• Steel and Composite Structures
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• v.14 no.1
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• pp.41-55
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• 2013

Fiber reinforced polymers (FRP) materials are increasingly being used for strengthening and repair of steel structures. An issue that concerns engineers in steel members which are retrofitted with FRP is stress experienced due to temperature changes. The changing temperature affects the interface bond between the FRP and Steel. This research focused on the effects of cyclical thermal loadings on the interface properties of FRP bounded to steel members. Over fifty tests were conducted to investigate the thermal effects on bonding between FRP and steel, which were cycled from temperature of $-11^{\circ}C$ ($12^{\circ}F$) to $60^{\circ}C$ ($140^{\circ}F$) for 21-36 days. This investigation consisted of two test protocols, 1) the tensile test of epoxy resin, tack coat, FRP and FRP-steel plate, 2) tensile test of each FRP compound and FRP with steel after going through thermal cyclic loading. This investigation reveals an extensive reduction in the composite's strength.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.1250-1254
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• 1992

This paper describes the designed and fabricated thermal imaging system with the SPRITE(Signal PRocessing in The Element) detector, operating in the 3-12 micron band. This system consists of an afocal telescope, a scan unit containing the SPRITE detector, an electronic processor unit and a cooler. The optical scan system utilizing rotating polygon and oscillating mirror, is 2-dimensional serial/parallel scan type using five elements of the detector. And the electronic processor unit performs digital scan conversion to reform the parallel data stream into serial analog data compatable with conventional RS-170 video. The scan field of view is 40 ${\times}$ 26.7 and the MRTD(Minium Resolvable Temperature Difference) is 0.6 K at 7.5 cycles/mm. The acquired thermal image indicates that this system has a satisfactory performance.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1673-1678
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• 2007

The use of flip-chip type electronic package offers numerous advantages such as reduced thickness, improved environmental compatibility, and downed cost. Despite numerous benefits, flip-chip type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. The electronic package in use is heated continuously by itself. When the crack at a weak site of the electronic package occurs, thermal deformationon the chip side is changed. Therefore, we can measure these micro deformations by using Moire interferometry and find out the crack length.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.360-360
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• 2006

Zein protein is one of the best biopolymer for edible film making and polyols are convenient plasticizers for biopolymers. Sorbitol, glycerol and manitol at three levels (0.5, 0.7, 1g/g of zein) were used as plasticizers. Rheological and thermal properties of zein resins were studied for determining their plasticization effectiveness. Sorbitol and glycerol had good plasticizing effects and could decrease viscoelastic modulus of zein resins considerably, but manitol was not as effective as them. Effects of plasticizers on thermal properties of resins were investigated by DSC at -100 to $150^{\circ}C$. No crystallization and melting peaks related to zein resin and plasticizers were observed. Thermograms showed that polyolic plasticizers and zein resin remained a homogeneous material throughout the cooling and heating cycles.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.202-204
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• 2006

The reliability of insert mounted components has been considered as their life time was getting increased. The spread of crack and the growth of IMC(intermetallic compound) were observed by SEM(scanning electron microscope) and EDS(energy dispersive spectroscope). The cracks in Sn-37wt%Pb under thermal shock test were found earlier than other solders(Sn-3.0wt%Ag-0.5wt%Cu and Sn-0.7wt%Cu-0.01wt%P). The IMC thickness was increased with increasing number of thermal shock cycles in the following order : Sn-0.7Cu-0.01P; Sn-3.0Ag-0.5Cu; Sn-37Pb

• Proceedings of the KIEE Conference
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• 1999.07c
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• pp.1114-1116
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• 1999

This paper presents a new algorithm which evaluates production cost and reliability indices under various constraints of the thermal generation system. In order to consider the operational constraints of thermal units effectively, the proposed algorithm is based on Monte Carlo techniques instead of analytical ones which have difficulty in modelling the units with additional constraints. At that point, generating units are modelled into two types, base load units and peaking units. These generating unit models are used in state duration sampling simulation for which approach can readily consider the peaking unit operating cycles and easily calculates frequency-duration indices. The proposed production simulation algorithm is applied to the IEEE Reliability Test System, and performs the production simulation under the given constraints. The results show that the proposed algorithm is accurate, reliable and useful.

• Proceedings of the KIEE Conference
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• 1993.07a
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• pp.9-11
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• 1993

This paper decribed the development of Thermal Imaging Oservation System(TIOS) using the serial-parallel scan method. The detectors scan five lines at a time. These are put into serial order by electronic scan converter. Digital memory and high speed multiplexer are used for the serial conversion instead of charge coupled devices. As a result, thermal imaging system be presented with exellent performance which MRTD value is less than $0.5^{\circ}K$ at 7.5 cycles/mm.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.543-545
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• 1993

This paper decribed the development of Thermal Imaging Oservation System(TIOS) using the serial-parallel scan method. The detectors scan five lines at a tine. These are put into serial order by electronic scan converter. Digital memory and high speed multiplexer are used for the serial conversion instead of charge coupled devices. As a result, thermal imaging system be presented with exellent performance which MRTD value is less than $0.5^{\circ}K$ at 7.5 cycles/mm.

• International Journal of Naval Architecture and Ocean Engineering
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• v.12 no.1
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• pp.146-156
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• 2020

Two High Tensile Strength Steel (EH47) plates with thickness of 70 mm were butt-welded together by multi-pass Submerged Arc Welding (SAW), also the hardness and welding residual stress were investigated experimentally. Based on Thermal-Elastic-Plastic Finite Element (TEP FE) computation, the thermal cycles during entire welding process were obtained, and the HAZ hardness of multi-pass butt welded joint was computed by the hardenability algorithm with considering microstructure evolution. Good agreement of HAZ hardness between the measurement and computational result is observed. The evolution of each phase was drawn to clarify the influence mechanism of thermal cycle on HAZ hardness. Welding residual stress was predicted with considering mechanical response, which was dominantly determined by last cap welds through analyzing its formation process.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.21-26
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• 2006

We developed a bonding at low temperature using fine pitch Sn and In bumps, and studied the reliability of the fine pitch In-Sn solder joints. The $30{\mu}m$ pitch Sn and In bumps were joined together at $120^{\circ}C$. A non conductive adhesive (NCA) was applied during solder joining. Thermal cycling test ($0^{\circ}C-100^{\circ}C$, 2 cycles/h) of up to 2000 cycles was carried out to evaluate the reliability of the solder joints. The bondability was evaluated by measuring the contact resistance (Rc) of the joints through the four point probe method. As the content of filler increased, the reliability improved in the solder joints during thermal cycling test because the contact resistance increased little. The filler redistributed the stress and strains from the thermal shock over the entire joint area.