• Title/Summary/Keyword: Thermal crack

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A Study on the Quality Properties of Low Heat Concrete according to Kinds of Cement (시멘트 종류에 따른 저발열 콘크리트의 품질특성에 관한 연구)

  • Kim, Sung;Choi, Sung-Woo;Jo, Hyun-Tae;Jun, Joun-Young;Ryu, Deuk-Hyun
    • Proceedings of the Korea Concrete Institute Conference
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    • 2006.11a
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    • pp.777-780
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    • 2006
  • Recently, owing to the development of industry and the improvement of building techniques, the concrete structure is becoming larger and higher. In hardening these large concrete, the heat of hydration gives rise to considerable thermal stress depending on the size and environmental condition of concrete, which might cause thermal cracking. Especially, the crack may cause severe damage to the safety and the durability of concrete structure. This study is investigated the thermal properties of concrete according to several binder conditions, such as OPC, Belite Rich Cement(BRC), Low-Heat-Mixed Cement(LHC), Fly ash added cement. As a result of this study, the Flowability of concrete was beetter with BRC and LHC than FA(25) and OPC. On the other hand, LHC gets superior effect in the control of heat hydration, it's caused by the volume of OPC.

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Degradation Properties of Epoxy Resin Used in Indoor (옥내용 에폭시 수지의 열화 특성)

  • 남기동;정중일;연복희;허창수;박영두
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.57-60
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    • 2000
  • In this paper, study on the properties of the thermal degradated epoxy resin which is used in indoor insulation apparatus is performed to investigate the problems of the decreasing insulation characteristics and crack in the indoor insulation apparatus. As a parameter of variation, SEM, contact angle, surface resistivity, relative dielectric constant and weight loss are measured. As the results of the above measurements, the contact angle and surface resistivity of the epoxy resin has increased to 200$^{\circ}C$ in but at the above 200$^{\circ}C$ the values have decreased. The relative dielectric constants the thermal treated samples have increased on with the temperature increase. We find the volatile components of the epoxy resin compound has disappeared during thermal degradation by SEM. The insulation properties of the epoxy resin have increased by the 200$^{\circ}C$ but decreased in the above 200$^{\circ}C$.

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Cracks in Tape Cast Oxide Laminar Composites (테이프 캐스팅 산화물 층상 복합체에서의 균열)

  • Kim, Ji-Hyun;Yang, Tae-Young;Lee, Yoon-Bok;Yoon, Seog-Young;Park, Hong-Chae
    • Journal of the Korean Ceramic Society
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    • v.39 no.5
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    • pp.484-489
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    • 2002
  • Hot-pressure sintered laminar composites with alumina/zirconia or mullite/zirconia as an outer layer and alumina/zircon (resulting in reaction-bonded mullite/zirconia during sintering) as an inner layer were fabricated by tape casting and lamination. Various forms of crack were observed in sintered laminar composites, these cracks included channel cracks in the outer layer, transverse cracks in the inner layer and interface cracks debonding interlayer. Based on detailed microscopic observations, the cracks were attributed to thermal expansion mismatch between the oxides consisting of the each layer. In particular, the interlayer and transverse cracks were confirmed in the laminates consisted of the mullite/zirconia system as the outer layers, however, those cracks were not observed in the alumina/zirconia system used. In addition, the crack propagation did not exhibit same behavior in the two kinds of outer layer when the indentation load was applied.

Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package (반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용)

  • 김경섭;신영의;장의구
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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Structural Improvement for Crack of Integrated Circuit in Single Board Computer by Structure Analysis (단일보드컴퓨터 구조해석을 통한 집적회로 균열현상의 구조적 개선)

  • Ryu, Jeong-min;Lee, Yong-jun;Sohn, Kwonil
    • Journal of Advanced Navigation Technology
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    • v.23 no.5
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    • pp.460-465
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    • 2019
  • In this study, we aim to derive a solution from the structural analysis for electrical failure of single board computers for computing navigation information. By analyzing the characteristic factor, we identify that crack occur on the central processing unit board due to a certain structural problem, and that the physical effect by the crack make communication function be impossible to perform, which it causes booting error. In order to find the location of excessive stress causing the crack, structural analysis for the single board computer is done. From the structural analysis, the areas where stress concentration occurs are identified, and improvement methods changing the structures are developed. As a result, we shows that stresses are reduced entirely on the stress distribution for the improved structure. In addition, heat analysis shows that changing the structure to reduce stresses is not affect to the heat radiation, and the thermal resistance of the actual equipment is verified by measuring the temperature of the heat sink applied with the improved structure.

Thermal Expansion and Contraction Characteristics of Continuous Casting Carbon Steels (연속주조용 탄소강에서 상변화에 따른 열팽창 및 수축 거동)

  • Kim, H.C.;Lee, J.H.;Kwon, O.D.;Yim, C.H.
    • Korean Journal of Materials Research
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    • v.13 no.3
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    • pp.137-143
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    • 2003
  • The air gap between the metal and mold, formed by shrinkage during solidification, causes surface and subsurface cracks in the continuous casting process. Molten crack on the surface might also occur due to improper heat transfer between them. In order to compensate the air gap in mold design, the thermal contraction is an essential factor. In this study, the thermal contraction and expansion behaviors were examined from the ($\alpha$ and pearlite)/${\gamma}$ to ${\gamma}$/$\delta$ transformations in continuous casting steels by the commercial dilatometer and the self- assembled dilatometer with laser distance measurement. It was found that the thermal contraction and expansion behaviors were very dependant on the phase transformation of the ${\gamma}$/$\delta$ as well as ($\alpha$ and pearlite)/${\gamma}$. The sudden volume change from $\delta$ to ${\gamma}$ which might cause cracks in the continuous casting process, was observed on cooling just below the melting temperature by the self-assembled dilatometer.

An Finite Element Analysis for Elasto-Plastic Thermal Stresses Considerating Strain Hysteresis at Quenching Process of Carbon Steel(II) - Analysis of elasto-viscoplastic thermal stress - (탄소강의 퀜칭처리 과정에서 변형율이력을 고려한 탄소성열응력의 유한요소 해석(II) - 탄점소성 열응력 해석 -)

  • Kim, Ok-Sam;Koo, Bon-Kwon
    • Journal of the Korean Society for Heat Treatment
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    • v.9 no.2
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    • pp.147-158
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    • 1996
  • Generally, analytical consideration on the behaviour of metallic structures during quenching process, and analysis on the thermal stress and deformation after heat treatment are very important in presumption of crack and distorsion of quenched material. In this study a set of constitute equations relevant to the analysis of thermo elasto-viscoplastic materials with strain hysteresis during quenching process way presented on the basis of contimuum thermo-dynamics mechanics. The thermal stresses were numerically calculated by finite element technique of weighted residual method and the principle of virtual work. In the calculation process, the temperature depandency of physical and mechaniclal properties of the material in consideration. On the distribution of elasto-viscoplastic thermal stresses according to radial direction, axial and tangential stress are tensile stress(50MPa, 1.5GPa and 300MPa) in surface and compressive stress(-1.2GPa, -1.14GPa and -750MPa) in the inner part on the other hand, radial stress is tensile stress(900MPa) in area of analysis. According to axial direction, tangential stress gradients are average 60MPa/mm on the whole. The reversion of stress takes place at 11.5 to 16.8mm from the center in area of analysing.

