• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.39-43
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• 2003

Thermal management is very important for the success of high density circuit design in LTCC. In this paper, LTCC substrates containing thermal via and pad were fabricated in order to study the influence of the thermal dissipation. To realize the accurate thermal analysis for structure design, a series of simple thermal conductivity measurement by laser flash method and parametric numerical analysis have been carried out. The LTCC substrate including via and Ag pad has good thermal conductivity over 103 W/mK which is 44% value of pure Ag material. Thermal behaviors with via arrays, size and density in the LTCC substrate were studied by numerical method.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.103-108
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• 2000

Since the ceramic/metal joint material is made at a high temperature, the residual stress development when it is cooled from bonding temperature to room temperature due to remarkable difference of thermal expansion coefficient between ceramic and metal. As residual stress at ceramic/metal joints influences the strength of joints, it is important to estimate residual stress quantitatively. In this study, it is attempted to estimate joint residual stress of $Si_3N_4/STS304$ joints quantitatively and to compare the strength of Joints. The difference of residual stress is measured when repeated thermal cycle is loaded under the conditions of the practical use of the ceramic/metal joint. And 4-point bending test is performed to examine the influence of residual stress on fracture strength. As a residual it is known that the stress of joint decreases as the number of thermal cycle increases.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2039-2042
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• 2008

Recently, Electronic & Electrical Products have problems how to reduce heat in trend reducing size and increasing speed. heat pipes worked by latent heats can solve problems for effective and quiet electronic applications. Heat Pipes have to be suitably designed for the external conditions due to showing optimum performance. it has influence on efficiency of heat pipes to the exterior structure changed by length, bending angle, diameter. Designing heat pipes has depended on experience from trial and error. this method wasted too many resources, but can't guarantee efficiency. to prevent those wastes, this study aims at making the thermal transfer coefficient predicting efficiency. In this study, the thermal transfer coefficient has been made from experimental results that used variables - lengths between heat source and radiation, bending angles, diameters of heat pipes. variables become non-dimensional in modeling process for making the coefficient.

• Journal of Mechanical Science and Technology
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• v.18 no.10
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• pp.1712-1721
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• 2004

A method of measuring the thermal diffusivity of semi-infinite solid material at room temperature using photothermal displacement is proposed. In previous works, within the constant thickness of material, the thermal diffusivity was determined by the magnitude and phase of deformation gradient as the relative position between the pump and probe beams. In this study, however, a complete theoretical treatment of the photothermal displacement technique has been performed for thermal diffusivity measurement in semi-infinite solid materials. The influence of parameters, such as, radius and modulation frequency of the pump beam and the thermal diffusivity, was studied. We propose a simple analysis method based on the zero -crossing position of real part of deformation gradient and the minimum position of phase as the relative position between two beams. It is independent of parameters such as power of pump beam, absorption coefficient, reflectivity, Poisson's ratio, and thermal expansion coefficient.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.4
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• pp.355-363
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• 2005

A novel method for simultaneously measuring the fluid velocity and the large particle velocity in a particle-containing fluid flow is developed in this study. In this method, the fluid velocity and the large particle velocity are measured by PIV and PTV, respectively. The PIV and PTV images are obtained from the same flow images. Since a PIV result represents the average displacement of all particles in an interrogation area, it will include an error caused by the relative displacement between the large particles and the fluid. In order to reduce the false influence of large particles on the PIV calculation, the mean brightness of small PIV particle images is substituted to the locations of large particles in the PIV images. The simulation results showed that the new method significantly reduces the PIV error caused by the large particles even at the case where the large particles occupy area fraction as large as $20\%$ of the full image.

