• Journal of the Semiconductor & Display Technology
• /
• v.21 no.1
• /
• pp.148-154
• /
• 2022

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

• Journal of the Semiconductor & Display Technology
• /
• v.12 no.1
• /
• pp.29-33
• /
• 2013

We have fabricated transparent polymer composite films with high thermal emissivity, which can be used for heat dissipation of transparent electronics. PMMA (poly(methyl methacrylate)) solution with high transparency and thermal emissivity is mixed with various fillers (carbon nanotubes (CNTs), aluminum nitride (AlN), or silicon carbide (SiC)) with high thermal conductivity. We have achieved the thermal emissivity as high as 0.94 by the addition of CNTs. Compared with the PMMA film on glass, however, the addition of AlN or SiC is shown to rather decrease the thermal emissivity. It is also observed that the thickness of the PMMA film does not affect its thermal emissivity. To avoid any degradation of the thermal conductivity, therefore, the PMMA film thickness is desirable to be $1{\mu}m$. There also exists a tradeoff between the optical transmittance and thermal conductivity on the selection of the amount of fillers.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.12 no.1
• /
• pp.137-151
• /
• 1988

Thurbulent thermal convection between two plates, bottom plate is at higher temperature $T_{h}$ and the upper plate is at lower temperature $T_{i}$ is numerically investigated. Model equations are abridged Reynolds stress equations; full Reynolds stress equations are simplified to yield algebraic relations in case of mean square velocity fluctuations in vertical and horizontal directions. Boundary conditions for turbulent kinetic energy k and mean square temperature variance .thera.$^{2}$oner bar at the plate surfaces are set to be zero and those of dissipation rate of turbulent kinetic energy .epsilon. and dissipation rate of mean square temperature variance .epsilon.$_{\theta}$ are assumed at first grid point nearest to the boundary surfaces, whose values are approximated by inviscid estimates. Results show that temperature profiles are in good agreement with experimental data except transition region, in which temperature is over-predicted. Such discrepancy becomes larger as the Rayleigh number becomes smaller. Nusselt numbers, which are calculated from the temperature gradients at the boundary surfaces, are also in good agreement with experimental data.a.a.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.125-129
• /
• 2004

[ $BaTi_4O_9$ ] thin film were grown on $Pt/Ti/SiO_2/Si$ substrate using rf magnetron sputter, and the microstructure and dielectric properties of the thin films were investigated. For the film grown at $350^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$, the $BaTi_5O_{11}$ Phase was formed. However, the $BaTi_4O_9$ phase was formed when the growing temperature exceeded $450^{\circ}C$ The dielectric constant of the $BaTi_4O_9$ thin film grown at $550^{\circ}C$ and rapidly thermal annealed at $900^{\circ}C$ was about 40 at low frequency range($100kHz{\sim}1MHz$) and 36 at microwave range($1{\sim}10GHz$) which is very close to that of the bulk $BaTi_4O_9$ phase. The dissipation factor was very low, about 0.005 at low frequency as well as microwave range.

• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2432-2437
• /
• 2007

The demand of high speed and miniaturization of electronic devices results in increased power dissipation requirement for thermal management. In this work, the effects of microchannel width, height and liquid flowrate on the cooling performances of microchannel waterblock are investigated experimentally. The microchannel waterblock considered ranged in width from 0.5 to 0.9 mm, with the channel height being nominally 1.7 to 9 times the width in each case. The experiments were conducted using water, over a liquid flow rate ranging from 0.2 to 2.0 lpm. The base temperature, thermal resistance and pressure drop increase with increasing of liquid flow rate. The measured thermal resistances ranged from 0.10 to 0.23 $^{\circ}C$/W for the channel 5.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.22 no.5
• /
• pp.29-34
• /
• 2014

Cooling the in-wheel motor in electric vehicles is critical to its performance and durability. In this study, thermal flow analysis was conducted by evaluating the thermal performance of two conventional cooling models for in-wheel motors under the continuous rating base speed condition. For conventional model #1, in which cooling oil was stagnant in the lower end of the motor, the maximum temperature of the coil was $221.7^{\circ}C$; for conventional model #2, in which cooling oil was circulated through the exit and entrance of the housing and jig, the maximum temperature of the coil was $155.4^{\circ}C$. Therefore, both models proved unsuitable for in-wheel motors since the motor control specifications limited the maximum temperature to $150^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.24 no.5
• /
• pp.351-354
• /
• 2011

This paper was carried about thermal analysis for high efficiency point contact solar cell. Therefore, we carried about 2-D device and process simulator according to design and process parameters. As a result of simulations, power transfer efficiency have decreased more increasing temperature. Especially, power transfer efficiency of room temperature have been showed 25%. The other hand, power transfer efficiency of 350 K kalvin temperature have been showed 20%. Therefore, we will considered design with thermal dissipation of device.

• Journal of Applied Reliability
• /
• v.7 no.2
• /
• pp.45-55
• /
• 2007

In this study, two types of fatigue tests were conducted. Firs, cyclic bending tests were performed using the micro-bending tester. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. Creep deformation was dominant in thermal fatigue and plastic deformation was main parameter for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.05c
• /
• pp.208-212
• /
• 2003

Silicon transient voltage suppressors (TVSs) are clamping devices that limit voltage spikes by low impedance avalanche breakdown of a rugged silicon PN junction. They are used to protect sensitive components from electrical overstress such as that caused by induces lightning, inductive load switching and electrostatic discharge. In this paper, we present static and dynamic characteristics of TVS diode using thermal analysis simulation software. And also, it is presented that the thermal dissipation characteristics of TVS diode in the transient state.

• Proceedings of the KIEE Conference
• /
• 2007.07a
• /
• pp.1393-1394
• /
• 2007

This paper presents the thermal characteristics of ZnO arrester blocks under the AC voltage. The leakage currents of ZnO arrester blocks were measured as a function of time. The temperature distribution of ZnO arrester blocks were observed by the forward looking infrared camera. The degradation and thermal runaway of ZnO arrester blocks were related to the temperature of ZnO arrster blocks which depended on heat generation and dissipation. As a result, the degradation and thermal runaway of ZnO arrester blocks are associated with the temperature and leakage current of ZnO arrester blocks.