• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.48-51
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• 1995

We have developed the three dimensional mesh generator for three dimensional process simulation using the FEM(Finite Element Method). Tetrahedron element construct the presented three dimensional mesh, which is suitable for the simulation of three dimensional behavior of the LOCOS. The simulation of thermal oxidation is one of the problem in scale downed semiconductor processes. As three dimensional simulators use the huge size of the memory, we use the efficient method that generates the new nodes inside the growing oxide and removes the nodes nearby the SiO2/Si interface in silicon. The resented three dimensional mesh generator was designed to be used in various process simulations, for instance thermal oxidation, silicidation, nitridation, ion implantation, diffusion, and so on.

• Korean Journal of Materials Research
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• v.18 no.12
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• pp.645-649
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• 2008

Graphite for the nuclear reactor is used to the moderator, reflector and supporter in which fuel rod inside of nuclear reactor. Recently, there are many researches has been performed on the various characteristics of nuclear graphite, however most of them are restricted to the structural and the mechanical properties. Therefore we focused on the thermal property of nuclear graphite. This study investigated the thermal emissivity following the oxidation degree of nuclear graphite with IG-11 used as a sample. IG-11 was oxidized to 6% and 11% in air at 5 l/min at $600^{\circ}C$. The porosity and thermal emissivity of the sample were measured using a mercury porosimeter and by an IR method, respectively. The thermal emissivity of an oxidized sample was measured at $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$ and $500^{\circ}C$. The porosity of the oxidized samples was found to increase as the oxidation degree increased. The thermal emissivity increased as the oxidation degree increased, and the thermal emissivity decreased as the measured temperature increased. It was confirmed that the thermal emissivity of oxidized IG-11 is correlated with the porosity of the sample.

• Journal of the Korean Institute of Telematics and Electronics
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• v.25 no.11
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• pp.1329-1334
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• 1988

A new method was developed for growing oxidation film by thermal reaction of $NH_3$ and $O_2$. The growth rate increased with the increase of partial pressure of $NH_3$. Optical transparency of the growth film was 12% at the wave number 1100 $cm^{-1}$ compared with 17% by thermal dry oxidation method, and the quality was much better. In C-V characteristic curve, $Q_{OX}$ was almost equal to $Q_{SS}$ and no hysteresis phenomena was observed. n-MOS transistors fabricated with this new method showed $I_D$-$V_{DS}$ characteristics better than thermal dry oxidation method.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.1-6
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• 2013

A simple thermal oxidation of Cu thin films deposited on planar substrates established a growth of vertically aligned copper oxide (CuO) nanorods. DC sputter-deposited Cu thin films with various thicknesses were oxidized in environments of various oxygen partial pressures to control the kinetics of oxidation. This is a method to synthesize vertically aligned CuO nanorods in a relatively shorter time and at a lower cost than those of other methods such as the popular hydrothermal synthesis. Also, this is a method that does not require a catalyst to synthesize CuO nanorods. The grown CuO nanorods had diameters of ~100 nm and lengths of $1{\sim}25{\mu}m$. We examined the morphology of the synthesized CuO nanorods as a function of the thickness of the Cu films, the gas environment, the oxidation time, the oxidation temperature, the oxygen gas flow rate, etc. The parameters all influence the kinetics of the oxidation, and consequently, the volume expansion in the films. Patterned growth was also carried out to confirm the hypothesis of the CuO nanorod protrusion and growth mechanism. It was found that the compressive stress built up in the Cu film while oxygen molecules incorporated into the film drove CuO nanorods out of the film.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.2
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• pp.38-45
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• 1997

In this paper, the three-dimensional stress effect of thermal oxide is simulated. We developed a three-dimensional finite element numerical simulator including three-dimensional adaptive mesh generator that is able to refine and eliminate nearby moving boundary of oxide, and oxidation solver with stress model. To investigate the behavior of thermal oxidation the simulations of thermal oxidation for island and hole structures are carried out assuming silicon wafer of <100> direction, temperature of $1000^{\circ}C$, oxidation time of 60min, wet ambient, initial oxide thickness of $300\AA$, and nitride thickness of $2, 000\AA$. The main effect of deformation at the corner area of oxide is due to distribution of oxidant, but the deformation of oxide is affected by the stressin theoxide. In the island structure which is the structure mostly covered with nitride and a coner is opended to oxidation, oxidation is reduced at the coner by compressive stress. In the hole structure which is the structure mostly opedned to oxide and a coner is convered with nitride, however, oxidation is increased at the coner by tensile stress.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.28A no.12
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• pp.59-64
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• 1991

