• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 추계학술대회 초록집
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• pp.62.2-62.2
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• 2011

To guarantee 20-25 years to the lifetime of the PV modules without failure, reliability test of the module is very important. Field-aged test of the outdoor environment is required. However, due to time constraints, accelerated testing is required to predict the lifetime of PV modules and find causes of failure. Failure is caused by many complex phenomena. In this study, we experimented two accelerated tests about corrosion and fatigue, respectively. First, temperature cycling test for fatigue were tested and Coffin-Manson equation was analyzed. Second, damp heat test for corrosion were tested and Eyring equation were analyzed. Finally, using two-mode failure model, we suggest a new lifetime model that analyze the phenomenon by combining two kinds of data.

• Journal of Welding and Joining
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• 제30권2호
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• pp.65-69
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• 2012

Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000Hz frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound ($Cu_6Sn_5$) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.

• 대한기계학회논문집A
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• 제38권8호
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• pp.831-836
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• 2014

본 연구에서는 한국원자력연구원 내에 설치될 예정인 소듐시험 시설인 SELFA(Sodium Thermal-hydraulic Experiment Loop for Finned-tube Sodium-to-Air heat exchanger) 내에서 정상상태 가동온도가 $510^{\circ}C$의 고온 압력용기인 팽창탱크에 대해 고온 건전성 평가를 수행하였다. 팽창탱크에 대해 3 차원 유한요소해석에 기초하여 고온설계 기술기준인 ASME Section III Subsection NH 와 프랑스의 RCC-MRx 코드를 따라 크리프-피로 손상평가를 수행하였다. 평가결과 팽창탱크는 크리프-피로 설계 과도 하중 하에서 구조적 건전성을 유지하는 것으로 나타났다. 316L 스테인리스강 재질의 동 압력용기에 대해 정량적 코드 비교 분석을 수행하였다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2004년도 추계학술발표대회 논문집
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• pp.286-289
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• 2004

This paper presents the fatigue characteristics of LIPCA (LIghtweight Piezo-Composite Actuator) device system. The LIPCA device system is composed of a piezoelectric ceramic layer and fiber reinforced lightweight composite layers. Typically a PZT ceramic layer is sandwiched by a top fiber layer with low CTE (coefficient of thermal expansion) and base layers with high CTE. The advantages of the LIPCA design are weight reduction by using the lightweight fiber reinforced plastic layers without compromising the generation of high force and large displacement and design flexibility by selecting the fiber direction and the size of prepreg layers. To predict the degradation of actuation performance of LIPCA due to fatigue, the cyclic electric loading tests using PZT specimens were performed and the strain for a given excitation voltage was measured during the test. The results from the PZT fatigue test were implemented into CLPT (Classical Laminated Plate Theory) model to predict the degradation of LIPCA's actuation displacement. The fatigue characteristic of PZT was measured using a test system composed of a supporting jig, a high voltage power supplier, data acquisition board, PC, and evaluated.

• 대한조선학회논문집
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• 제41권6호
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• pp.84-90
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• 2004

For the precise assessment of the effect of welding residual stresses on structural strength and fatigue crack growth behavior, new FE analysis algorithms for the estimation of residual stress relaxation due to external load and redistribution due to fatigue crack propagation were proposed in this paper. Initial welding residual stress field was obtained by thermal elasto-plastic analysis considering temperature dependent material properties, and the amount of residual stress relaxation and redistribution were assessed by subsequent elasto-plastic analysis In the analysis of fatigue crack propagation, the applied SIF(Stress Intensity Factor) range was evaluated by $\frac{1}{4}$-point displacement extrapolation method, and the effect of welding residual stresses on crack propagation was considered by introducing the effective SIF concept. The test results of crack propagations were compared with the predicted data obtained by the analysis.