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Effects of Alpha Phase on the Fatigue Properties of Fe-29%Ni-17%Co Low Thermal Expansion Alloy (Fe-29%Ni-17%Co 저열팽창 합금의 피로 특성에 미치는 알파상의 영향)

  • Kim, Min-Jong;Gwon, Jin-Han;Cho, Kyu-Sang;Lee, Kee-Ahn
    • Korean Journal of Materials Research
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    • v.24 no.9
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    • pp.481-487
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    • 2014
  • The effect of alpha phase on the fatigue properties of Fe-29%Ni-17%Co low thermal expansion alloy was investigated. Two kinds of alloys (Base alloy and Alpha alloy) were prepared by controlling the minimal alloy composition. Microstructure observation, tensile, high-cycle fatigue, and low-cycle fatigue results were measured in this study. The Base alloy microstructure showed typical austenite ${\gamma}$ phase. Alpha alloy represented the dispersed phase in the austenite ${\gamma}$ matrix. As a result of tensile testing, Alpha alloy was found to have higher strengths (Y.S. & T.S.) and lower elongation compared to those of the Base alloy. High cycle fatigue results showed that Alpha alloy had a higher fatigue limit (360MPa) than that (330MPa) of the Base alloy. The Alpha alloy exhibited the superior high cycle fatigue property in all of the fatigue stress conditions. SEM fractography results showed that the alpha phase could act to effectively retard both fatigue crack initiation and crack propagation. In the case of low-cycle fatigue, the Base alloy had longer fatigue life in the high plastic strain amplitude region and the Alpha alloy showed better fatigue property only in the low plastic strain amplitude region. The fatigue deformation behavior of the Fe-29%Ni-17%Co alloy was also discussed as related with its microstructure.

Studies on effects of calibration methods and current lead position on the direct current potential drop method for crack length measurement (직류전압강하법에 의한 균열길이 측정에 미치는 도선의 위치 및 보정방법의 영향에 관한 연구)

  • Cho, C.C.;Kim, I.S.;Kim, S.S.;Choe, S.J.;Hur, B.Y.
    • Analytical Science and Technology
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    • v.10 no.4
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    • pp.300-306
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    • 1997
  • The effective resolution of the direct current potential drop (DCPD) method for crack length determination is strongly affected by a number of factors including wire locations and calibration method. In the present study, the effects of wire locations, thermal EMF and reference probe locations on the accuracy of calibration methods, including Hicks-Pickard equation and Johnson's equation, were examined with the CT specimens which were nine times larger than the standard specimen. In light of experimental results, it was found that Hicks-Pickard equation can accurately represent the a/W-V/Vo relationship when current input wire is located at the load line. It was also found that the accuracy of DCPD method can be greatly improved with the thermal EMF calibration and the use of Vo value at a/W = 0.241. The use of reference potential was found to be impractical when current input wire is located at the load line.

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Stress Intensity factor Calculation for the Axial Semi-Elliptical Surface Flaws on the Thin-Wall Cylinder Using Influence Coefficients (영향계수를 이용한 원통용기 축방향 표면결함의 응력확대계수의 계산)

  • Jang, Chang-Heui;Moon, Ho-Rim;Jeong, Ill-Seok;Kim, Tae-Ryong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.11
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    • pp.2390-2398
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    • 2002
  • For integrity analysis of nuclear reactor pressure vessel, including the Pressurized thermal shock analysis, the fast and accurate calculation of the stress intensity factor at the crack tip is needed. For this, a simple approximation scheme is developed and the resulting stress intensity factors for axial semi-elliptical cracks in cylindrical vessel under various loading conditions are compared with those of the finite element method and other approximation methods, such as Raju-Newman's equation and ASME Sec. Xl approach. For these, three-dimensional finite-element analyses are performed to obtain the stress intensity factors for various surface cracks with t/R = 0.1. The approximation methods, incorporated in VINTIN (Vessel INTegrity analysis-INner flaws), utilizes the influence coefficients to calculate the stress intensity factor at the crack tip. This method has been compared with other solution methods including 3-D finite clement analysis for internal pressure, cooldown, and pressurized thermal shock loading conditions. The approximation solutions are within $\pm$2.5% of the those of FEA using symmetric model of one-forth of a vessel under pressure loading, and 1-3% higher under pressurized thermal shock condition. The analysis results confirm that the VINTIN method provides sufficiently accurate stress intensity factor values for axial semi-elliptical flaws on the surface of the reactor pressure vessel.