• Title/Summary/Keyword: Thermal fatigue test

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A Fatigue Analysis of Thermal Shock Test in Brake Disc Material for Railway (철도차량 제동디스크 소재 열충격 실험에 대한 피로해석)

  • Lim, Choong-Hwan;Goo, Byeong-Choon
    • Proceedings of the KSR Conference
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    • 2010.06a
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    • pp.615-620
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    • 2010
  • During braking of railway vehicles the repetitive thermal shock leads to thermal cracks on disc surface, and the lifetime of brake disc is dependent on the number of trimming works for removing these thermal cracks. Many tries for development of high heat resistant brake disc to extend the disc life and to warrant reliable braking performance has been continued. In present study, we carry out the computational fatigue analysis for thermal fatigue test in three candidate materials which were made to develop new high heat resistant material. Using FEM, we simulate thermal fatigue test in three candidate materials and conventional disc material. We then estimate the number of cycle to thermal crack initiation based on data from mechanical fatigue tests, and the results are compared with each material. For each material, the correction factor for $N_{f-40}$ which is the number of cycles when crack over $40{\mu}m$ was observed in thermal fatigue test is decided. From this study, we can verify the performance of thermal fatigue test system and suggest a qualitatively comparative method for heat resistance by FEM analysis of thermal shocking phenomenon.

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Stress Analysis of $Si_3N_4$ Swirl Chamber during Thermal Fatigue Test (열피로시험중 질화규소 와류실에 발생하는 응력해석)

  • 김창삼;정덕수
    • Journal of the Korean Ceramic Society
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    • v.33 no.3
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    • pp.321-326
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    • 1996
  • Thermal fatigue test and stress analysis of Si3N4 and metal swirl chamber were carried out to investigate the reliability of the swirl chambers. Conditions of the thermal fatigue test were severer than those in real engine and FEM was used to analize the stress distribution in the swirl chambers. Fatigue cracks of the maximum length 2.4 mm and deformation were occurred at the corner of the jet in metal swirl chamber but not observed in Si3N4 swirl chamber. Maximum tensile stress in Si3N4 swirl chamber calculated by FEM was 300 MPa.

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Thermal-mechanical Fatigue Life Prediction of 12Cr Forged Steel Using Strain Range Partitioning method (변형률분할법에 의한 12Cr 단조강의 열피로 수명예측)

  • 하정수;옹장우;고승기
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.5
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    • pp.1192-1202
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    • 1994
  • Fatigue behavior and life prediction were presented for thermal-mechanical and isothermal low cycle fatigue of 12Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test at 350 to 600.deg. C and isothermal low cycle fatigue test at 600.deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. Cyclic softening behavior was observed regardless of thermal-mechanical and isothermal fatigue tests. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. The difference in fatigue lives was dependent upon the magnitudes of inelastic strain ranges and mean stresses. Increase in inelastic strain range showed a tendency of intergranular cracking and decrease in fatigue life, especially for out-of-phase thermal-mechanical fatigue. Thermal-mechanical fatigue life prediction was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase thermal-mechanical fatigue lives, which was quite improved conservatively by a proposed strain range partitioning method.

A STUDY ON THE THERMAL FATIGUE TEST AND ANALYSIS METHOD FOR THE DEVELOPMENT OF BRAKE DISK MATERIALS

  • Lim, Choong-Hwan;Goo, Byeong-Choon
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.127-131
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    • 2008
  • In the disk braking of the railway trains, kinetic energy of the vehicles is converted into thermal energy by friction between a brake disk and the pad materials. This can be cause of the iterative thermal shock and generates thermal cracks on the brake disk surface. In this study, we show the comparative thermal fatigue test procedures and thermal crack analysis process to evaluate the thermal fatigue characteristics of candidate materials designed for development of heat-resistant brake disk material. We carried out tests on the conventional brake disk materials used for Saemaul and Mugunghwa trains, then we comparatively analyzed the thermal crack initiation and propagation on the surface of a specimen. A thermal fatigue test procedure and a crack analysis process were suggested to evaluate the heat resistance of the developed materials at later studies.

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Solder Joints Fatigue Life of BGA Package with OSP and ENIG Surface Finish (OSP와 ENIG 표면처리에 따른 BGA 패키지의 무연솔더 접합부 피로수명)

  • Oh, Chulmin;Park, Nochang;Hong, Wonsik
    • Korean Journal of Metals and Materials
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    • v.46 no.2
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    • pp.80-87
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    • 2008
  • Many researches related to the reliability of Pb-free solder joints with PCB (printed circuit board) surface finish under thermal or vibration stresses are in progress, because the electronics is operating in hash environment. Therefore, it is necessary to assess Pb-free solder joints life with PCB surface finish under thermal and mechanical stresses. We have investigated 4-points bending fatigue lifetime of Pb-free solder joints with OSP (organic solderability preservative) and ENIG (electroless nickel and immersion gold) surface finish. To predict the bending fatigue life of Sn-3.0Ag-0.5Cu solder joints, we use the test coupons mounted 192 BGA (ball grid array) package to be added the thermal stress by conducting thermal shock test, 500, 1,000, 1,500 and 2,000 cycles, respectively. An 4-point bending test is performed in force controlling mode. It is considered that as a failure when the resistance of daisy-chain circuit of test coupons reaches more than $1,000{\Omega}$. Finally, we obtained the solder joints fatigue life with OSP and ENIG surface finish using by Weibull probability distribution.

