• Korean Journal of Metals and Materials
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• v.46 no.6
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• pp.363-369
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• 2008

Effects of top coat morphology and thickness on thermal fatigue behavior of thermal barrier coatings (TBC) were investigated in this study. Thermal fatigue tests were conducted on three coating specimens with different top coat morphology and thickness, and then the test data were compared via microstructures, cycles to failure, and fracture surfaces. In the air plasma spray specimens (APS1, APS2), top coat were 200 and $300{\mu}m$ respectively. The thickness of top coat was about $700{\mu}m$ in the perpendicular cracked specimen (PCS). Under thermal fatigue condition at $1,100^{\circ}C$, the cycles to top coat failure of APS1, APS2, and PCS were 350, 560 and 480 cycles, respectively. The cracks were initiated at the interface of top coat and thermally grown oxide (TGO) and propagated into TGO or top coat as the number of thermal fatigue cycles increased. For the PCS specimen, additive cracks were initiated and propagated at the starting points of perpendicular cracks in the top coat. Also, the thickness of TGO and the decrease of aluminium concentration in bond coat do not affect the cycles to failure.

• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.1
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• pp.139-145
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• 2007

This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermomechanical cyclic loadings. The analysis includes the FE model of the exhaust system, temperature dependent material properties, and thermal loadings. The result shows that at an elevated temperature, large compressive plastic deformations are generated, and at a cold condition, tensile stresses are remained in several critical zones of the exhaust manifold. From the repetitions of thermal shock cycles, plastic strain ranges could be estimated by the stabilized stress-strain hysteresis loops. The method was applied to assess the low cycle thermal fatigue for the engine exhaust manifold. It shows a good agreement between numerical and experimental results.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.4 no.2
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• pp.40-45
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• 2008

There exist many types of pipe and component fatigue through vibrations, thermal fatigues or shifting. In some cases of thermal stratification/thermal fatigue, pipes & components are receiving thermal stress by means of material expansion and shrinkage by continuous thermal repetitive variation. Small cracks initially occur on the inside surface by thermal stress. These cracks grow in depth the pipe wall and finally come to a rupture. Pipe parts of susceptibility to thermal stratification and thermal fatigue are now being examined by conventional UT(ultrasonic test) as volumetric examination. It is difficult to fully satisfy the code & standards requirements because 3" weldolet weldments of RCS 16" pipe to 3" branch connection lines have complex structural shape. To solve the problems of conventional UT examination, we made a realistic mock-up and UT calibration block. We performed a simulation of phased array UT utilizing CIVA as NDE(Non-Destructive Examination) simulation software. Also we designed phased array UT transducer and wedge, optimal frequency by using simulation data. We performed phased array UT experiment through mock-up including artificial flaws(notch). The phased array UT technique is finally developed to improve the reliability of ultrasonic test at RCS 16" pipe to 3" branch connection weld.

• International Journal of Korean Welding Society
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• v.4 no.1
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• pp.61-66
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• 2004

In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.4
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• pp.99-106
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• 2006

High velocity oxygen-fuel thermal spray coating of the WC-Co cermet material is a well-established process for modifying the surface properties of the structural components exposed to the corrosive and wear attacks, and also these coating are well-known method to improve the fatigue strength of material. In this study, HVOF coated SM490B are prepared to evaluation of the effect of coating on tension and fatigue crack growth behavior. The pre-crack of the fatigue crack growth test specimens machined at deposited material area, heat affected zone and boundary, respectively. Through these test, the following results are obtained: 1) Tensile strength was about 498 MPa, and fracture occurred on base metal area. 2) The fatigue crack of coated specimens propagated more rapidly than non-coated specimen in all specimens. 3) In the same coating thickness specimens, the specimens with pre-crack at boundary more rapidly propagated than the specimens with pre-crack at HAZ and deposited material area. These results can be used as basic data in a structural integrity evaluation of rolled SM490B weldments considering HVOF coating.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.45-50
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• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Journal of Mechanical Science and Technology
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• v.19 no.2
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• pp.496-504
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• 2005

The thermal and mechanical properties of an electro-slag cast steel of a similar chemical composition with an AISI-6F2 steel are investigated and compared with a forged AISI-6F2 steel. AISI-6F2 is a hot-working tool steel. Electro-slag casting (ESC) is a method of producing ingots in a water-cooled metal mold by the heat generated in an electrically conductive slag when current passes through a consumable electrode. The ESC method provides the possibility of producing material for the high quality hot-working tools and ingots directly into a desirable shape. In the present study, the thermal and mechanical properties of yield strength, tensile strength, hardness, impact toughness, wear resistance, thermal fatigue resistance, and thermal shock resistance for electro-slag cast and forged steel are experimentally measured for both annealed and quenched and tempered heat treatment conditions. It has been found that the electro-slag cast steel has comparable thermal and mechanical properties to the forged steel.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.160-165
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• 2004

At this research, we examined probability of light bulb's life span value and prediction on purpose to inquire out the span of repeat velocity as fracture probability by executing the fatigue test, which is considered property of Tungsten filament's thermal fatigue used as an automobile bulb. As a result we can confirm what the most suitable solution is weibull distribution and log normal distribution. Tungsten filament's span gets longer as the fatigue repeat velocity gets shorter And, repeat span is about 15%~40% shorter than sequence life span.

• Journal of Welding and Joining
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• v.21 no.4
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.1201-1202
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• 2010