• Title/Summary/Keyword: Thermal evaporation process

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The Manufacturing Process and Characteristic Analysis of BKNO3 Metal-Explosive for PMD (PMD용 BKNO3 금속화약의 제조공정 및 특성분석)

  • Shim, Jungseob;Kim, Sangbaek;Ahn, Gilhwan;Kim, Junhyung;Ryu, Byungtae
    • Journal of the Korean Society of Propulsion Engineers
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    • v.22 no.3
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    • pp.90-96
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    • 2018
  • This study investigated the manufacturing process and characteristics of $BKNO_3$ (Boron Potassium Nitrate) as a pyrotechnic propellant that is commonly used in the aerospace, defense, and automobile industries. The solid mixture was composed of oxidizing agent, fuel, and binder. Evaporation process was used to uniformly mix the raw materials. The optimal ratio of composition was designed through the CEA program analysis of the material characteristics and thermal responses. Further the size, shape, sensitivity, and calorimetry characteristics were studied.

Application of femtosecond laser hole drilling with vibration for thin Invar alloy using fine metal mask in AMOLED manufacturing process (AMOLED 제조공정에 사용되는 Fine Metal Mask 용 얇은 Invar 합금의 진동자를 이용한 펨토초 레이저 응용 홀 드릴링)

  • Choi, Won-Suk;Kim, Hoon-Young;Shin, Young-Gwan;Choi, Jun-ha;Chang, Won-Seok;Kim, Jae-Gu;Cho, Sung-Hak;Choi, Doo-Sun
    • Design & Manufacturing
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    • v.14 no.3
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    • pp.44-49
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    • 2020
  • One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

Research on the Heat Exchanger for Kimchi Refrigerator Using Thermal Conductive Plastic (열전도성 플라스틱을 이용한 김치냉장고용 열교환기에 관한 연구)

  • Kang Tae-Ho;Baek Jong-Yong;Kwon Yong-Ha;Kim In-Kwan;Kim Young-Soo;Sin Dae-Sik;Park Jae-Hong
    • Journal of Advanced Marine Engineering and Technology
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    • v.29 no.4
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    • pp.407-416
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    • 2005
  • The kimchi refrigerator is the electric home appliance which is used for the maturing and preserving of the kimchi in domestic and foreign market. The kimchi refrigerator is composed in 3 main parts as insulation. kimchi container, machinery room. The heat exchanger of kimchi refrigerator is made of aluminum and the other parts are made of steel and polymer. Also, kimchi refrigerator is expensive and heavy as compared with same class of refrigerator until now. In the present study, the possibility to replace heat exchanger from aluminum to thermal conductive plastic was analyzed and experimented. The thermal conductive plastic has $10{\sim}100$ times heat conductivity than that of normal plastic. It is known that heat transfer process is dependent not only conduction but convection or radiation. Thermal conductivity of the applied material in this research is over than 2 W/mK, thermal conductivity doesn't play a vital role on heat transfer. In this study, temperature is the most important parameter on the kimchi refrigerator and the temperature of kimchi refrigerator's heat exchanger was measured and compared with the temperature calibrated by CFD analysis on the inside wall of the kimchi refrigerator. It is important to keep constantly the inside temperature of the Kimchi refrigerator. Besides numerical analyses for the new thermal conductive plastic for heat exchanger were executed with the various height of evaporation tube. A series of experiments were conducted to compare the performance of the two heat exchanger made of aluminum and thermal conductive plastic at the same condition and certified the possibility of the thermal conductive plastic. According to these results, it was confirmed that the conventional aluminium heat exchanger can be replaced by thermal conductive plastic successfully.

Study on the Organic Gate Insulators Using VDP Method (VDP(Vapor Deposition Polymerization) 방법을 이용한 유기 게이트 절연막의 대한 연구)

  • Pyo, Sang-Woo;Shim, Jae-Hoon;Kim, Jung-Soo;Kim, Young-Kwan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.185-190
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    • 2003
  • In this paper, it was demonstrated that the organic thin film transistors were fabricated by the organic gate insulators with vapor deposition polymerization (VDP) processing. In order to form polyimide as a gate insulator, vapor deposition polymerization process was also introduced instead of spin-coating process, where polyimide film was co-deposited by high-vacuum thermal evaporation from 4,4'-oxydiphthalic anhydride (ODPA) and 4,4'-oxydianiline (ODA) and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and ODA, and cured at $150^{\circ}C$ for 1hr. Electrical output characteristics in our organic thin film transistors using the staggered-inverted top-contact structure obtained to the saturated slop in the saturation region and the subthreshold non-linearity in the triode region. Field effect mobility, threshold voltage, and on-off current ratio in $0.45\;{\mu}m$ thick gate dielectric layer were about $0.17\;cm^2/Vs$, -7 V, and $10^6\;A/A$, respectively. Details on the explanation of compared to organic thin-film transistors (OTFTS) electrical characteristics of ODPA-ODA and 6FDA-ODA as gate insulators by fabricated thermal co-deposition method.

