• 한국세라믹학회지
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• 제35권10호
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• pp.1094-1100
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• 1998

The thermal fatigue behavior of alumina ceramics was investigated by water quenching method. Single-quench thermal shock tests were performed to decide the critical thermal shock temperature difference ($\Delta$Tc) which was found to be 225$^{\circ}C$ Cyclic thermal shock fatigue tests were performed at temperature diff-erences of 175$^{\circ}C$, 187$^{\circ}C$ and 200$^{\circ}C$ respectively. After cyclic thermal shock fatigue test the distributions of retained strength and crack were observed. Retained strength was measured by four point bending method and crack observation method bydye penetration. In terms of the retained strength distribution the critical number of thermal shock cycles(Nc) were 7 for $\Delta$T=200$^{\circ}C$, 35 for $\Delta$T=187$^{\circ}C$ and 180for $\Delta$T=175$^{\circ}C$ respec-tively. In terms of the crack observation the critical number of thermal shock cycles were 5 for $\Delta$T==200$^{\circ}C$ 20 for $\Delta$T==187$^{\circ}C$ and 150 for $\Delta$T=175$^{\circ}C$ respectively. The difference of Nc investigated by two different methods is due to the formation of the longitudinal cracks which had no effect on the four point bending strength. Therefore the thermal fatigue behavior of alumina ceramics could be more accurately described by the crack observation method than the retained strength measurement method.

• 소성∙가공
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• 제11권1호
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• pp.61-68
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• 2002

The thermal shock and thermal fatigue test has been carried out to analyze the thermal characteristics of tool steels for hot forging and the effects of mechanical properties on this study have been investigated. The resistance to thermal shock is first of all a matter of good toughness and ductility. Therefore, a proper hot-work tool steel should be characterized by high fracture strength and high temperature toughness. Based on these results, some critical temperature($T_{fracture}$) at which fracture occur can be measured to characterize the thermal resistance of the materials. During thermal fatigue tests, the thermal fatigue cracks occur because of the repetitive heating and cooling of the die surface and the thermal fatigue damage was evaluated by analyzing different number of cycles to failure. The results showed that the resistance to thermal shock and thermal fatigue were found to be favoured by high hot tensile strength and high hot hardness, and thermal resistance of SKD61 was superior to that of ESC, SKT4 and this was caused by higher mechanical properties of SKD61.

• Journal of Mechanical Science and Technology
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• 제20권1호
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• pp.59-65
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• 2006

A half-scaled large test model for the main components of the real annular structure was built and the thermal behaviors were experimented and obtained by thermal cyclic loads. The model design and the test conditions for the thermal loads were determined to take into consideration the thermal and mechanical loads acting on the real annular structure by finite element analyses. Temperature profiles and strains of the main components of the model were measured at an early stage of the test and periodically throughout the test in the given test conditions. After completion of the thermal cyclic tests, no evidence of crack initiation and propagation were identified by a dye penetration test. The measured strains at the critical parts were slightly increased proportionally with the increase in the number of the thermal cycles.

• 대한금속재료학회지
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• 제47권8호
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• pp.500-507
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• 2009

Pb-free solder has recently been used in electronics in efforts to meet environmental regulations, and a number of Pb-free solder alloy choices beyond the near-eutectic SnAgCu solder are now available. With increased demand for thin and portable electronics, the high cost of alloys containing significant amounts of silver and their poor mechanical shock performance have spurred the development of low Ag SnAgCu solder, which provides improved mechanical performance at a reasonable cost. Although low Ag SnAgCu solder exhibits significantly higher fracture resistance under high-strain rates, little thermal fatigue data exist for this solder. Therefore, it is necessary to investigate thermal fatigue reliability of low Ag SnAgCu solder under variation of thermal stress in order to allow its implementation in electronic products with high reliability requirements. In this study, the reliability of Sn0.3Ag0.7Cu(SAC0307), a low Ag solder alloy, is discussed and compared with that of Sn3Ag0.5Cu(SAC305). Three sample types and six samples size are evaluated. Mechanical properties and microstructure of the solder joint are investigated under thermal shock cycles. It was observed that the mechanical strength of SAC0307 dropped slightly with thermal cycling relative to that of SAC305. This reveals that the failure mode of SAC0307 is different from that SAC305 under this critical condition.