• Title/Summary/Keyword: Thermal curing

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A Study on Vulcanization of EPDM by Far-infrared (원적외선에 의한 EPDM의 가교 특성 연구)

  • Bae, J.W.;Kim, J.S.;Lee, J.H.;Jung, W.S.;Park, H.C.;Kang, D.P.
    • Elastomers and Composites
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    • v.43 no.1
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    • pp.1-7
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    • 2008
  • Far-infrared vulcanization of ethylene-propylene-diene terpolymer(EPDM) compounds has been studied in comparison with hot air vulcanization. Vulcanization characteristics of EPDM compounds were measured by degree of curing and temperature of specimens in vulcanization process. As a result, degree of curing by far-infrared of EPDM compounds was shown to be higher value than that by hot air at the same vulcanization temperature. Especially, degree of curing by far-infrared on 3 mm thickness of EPDM compounds was increased by two times compared to that by hot air. While the increase of thermal conductivity of EPDM compounds highly improved degree of curing by far-infrared, that hardly improved degree of curing by hot air.

A numerical study on the residual stress in LED encapsulment silicone considering cure process (경화공정을 고려한 LED 패키징 실리콘의 잔류음력에 대한 수치해석적 고찰)

  • Song, M.J.;Kim, K.B.;Kang, J.J.;Kim, H.K.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.323-327
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    • 2009
  • Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for both curing and cooling process during silicone molding. For analysis of curing process, a cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the curing as well as the cooling process should be designed carefully so as to reduce the residual stress although the cooling process plays the bigger role than curing process in determining the final residual stress state.

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Synthesis and Characterization of Schiff Base Metal Complexes and Reactivity Studies with Malemide Epoxy Resin

  • Lakshmi, B.;Shivananda, K.N.;Prakash, Gouda Avaji;Isloor, Arun M.;Mahendra, K.N.
    • Bulletin of the Korean Chemical Society
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    • v.33 no.2
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    • pp.473-482
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    • 2012
  • A novel malemide epoxy containing Co(II), Ni(II) and Cu(II) ions have been synthesized by curing malemide epoxy resin (MIEB-13) and Co(II), Ni(II) and Cu(II) complexes of macrocyclic bis-hydrazone Schiff base. The Schiff base was synthesized by reacting 1,4-dicarbnyl phenyl dihydrazide with 2,6-diformyl-4-methyl phenol. The Schiff base and its Co(II), Ni(II) and Cu(II) complexes have been characterized by elemental analyses, spectral (IR, $^1H$ NMR, UV-vis., FAB mass, ESR), thermal and magnetic data. The curing reaction of maleimide epoxy compound with metal complexes was studied as curing agents. The stability of cured samples was studied by thermo-gravimetric analyses and which have excellent chemical (acid/alkali/solvent) and water absorption resistance. Further, the scanning electron microscopy (SEM) and definitional scanning colorimetric (DSC) techniques were confirmed the phase homogeneity of the cured systems.

Curing of Epoxy Resins by Aminophosphazene Derivatives and Its Thermal Properties (아미노포스파젠 유도체에 의한 에폭시수지의 경화와 열적성질)

  • 윤흥수
    • Textile Coloration and Finishing
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    • v.11 no.6
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    • pp.7-17
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    • 1999
  • Aminophosphazene derivatives were prepared from hexachlorocyclotriphosphazene and used for the curing agents of epoxy resins. The effect of the curing agent on the dynamic viscoelastic properties, flame proofing, and heat resistance of the cured epoxy resins were investigated and compared with those for the epoxy resins cured with aliphatic and aromatic amines. The epoxy resin cured by 1,1-diamino-3,3,5,5-tetrachlorocyclotriphosphazene showed the highest storage modulus and glass transition temperature when cured at 19$0^{\circ}C$ for 6 hours. The epoxy resins cured with phosphazene derivatives showed superior flame proofing to those with aliphatic amine and aromatic amine. Particularly it is an effective curing agent for epoxy resins to enhance the storage modulus, flame proofing and resistance to heat.

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Temperature Control of Mass-Concrete Structure with Pipe Cooling or Sheet Curing. (시트양생 및 파이프 쿨링에 의한 매스콘크리트 구조물의 온도제어)

  • 차홍윤;김은경;김래현;신치범
    • Proceedings of the Korea Concrete Institute Conference
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    • 1995.04a
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    • pp.263-267
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    • 1995
  • The usual methods for the temperature control of mass-concrete structures include the use of low-heat cement, pre-cooling, post-cooling, or sheet curing. In order to control the heat of hydration during the construction of mass-concrete structures, the combination of the above methods is commonly employed. For the construction of mass-concrete structures such as massive pier or anchor, it is necessary to control the curing temperature with pipe cooling. In this study, the method of analysis on the effect of pipe of was proposed to prevent the thermal cracking due to heat of hydration In addition the effect of covering the concrete surface with blanket insulation was investigated. The results of the present study may be useful for the prediction of curing temperature of mass-concrete structures and the reasonable construction management.