• Journal of the Korean Solar Energy Society
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• v.28 no.4
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• pp.68-75
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• 2008

The purpose of this research is revise the value yield to compensate of measure the difference between computer simulation and the measurement value on the two methods which can calculates thermal performance. The way is need to understand about thermal performance, air tightness, simulations and comparisons of analysis to influence the value of each identified. The opening type of the windows and doors to be used at the analysis are T/T, L/S and SL Different condition of the windows and doors excluded except the opening type. Each of the four samples was selected by the way of opening. Result of the analysis of the difference between measurement and simulation are that T/T approach 5.3%, L/S approach 15.7%, SL approach 21% and the more air-tightness guarantees less difference of the numerical value. Each compensation value calculates by the correlation regression analysis and the air-tightness data. After the compensation of the resulting difference in T/T, L/S, SL indicate 5.4%, 2.5%, 1.0% respectively.

• 한국연소학회:학술대회논문집
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• 2002.06a
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• pp.185-191
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• 2002

The influence of N2 addition on soot formation, flame temperature and NOx emissions is investigated experimentally with methane fuel co-flow diffusion flames. The motivation of the present investigation is the differences in NOx reduction reported between fuel-side and oxidizer-side introduction of N2. To determine the influence of dilution alone, fuel was diluted with nitrogen while keeping the adiabatic flame temperature fixed by changing the temperature of the reactants. And to see the thermal effect only, air was supplied at different temperature without N2 addition. N2 addition into fuel side suppressed the soot formation than the case of oxidizer-side, while flame temperature enhanced the soot formation almost linearly. These results reveals the relative influences of the thermal, concentration effects of N2 additives on soot formation In accordance with experimental study, numerical simulation using CHEMKIN code was carried out to compare the temperature results with those acquired by CARS measurement, and we could find that there is good agreement between those results. Emission test revealed that NOx emissions were affected by not only flame temperature but also N2 addition.

• Korean Journal of Optics and Photonics
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• v.7 no.2
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• pp.174-180
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• 1996

For the investigation of the influence of microstructure of optical thin films on the in-plane thermal diffusivity of glass substrate coated by that films, we constructed the AC calorimeter which uses argon-ion laser as a thermal source and measured several kinds of ZnS optical thin films which prepared by the changing of thermal evaporation speed such as 5$\AA$/s, 10$\AA$/s, 20$\AA$/s, 40$\AA$/s, 60$\AA$/s. The result showed that the thermal diffusivity decreases as the temperature increases. Also, when the evaporation speed is 20$\AA$/s, the thermal diffusivity has maximum value, and the variation of the thermal diffusivities are 27% at maximum.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.304.2-304.2
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• 2014

Chalcogenides (Te,Se) and pnictogens(Bi,Sb) materials have been widely investigated as thermoelectric materials. Especially, Bi2Te3 (Bismuth telluride) compound thermoelectric materials in thin film and nanowires are known to have the highest thermoelectric figure of merit ZT at room temperature. Currently, the thermoelectric material research is mostly driven in two directions: (1) enhancing the Seebeck coefficient, electrical conductivity using quantum confinement effects and (2) decreasing thermal conductivity using phonon scattering effect. Herein we demonstrated influence of annealing temperature on structural and thermoelectrical properties of Bismuth-telluride-selenide ternary compound thin film. Te-rich Bismuth-telluride-selenide ternary compound thin film prepared co-deposited by thermal evaporation techniques. After annealing treatment, co-deposited thin film was transformed amorphous phase to Bi2Te3-Bi2Te2Se1 polycrystalline thin film. In the experiment, to investigate the structural and thermoelectric characteristics of Bi2Te3-i2Te2Se1 films, we measured Rutherford Backscattering spectrometry (RBS), X-ray diffraction (XRD), Raman spectroscopy, Scanning eletron microscopy (SEM), Transmission electron microscopy (TEM), Seebeck coefficient measurement and Hall measurement. After annealing treatment, electrical conductivity and Seebeck coefficient was increased by defect states dominated by selenium vacant sites. These charged selenium vacancies behave as electron donors, resulting in carrier concentration was increased. Moreover, Thermal conductivity was significantly decreased because phonon scattering was enhanced through the grain boundary in Bi2Te3-Bi2Te2Se1 polycrystalline compound. As a result, The enhancement of thermoelectric figure-of-merit could be obtained by optimal annealing treatment.