• 터널과지하공간
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• 제24권3호
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• pp.224-233
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• 2014

지하 하중 조건에서 암석물성이 변한다는 것은 잘 알려져 있다. 따라서 침수상태에 놓인 폐광산이나 폐공동에서의 하중에 따른 암석 물성변화와 일반적인 건조상태의 하중에 따른 물성 변화와의 관계에 대하여는 연구가 필요하다. 침수-하중 조건에서의 암석 물성 변화를 파악하기 위해 다양한 실험실 실험이 실시되었다. 암석에 가해지는 하중은 단축압축강도의 20~80%로 조절하였다. 침수 및 건조 조건에서 동일한 하중을 가할 경우 발생하는 암석의 열적, 역학적, 물리적 물성 변화를 비교함으로써 건조조건에 비해 침수조건에서의 물성변화가 더 크게 일어남을 알 수 있었다.

• 한국전산구조공학회:학술대회논문집
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• 한국전산구조공학회 2006년도 정기 학술대회 논문집
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• pp.820-827
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• 2006

The convection heat transfer coefficients on the top surface of a large liquid petroleum liquid injection(LPLi) engine piston are analyzed by solving an inverse thermal conduction problem. The heat transfer coefficients are numerically found so that the difference between analyzed temperatures from the finite element method and measured temperatures is minimized. Using the resulting heat transfer coefficients as the boundary condition, temperature of a large LPLi engine piston is analyzed.

• Journal of Welding and Joining
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• 제21권3호
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• pp.68-77
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• 2003

It is important to understand the characteristics of material strength and fracture under the dynamic loading like as earthquakes to assure the integrity of welded structures. The characteristics of dynamic strength and fracture in structural steels and their welded joints should be evaluated based on the effects of the strain rate and the service temperature. It is difficult to predict or measure temperature rise history with the corresponding stress-strain behavior. In particular, material behaviors beyond the uniform elongation can not be precisely evaluated, though the behavior at large strain region after the maximum loading point is much important for the evaluation of fracture. In this paper, the coupling phenomena of temperature and stress-strain fields under the dynamic loading was simulated by using the finite element method. The modified rate-temperature parameter was defined by accounting for the effect of temperature rise under the dynamic deformation, and it was applied to the fully-coupled analysis between heat conduction and thermal elastic-plastic behavior. Temperature rise and stress-strain behavior including complicated phenomena were studies after the maximum loading point in structural steels and their undermatched joints and compared with the measured values.

• 한국안전학회지
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• 제18권4호
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• pp.39-43
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• 2003

An experimental study was conducted to develop and understanding of fracture behavior of ceramic thermal barrier coating when subjected to a thermal shock loading. The thermal loading was applied using a 1.5kW $CO_2$ laser. In the experiments, beam-shaped specimens were subjected to a high heat flux for 4sec and cooling of 7sec in air. The interface crack length was increased as the crack density, the surface pre-crack legth and the coating thickness were increased. The center surface crack length was increased as the maximum surface temperature got higher and the surface pre-crack length for shorter.

• Structural Engineering and Mechanics
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• 제87권1호
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• pp.29-46
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• 2023

Critical thermal buckling of functionally graded porous (FGP) sandwich plates under various types of thermal loading is considered. It is assumed that the mechanical and thermal nonhomogeneous properties of FGP sandwich plate vary smoothly by distribution of power law across the thickness of sandwich plate. In this paper, porosity defects are modeled as stiffness reduction criteria and included in the rule of mixture. The thermal environments are considered as uniform, linear and nonlinear temperature rises. The critical buckling temperature response of FGM sandwich plates has been analyzed under various boundary conditions. By comparing several numerical examples with the reference solutions, the results indicate that the present analysis has good accuracy and rapid convergence. Further, the effects of various parameters like distribution shape of porosity, sandwich combinations, aspect ratio, thickness ratio, boundary conditions on critical buckling temperature of FGP sandwich plate have been studied in this paper.

• 한국응용과학기술학회지
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• 제24권4호
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• pp.416-426
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• 2007

Polypropylene (PP) composites with wood flour/wax/coupling agent were manufactured by melt compounding and injection molding. The influence of wood flour(WF), wax, and coupling agent on the mechanical and thermal properties of the composites was investigated. The addition of wood flour to neat PP has the higher tensile modulus and strength compared with neat PP. The presence of wax also improved the tensile modulus. At the same loading of PP and WF, the addition of coupling agent highly decreased the tensile modulus, and increased the tensile strength. From thermogravimetric analysis (TGA), the addition of wax improved the thermal stability of the composites in the later stages of degradation. The presence of MAPP and wood flour in turn decreased thermal stabilities of composites. From differential scanning calorimetry analysis (DSC), neither the loading of wax. nor the presence of MAPP has shown significant effect on the thermal transition of composites.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• 에너지공학
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• 제28권3호
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• pp.1-9
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• 2019

화력발전소에서 사용되는 급수 가열기 튜브에서는 사용중에 두께 감육이 발생하여 수명이 소진된다. 감육에 의한 파열 우려가 있으면 수명이 종료되는데, 파열조건을 결정하는 튜브 벽의 응력은 내압에 의한 원주방향 응력의 영향이 가장 큰 것으로 알려져 있지만, 튜브 내외부 온도차이에 의한 열응력에 대한 고려 또한 필요하다. 튜브 두께 방향의 온도차이는 열응력을 발생시켜 튜브의 잔여수명을 단축시키는 영향을 준다. 본 논문에서는 급수가열기 내에서 튜브 내표면과 외표면에 온도 차이가 가장 큰 과열저감구역(de-superheating zone)을 대상으로 열응력을 연구하였다. 원주방향으로 균일하게 감육된 튜브에서 두께방향의 온도차 때문에 발생하는 원주방향 응력, 반경방향 응력 및 온도분포를 평가하기 위한 해석적 수식을 제시하였다. 제시된 해석식의 정확도와 효과를 검증하기 위해 식으로부터의 계산된 결과를 유한요소해석으로 평가한 정확한 결과와 비교하였다. 또한, 유한요소해석으로 편심 감육된 튜브에 대한 응력도 평가하였다. 열응력 해석 및 온도 분포 해석에서 대류열전달 계수의 영향을 분석하기 위해 튜브 내표면 및 외표면에 여러 값의 열대류 계수를 적용하여 해석 결과를 비교하였다. 해석 결과 튜브 내표면보다 외표면의 열대류 계수가 응력 발생에 더 큰 영향을 주는 것으로 나타났다. 열하중만 고려된 경우, 균일 감육과 편심 감육 상태 모두에서 원주방향 응력이 반경방향 응력보다 크게 평가되었다.

• 전자공학회논문지A
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• 제31A권12호
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• pp.44-55
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• 1994

This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint.

• 마이크로전자및패키징학회지
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• 제5권2호
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.