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Synthesis, Characterization and Curing Studies of Thermosetting Epoxy Resin with Amines

  • Lakshmi, B.;Shivananda, K.N.;Mahendra, K.N.
    • Bulletin of the Korean Chemical Society
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    • v.31 no.8
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    • pp.2272-2278
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    • 2010
  • A new hybrid thermosetting maleimido epoxy compound 4-(N-maleimidophenyl) glycidylether (N-MPGE) is prepared by reacting N-(4-hydroxyphenyl) maleimide (HPM) with Epichlorohydrin by using benzyltrimethylammonium chloride as a catalyst. The resulting compound possesses both the oxirane ring and maleimide group. The curing reaction of these maleimidophenyl glycidylether epoxy compound (N-MPGE) with amines as curing agents such as ethylendiamine (EDA), diethylentriamine (DETA) and triethylenetetramine (TETA), aminoethylpiperazine (AEP) and isophoronediamine, IPDA), are studied. Incorporation of maleimide groups in the epichlorohydrin provides cyclic imide structure and high cross-linking density to the cured resins. The cured samples exhibited good thermal stability, excellent chemical (acid/alkali/solvent) and water absorption resistance. Morphological studies by the SEM technique further confirmed the phase homogeneity net work of the cured systems.

An Experimental Study on the Strength Development of Fly-Ash Mortar by Using the Activator and Curing Temperature change. (자극제 사용 및 양생온도 변화에 의한 플라이애쉬 모르타르의 강도발현에 관한 실험적 연구)

  • 배수환;최광윤;정재동;최영화
    • Proceedings of the Korea Concrete Institute Conference
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    • 2003.11a
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    • pp.277-280
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    • 2003
  • The purpose of this study is for the active use of the fly ash, which is a by-product of the combustion pulverizes coal thermal power plants, to compensate for the lack of landfill and for conservation of energy, by using fly ash as the supplementary cementitious material, and to prove its possibility as the related products of the cement. First of all, we examined strength development of Micro grinding fly ash by elevating its fineness and using $Na_{2}SO_{4}$ as an activator to elevate pozzolanic reaction of fly ash. Following fly ash replacement ratio and curing temperature we hope to prove its properties to suggest its possibility in the concrete and cement industry. In case of water curing, the more fineness and higher annexing of activator is, the higher strength is, and the higher curing temperature is the more pozzolanic reaction happens.

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Thermal Behavior of Silver Paste to Improve Reliability and Image Quality of LCoS Panel

  • Chen, Yu-Hsien;Huang, I-Chen;Huang, Li-Chen;Wang, Jiun-Ming;Chen, Kun-Hong;Liu, Kuang-Hua;Li, Huai-An;Lo, Yu-Cheng;Liu, Pei-Yu
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1398-1401
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    • 2006
  • Silver paste curing process is very important in LCoS panel manufacture because incomplete curing process will cause poor bonding strength and increase resistance. The imperfection situation results in poor reliability and the variation of the common voltage, respectively. The change of the common voltage causes image flicker. According to Kinetics, we acquire activation energy by using dynamic DSC and compare two kinds of silver paste. From the result of isothermal DSC, we get optimum curing parameters to solve the flicker problem caused of incomplete curing of the silver paste.

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Variation according to Curing Time in Epoxy Composites Using TSC Method (TSC방법을 이용한 에폭시 복합체의 경화 시간에 따른 변화)

  • 장인범;김성렬;박건호;이성일;김영천;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1996.05a
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    • pp.260-263
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    • 1996
  • The thermally stimulated currents(TSC) are measured to know the behaviour of charging particles of epoxy composites at the temperature range of -160∼200[$^{\circ}C$] and to prove the variation according to curing time in this study. It is confirmed that the peak amplitude is inversely proportional to the curing time, and TSC are reduced is and T$\sub$m/ is moved to high temperature side according to the curing time because carboxyl radical is formed by thermal oxidation and motility becomes lack.

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Preparation and Properties of Crosslinkable Waterborne Polyurethanes Containing Aminoplast -Effect of Curing Condition-

  • Kwon Ji-Yun;Rahman Mohammad Mizanur;Kim Han-Do
    • Fibers and Polymers
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    • v.7 no.2
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    • pp.95-104
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    • 2006
  • In order to improve the water swelling, thermal/mechanical and adhesion properties of waterborne polyurethane (WBPU), a series of the crosslinkable WBPUs containing hydrophilic ionic component, dimethylol propionic acid (20 mole%), were prepared by in-situ polymerization using a cross-linker hexakis (methoxymethyl) melamine (HMMM). Effects of the HMMM content (2, 4, and 6 wt%) and curing temperature on these properties of the crosslinked WBPUs samples were investigated. All properties were found to increase with increasing HMMM content. It was found that the optimum curing temperature of the WBPU films and adhesives was near $120^{\circ}C$, which was not dependent on the HMMM content.