• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2000년도 봄 학술발표회 논문집
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• pp.497-500
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• 2000

This paper describes the procedures to estimate for the design thermal loads on prestressed concrete box girder bridges on th basis of the extreme analysis of the temperature data obtained from long-term thermal analyses. Long-term thermal analyses using the environmental data for three years were conducted, and the extreme distributions of th thermal loads are then determined by the tail-equivalence method, and the thermal loads corresponding to selected return period are calculated. Finally, the results are compared to the specifications suggested in a current design code for thermal loads.

• 대한기계학회논문집B
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• 제29권4호
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.77-82
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• 2001

Thermal design for KOMPSAT-2 propulsion system has been performed. Overall design requirements and the constitution for propulsion system is described. To meet the thermal design requirements, both a primary and a redundant heater circuit, each with two thermostats placed in series, will protect each hydrazine-wetted components, even if one heater circuit fails to operate. Heater power is turned off if any one of these thermostats is opened at its higher setpoint. Thus, even if one thermostat is failed closed, the second thermostat will turn off the heater. All such components shall be insulated with MLI. Propulsion heater sizing based on the constant worst cold case condition is conducted through thermal analysis. All heaters selected for propulsion components operate to prevent propellant freezing satisfying the thermal requirements for the propulsion subsystem over the worst case average voltage, i.e. 25 volts.

• 한국우주과학회:학술대회논문집(한국우주과학회보)
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• 한국우주과학회 2005년도 한국우주과학회보 제14권1호
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• pp.129-132
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• 2005

본 논문에서는 HAUSAT-2의 궤도 열 해석과 열 제어계의 예비설계를 살펴본다. HAUSAT-2의 열 제어계를 설계하기 위해서 우선 열 제어의 기본 이론 및 열 평형 방정식을 바탕으로 능동 및 수동의 각종 열 제어 방법을 고려하여 HAUSAT-2에 적합한 열 제어 방법 및 재질을 선정하였다(Karam 1998). 또한, 예상궤도인 고도 650km, 경사각 $98^{\circ}$의 태양동기궤도에서 HAUSAT-2가 처해지는 열 환경에 대한 분석 및 위성체의 각 면에 가해지는 은도 분포 및 범위를 예측하여 이를 바탕으로 열 제어계를 설계하였다. 열 해석은 기본적으로 시스템레벨의 해석, 부품레벨의 해석, 보드레벨의 해석 차순으로 진행되었으며, 현재 HAUSAT-2의 열 해석은 발열이 비교적 많은 보드의 해석까지 진행된 상태이며, 이러한 열 해석을 통해서 얻은 결과는 요구조건을 만족하지 못하는 부분에 대해 설계 변경 등을 통해서 모든 부품이 허용온도 범위를 유지하도록 HAUSAT-2의 열 제어계를 설계하였다. 향후 구조-열 모델(STM; Structure & Thermal Model)을 제작한 후 열 진공시험을 통해 열 해석 결과에 대한 검증을 수행할 것이다.

• Journal of Astronomy and Space Sciences
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• 제1권1호
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• pp.35-39
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• 1984

Space Shuttle의 성공적인 비행을 가능케한 요인중의 하나가 Silica Tile을 사용한 재사용 할 수 있는 Thermal Protection System의 설계이었다. 이러한 Thermal Protection System의 기본 설계 개념을 밝히고 또한 Silica Tile의 생산 공정과 Tile System의 구조를 서술하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.153-157
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• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2005년도 춘계 학술대회논문집
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• 정보저장시스템학회:학술대회논문집
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• 정보저장시스템학회 2005년도 추계학술대회 논문집
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• pp.246-247
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• 2005

This study suggested fanless thermal design using CAE technique for the information storage system under the serious thermal problem. At first, main heat flow was controlled by CAE based fanless heat sink design not to influence sensitive optical pick-up sensor. Then, vent parametric studies found a thermal solution about highly concentrated case top heat due to fanless. These CAE results were verified by experimental methods. As a consequence of newly designed thermal path, thermal specification of optical pick-up sensor was satisfied and fanless thermal design for the information storage system was achieved.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 추계학술발표대회 논문집
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• pp.15-20
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• 2009

The purpose of this study is to develop of portable thermal comfort measurement tool for elderly. Using prediction expression of thermal comfort for elderly which derived at previous study, a field studies were conducted. The objects of this survey are old persons over 60 years old and total 296 (male:111 persons, female:145 persons) persons were measured. The actual thermal sensation was compared with predicted thermal sensation calculated with PMV model, and the results shows that there were no correlation between them. Also, appling cheek temperature and hand temperature were useful to predict thermal sensation of elderly people. Especially, predicted thermal sensation using cheek temperature were closely connected with actual thermal sensation of elderly and presented most similar trend to actual thermal sensation.