Thermal-Mechanical and Low Cycle Fatigue Characteristics of 12Cr Heat Resisting Steel with Hold Time Effects (유지시간 효과를 고려한 12Cr 내열강의 열피로 및 저주기 피로 특성)

  • Ha, J.S.;Koh, S.K.;Ong, J.W.
    • Transactions of the Korean Society of Automotive Engineers
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    • v.3 no.1
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    • pp.1-12
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    • 1995
  • Isothermal and thermal-mechanical fatigue characteristics of 12Cr heat resisting steel used for high temperature applications were investigated including hold time effects. Isothermal low cycle fatigue test at $600^{\circ}C$ and in-phase, out-of-phase thermal-mechanical fatigue test at 350 to $600^{\circ}C$ were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. Regardless of thermal-mechanical and isothermal fatigue tests, cyclic softening behavior was observed and much more pronounced in the thermal-mechanical fatigue tests with hold times due to the stress relaxation during the hold time. The phase difference between temperature and strain in thermal-mechanical fatigue tests resulted in significantly shorter fatigue life for out-of-phase compared to in-phase. The differences in fatigue lives were dependent upon the magnitudes of plastic strain ranges and mean stresses. During the hold time in the strain-controlled fatigue tests, the increase in the plastic strain range and the stress relaxation were observed. It appeared that the increase in plastic strain range per cycle and the introduction of creep damage made important contributions to the reduction of thermal-mechanical fatigue life with hold time, and the life reduction tendency was more remarkable in the in-phase than in the out-of-phase thermal-mechanical fatigue. Isothermal fatigue tests performed under the combination of fast and slow strain rates at $600^{\circ}C$ showed that the fatigue life decreased as the strain rate and frequency decreased,especially for the low strain ranges.

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A study on the thermal-mechanical fatigue life prediction of 12 Cr steel (12 Cr 강의 열피로 수명단축에 관한 연구)

  • Ha, Jeong-Soo;Kim, Kun-Young;Ahn, Hye-Thon
    • Journal of the Korean Society for Precision Engineering
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    • v.11 no.4
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    • pp.114-125
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    • 1994
  • Fatigue behavior and life prediction method were presented for themal-mechanical and isothermal low cycle fatigue of 12 Cr forged steel used for high temperature applications. In-phase and out-of-phase thermal-mechanical fatigue test from 350 .deg. C to 600 .deg. C and isothermal low cycle fatigue test at 600 .deg. C, 475 .deg. C, 350 .deg. C were conducted using smooth cylindrical hollow specimen under strain-control with total strain ranges from 0.006 to 0.015. The phase difference between temperature and strain in thermal-mechanical fatigue resulted in significantly shorter fatigue life for out-of-phase than for in-phase. Thermal-mechanical fatigue life predication was made by partitioning the strain ranges of the hysteresis loops and the results of isothermal low cycle fatigue tests which were performed under the combination of slow and fast strain rates. Predicted fatigue lives for out-of-phase using the strain range partitioning method showed an excellent agreement with the actual out-of-phase thermal-mechanical fatigue lives within a factor of 1.5. Conventional strain range partitioning method exhibited a poor accuracy in the prediction of in-phase range partitioning method in a conservative way. By the way life prediction of thermal-mechanical fatigue by Taira's equivalent temperature method and spanning fartor method showed good agreement within out-of-phase thermal-mechanical fatigue.

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Metal/ceramic Interface Mechanical Property Analysis (금속/세라믹 계면 물성 분석)

  • Kim, Song-Hee;Kang, Hyung-Suk
    • Journal of Industrial Technology
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    • v.24 no.A
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    • pp.9-15
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    • 2004
  • The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

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Thermal Cycling Fatigue Analysis of Flip-Chip BGA Solder Joints (플립 칩 BGA 솔더접합부의 열사이클링 피로해석)

  • 김경섭;유정희;김남훈;장의구;임희철
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2002.11a
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    • pp.27-32
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    • 2002
  • In this paper, global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. It was estimated by the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life of results was obtained at the thermal cycling testing condition of -65℃ ∼ 150℃. It was increased about 3.5 times in comparison with that of 0℃ ∼ 100℃. As the change of pad structure at the same other conditions, the fatigue life of SMD structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

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