Thin (25-103$\AA$) SiO$_2$ films are grown using the rapid thermal oxidation processing at temperatures of 105$0^{\circ}C$-115$0^{\circ}C$ for 5-30 sec, in order to investigate the characteristics of ultra thin oxide. For measuring the thickness of oxide TEM, ellipsometry, and C-V method which is taken in the condition of small surface band bending are used and compared. When neglecting the small deviation affected by both interface state and moisture charge effect, those three methods described above give similar results. In order to examine the effect of rapid thermal annealing, part of samples are annealed in N$_2$ ambient. MOS capacitors are fabricated and the characteristics of I-V and C-V are measured. Measurements show that the activation energy of initial thickness of oxide grown during the ramp-up time is of 1.125eV and the activation energy of the oxidation rate is of 0.98eV. As oxidation temperature is increased, dielectric breakdown field E$_{BD}$ is decreased due to the increase of fixed charge density N$_f$ However, E$_{BD}$ is shown to be decreased as increasing the thickness of oxide. The increase of N$_f$ in the early stage of thermal annealing results in the decrease of E$_{BD}$.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.3
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• pp.57-62
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• 2014

In this work, molybdenum oxide films were fabricated by heat-treatment method. Fundamental surface characteristics of molybdenum oxide films were investigated using XRD and Raman spectroscopy. From the results, the optimum MoOx films could be obtained under the conditions of thermal treatment temperature of $550^{\circ}C$, oxidation time of 30 minutes and oxygen flow rate of 250sccm. The thermal treatment method offers a simple and effective route for the synthesis of uniform $MoO_3$ films.

• Proceedings of the KIEE Conference
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• 1988.07a
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• pp.360-362
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• 1988

The new oxidation method was presented to grow the oxide layer by thermal reaction of $NH_{3}$ and $O_{2}$. The growth rate increased according as increase of partial pressure of $NH_{3}$. Optical transparent of the grown film was 12% compared with 17% of thermal oxidation when the wave number was $1,100cm^{-1}$. The oxide layer with good quaility was obtained.

• Journal of the Korean Solar Energy Society
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• v.35 no.4
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• pp.9-15
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• 2015

Black cobalt solar selective coatings were prepared by using an electroplating method. The changes in the optical properties of the black cobalt selective coating due to thermal degradation were analyzed by using the Auger electron spectroscopy (AES) and spectrophotometer. The black cobalt selective coating was prepared on a copper substrate by using a synthesized electrolyte with $CoCl_2$ and KSCN at a current density of ${\sim}0.5A/dm^2$ for 45s ~ 60s. Its optical properties were a solar absorptance (${\alpha}$) of the order of 0.80 ~ 0.84 and a thermal emittance (${\epsilon}$) of 0.01. From the AES depth profile analysis of heated sample, thermal degradation of the black cobalt selective coating heated for 33 hours at temperature of $350^{\circ}C$ occurred primarily due to interdiffusion at interface of cobalt and copper substrate. This results were predictable that the ${\alpha}$ decreases due to the thermal oxidation and diffusion.

• Proceedings of the Materials Research Society of Korea Conference
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• 1992.05b
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• pp.57-58
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• 1992

The NH$_3$oxidation, which forms thermal oxide layer on silicon substrate with pure $O_2$gas added with small amounts of NH$_3$gas, has good interface sates due to activated gettering effect during oxidation. The superiority of interfae state in NH$_3$ oxidation method is not affected by preprocess but by gettering during oxidation. The dramatec reduction fo interface state is conformed with observing OSF when NH$_3$ oxide is annealed in NH$_3$ atmosphere.