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Process Controllability and Stability in Organic Vapor Phase Deposition

  • Schwambera, M.;Gersdorff, M.;Reinhold, M.;Meyer, N.;Strauch, G.;Marheineke, B.;Heuken, M.;Zhou, T.X.;Ngo, T.;Brown, J.J.;Shtein, M.;Forrest, S.R.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.824-827
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    • 2004
  • High performance green $Ir(ppy)_3$-based phosphorescent OLEDs (PHOLEDs) have been fabricated by organic vapor phase deposition ($OVPD^{TM}$). In addition to demonstrating both efficiency and operational device lifetime comparable to devices built by vacuum thermal evaporation, we report on the controllability and stability of the $OVPD^{TM}$ process. Specifically, run-to-run and day-to-day deposition rate reproducibility of better than 2 % for three consecutive days is demonstrated.

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Spray Flow Characteristics of Twin-fluid Water Mist Nozzle for Fire Suppression (2유체 미세 물분무 소화노즐의 분무유동 특성)

  • Kim, Bong-Hwan;Choi, Hyo-Sung;Kim, Dong-Keon
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.10 no.3
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    • pp.60-66
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    • 2011
  • In the present investigation, experimental studies were conducted on the fire suppression performance of twin-fluid water mist spray which is subjected to thermal radiation in a closed space. Downward-directed water-mist sprays, interacting with an under kerosene pool fire, were investigated in a test facility. The mass mean diameter of water-mist droplets were measured by PMAS under various flow conditions. The developed twin-fluid water mit spray nozzle satisfied the criteria of NFPA 750, Class 1. The mechanism of fire suppression by fine water mist was concluded to be the cooling of the fire surface which leads to the suppression of fuel evaporation. It was proved that the automatic twin-fluid water mist spray system under lower pressures could be applied to an industrial facilities.

Analysis of die strength for laser dicing (레이저 다이싱에 의한 die strength 분석)

  • Lee, Young-Hyun;Choi, Kyung-Jin;Bae, Sung-Chang
    • Proceedings of the KIEE Conference
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    • 2006.04a
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    • pp.327-329
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    • 2006
  • In this paper, the cutting qualities by laser dicing and fracture strength of a silicon die is investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bend test and is compared with the die strength by mechanical sawing. As a results, die strength by laser dicing shows a decrease of 50% in compared with die strength by mechanical sawing.

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레이저를 이용한 웨이퍼 다이싱 특성 분석

  • Lee Yong-Hyeon;Choe Gyeong-Jin;Yu Seung-Ryeol;Yang Yeong-Jin;Bae Seong-Chang
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.251-254
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    • 2006
  • In this paper, cutting qualifies and fracture strength of silicon dies by laser dicing are investigated. Laser micromachining is the non-contact process using thermal ablation and evaporation mechanisms. By these mechanisms, debris is generated and stick on the surface of wafer, which is the problem to apply laser dicing to semiconductor manufacture process. Unlike mechanical sawing using diamond blade, chipping on the surface and crack on the back side of wafer isn't made by laser dicing. Die strength by laser dicing is measured via the three-point bending test and is compared with the die strength by mechanical sawing. As a results, die strength by the laser dicing shows a decrease of 50% in compared with die strength by the mechanical sawing.

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Theory of Charged Clusters Linking Nano Science and Technology to Thin Films

  • Hwang, Nong-Moon
    • Proceedings of the Korea Crystallographic Association Conference
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    • 2002.11a
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    • pp.20-20
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    • 2002
  • Based on experimental and theoretical analyses, we suggested a new possibility that the CVD diamond films grow not by the atomic unit but by the charged clusters containing a few hundreds of carbon atoms, which form spontaneously in the gas phase [J. Crysta] Growth 62 (1996) 55]. These hypothetical negatively-charged clusters were experimentally confirmed under a typical hot-filament diamond CVD process. Thin film growth by charged clusters or gas phase colloids of a few nanometers was also confirmed in Si and ZrO₂ CVD and appears to be general in many other CVD processes. Many puzzling phenomena in the CVD process such as selective deposition and nanowire growth could be explained by the deposition behavior of charged clusters. Charged clusters were shown to generate and contribute at least partially to the film deposition by thermal evaporation. Origin of charging at the relatively low temperature was explained by the surface ionization described by Saha-Langmuir equation. The hot surface with a high work function favors positive charging of clusters while that of a low work function favors negative charging.

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Catalyst-Free and Large-Area Deposition of Graphitic Carbon Films on Glass Substrates by Pyrolysis of Camphor

  • Nam, Hyobin;Lee, Woong
    • Korean Journal of Materials Research
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    • v.25 no.7
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    • pp.341-346
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    • 2015
  • The feasibility of obtaining graphitic carbon films on targeted substrates without a catalyst and transfer step was explored through the pyrolysis of the botanical derivative camphor. In a horizontal quartz tube, camphor was subjected to a sequential process of evaporation and thermal decomposition; then, the decomposed product was deposited on a glass substrate. Analysis of the Raman spectra suggest that the deposited film is related to unintentionally doped graphitic carbon containing some $sp-sp^2$ linear carbon chains. The films were transparent in the visible range and electrically conductive, with a sheet resistance comparable to that of graphene. It was also demonstrated that graphitic films with similar properties can be reproduciblyobtained, while property control was readily achieved by varying the process temperature.