• Tribology and Lubricants
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• 제21권2호
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• pp.63-70
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• 2005

This study presents the thermal cracking on a commercial vehicle ventilated brake disk. Distributions of temperature and thermal stress of the disk were analysed, using FEM analysis, under the several driving conditions with actual vehicle specifications. The results from the fatigue tests on the disk material were compared with those from FEM analysis. In case of deceleration of 0.6 g with initial vehicle speed of 97, 140, and 160 km/h, the maximum compressive stress at the disk surface of disk due to braking was 224, 318, and 362 MPa, respectively. It was estimated that each damage fraction of 0.00005, 0.00050, 0.00136 per full stop was imposed on the brake disk in case of deceleration of 0.6 g with initial vehicle speed of 97, 140, and 160 km/h, respectively.

• 한국지반공학회논문집
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• 제20권1호
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• pp.13-19
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• 2004

국내 아스팔트 포장의 주요파손은 피로균열, 반사균열, 온도균열, 소성변형 등이 발생하고 있다. 이러한 아스팔트포장의 파손을 최소화하기 위해 기존의 아스팔트 포장 층에 포장섬유를 포설, 보강하는 기법이 적용될 수도 있다. 본 연구에서는 포장섬유 아스팔트 포장 시스템을 체계적으로 정립하기 위해 유리섬유 시트로 보강한 아스팔트 포장층을 대상으로 실내시험을 실시하였다. 실내시험은 포장섬유 보강 아스팔트 포장의 균열저항성과 소성변형을 평가하기 위해 휠트래킹 시험과 균열저항성 시험을 수행하여 포장섬유 아스팔트 포장의 소성변형 및 균열 저항성을 분석하였다.

• 대한기계학회논문집A
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• 제24권7호
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• pp.1771-1778
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• 2000

The purpose of this study is to investigate the thermal embrittlement and the mechanical properties of 2.25Cr-1Mo steel aged at high temperature for the extended periods. Original, aged artificiall y and used material were tested to obtain the tensile strength, hardness and impact absorbed energy. Tensile strength, hardness and impact absorbed energy decreased with the increasing aging time. The carbide morphology with the thermal embrittlement was found to contribute to the mechanical property change by X-Ray diffraction method.

• 대한기계학회논문집A
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• 제24권8호
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• pp.1910-1916
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• 2000

The five classes of the thermally aged CF8M specimen are prepared using an artificially accelerated aging method. Namely, after the specimens are held for 100, 300, 900, 1800, and 3600hrs at 430$^{\circ}C$ respectively, the specimens are water-cooled to room temperature. The impact energy variations are measures for both the aged and virgin specimens through the Charpy impact tests in addition to the microstructure observation, tensile, hardness and fatigue crack growth tests. From the present investigation the following results are obtained : 1) The difference among the thermally degraded specimens can be distinguished through their microstructures, 2) Hardness and tensile strength are increased to 300hrs, degradation specimen, while elongation and reduction area are decreased to 3600hrs degradation specimen, and impact energy is decreased to 1800hrs degradation specimen, 3) The FCG rates for thermally degraded specimens are larger than that of the virgin specimen.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.134-139
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• 2007

This paper presents a computer-based analysis on the thermal shock characteristics of Pb-free solder joints and UBM in flip chip assemblies. Among four types of popular UBM systems, TiW/Cu system with 95.5Sn-3.9Ag-0.6Cu solder joints was chosen for simulation. A simple 3D finite element model was first created only including silicon die, mixture between underfill and solder joints, and substrate. The displacements due to CTE mismatch between silicon die and substrate was then obtained through FE analysis. Finally, the obtained displacements were applied as mechanical loads to the whole 2D FE model and the characteristics of flip chip assemblies were analyzed. In addition, based on the hyperbolic sine law, the accumulated creep strain of Pb-free solder joints was calculated to predict the fatigue life of flip chip assemblies under thermal shock environments. The proposed method for fatigue life prediction will be evaluated through the cross check of the test results in the future work.