• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.9 no.2
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• pp.45-53
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• 2005

This paper investigates the influence of thermal conductivity and variable viscosity on the problem of micropolar fluid in the presence of suction or injection. The fluid viscosity is assumed to vary as an exponential function of temperature and the thermal conductivity is assumed to vary as a linear function of temperature. The governing fundamental equations are approximated by a system of nonlinear ordinary differential equations and are solved numerically by using shooting method. Numerical results are presented for the distribution of velocity, microrotation and temperature profiles within the boundary layer. Results for the details of the velocity, angular velocity and temperature fields as well as the friction coefficient, couple stress and heat transfer rate have been presented.

• Bulletin of the Korean Chemical Society
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• v.28 no.8
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• pp.1371-1374
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• 2007

The velocity auto-correlation (VAC) function of liquid argon in the Green-Kubo formula decays quickly within 5 ps to give a well-defined diffusion coefficient because the velocity is the property of each individual particle, whereas the stress (SAC) and heat-flux auto-correlation (HFAC) functions for shear viscosity and thermal conductivity have non-decaying, long-time tails because the stress and heat-flux appear as system properties. This problem can be overcome through N (number of particles)-fold improvement in the statistical accuracy, by considering the stress and the heat-flux of the system as properties of each particle and by deriving new Green-Kubo formulas for shear viscosity and thermal conductivity. The results obtained for the transport coefficients of liquid argon obtained are discussed.

• Bulletin of the Korean Chemical Society
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• v.28 no.10
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• pp.1689-1696
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• 2007

Equilibrium molecular dynamics (EMD) simulations are used to evaluate the transport coefficients of argonkrypton mixtures at two liquid states (state A: 94.4 K and 1 atm; state B: 135 K and 39.5 atm) via modified Green-Kubo formulas. The composition dependency of the volume at state A obeys close to the linear model for ideal liquid mixture, while that at state B differs from the linear model probably due to the high pressure. The radial distribution functions for the Ar-Kr mixture (x = 2/3) show a mixing effect: the first peak of g11 is higher than that of g(r) for pure Ar and the first peak of g22 is lower than that of g(r) for pure Kr. An exponential model of engineering correlation for diffusion coefficient (D) and shear viscosity (η) is superior to the simple linear model for ideal liquid mixtures. All three components of thermal conductivity (λpm, λtm, and λti) at state A and hence the total thermal conductivity decrease with the increase of x. At state B, the change in λtm is dominant over those in λpm and λti, and hence the total thermal conductivity decrease with the increase of x.

• Design & Manufacturing
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• v.15 no.3
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• pp.7-12
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• 2021

Plastic injection molds used for rapid heating and cooling must minimize surface damage due to friction and maintain excellent thermal and low electrical conductivity. Accordingly, various surface treatments are being applied. The properties of Al₂O₃ coating and DLC coating were compared to find the optimal surface treatment method. Al₂O₃ coating was deposited by thermal spray method. DLC films were deposited by sputtering process in room temperature and high temperature PECVD (Plasma enhanced chemical vapor deposition) process in 723 K temperature. For the evaluation of physical properties, the electrical and thermal conductivity including surface hardness, adhesion and wear resistance were analyzed. The electrical resistance of the all coated samples was showed insulation properties of 24 MΩ/sq or more. Especially, the friction coefficient of high temp. DLC coating was the lowest at 0.134.

• Elastomers and Composites
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• v.55 no.1
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• pp.59-66
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• 2020

Herein, we investigated the thermal conductivity and thermal stability of natural rubber composite systems containing hybrid fillers of boron nitride (BN) and aluminum nitride (AlN). In the hybrid system, the bimodal distribution of polygonal AlN and planar BN particles provided excellent filler-packing efficiency and desired energy path for phonon transfer, resulting in high thermal conductivity of 1.29 W/mK, which could not be achieved by single filler composites. Further, polyethylene glycol (PEG) was compounded with a commonly used naphthenic oil, which substantially increased thermal conductivity to 3.51 W/mK with an excellent thermal stability due to facilitated energy transfer across the filler-filler interface. The resulting PEG-incorporated hybrid composite showed a high thermal degradation temperature (T₂) of 290℃, a low coefficient of thermal expansion of 26.4 ppm/℃, and a low thermal distortion parameter of 7.53 m/K, which is well over the naphthenic oil compound. Finally, using the Fourier's law of conduction, we suggested a modeling methodology to evaluate the cooling performance in thermal management system.

• Korean Journal of Metals and Materials
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• v.56 no.11
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• pp.822-828
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• 2018

P-type Ce/Yb-filled skutterudites were synthesized, and their charge transport and thermoelectric properties were investigated with partial double filling and charge compensation. In the case of $(Ce_{1-z}Yb_z)_{0.8}Fe_4Sb_{12}$ without Co substitution, the marcasite ($FeSb_2$) phase formed alongside the skutterudite phase, but the generation of the marcasite phase was inhibited by increasing Co concentration. The electrical conductivity decreased with increasing temperature, exhibiting degenerate semiconductor behavior. The Hall and Seebeck coefficients were positive, which confirmed that the specimens were p-type semiconductors with holes as the major carriers. The carrier concentration decreased as the concentration of Ce and Co increased, which led to decreased electrical conductivity and increased Seebeck coefficient. The thermal conductivity decreased due to a reduction in electronic thermal conductivity via Co substitution, and due to decreased lattice thermal conductivity via double filling of Ce and Yb. $(Ce_{0.25}Yb_{0.75})_{0.8}Fe_{3.5}Co_{0.5}Sb_{12}$ exhibited the greatest dimensionless figure of merit (ZT = 0.66 at 823 K).

• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• Journal of Powder Materials
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• v.7 no.3
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• pp.154-160
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• 2000

In order to enhance sinterability of W-Cu composites used for heat sink materials, mechanical alloying process where both homogeneous mixing of component powders and fine dispersion of minor phase can be easily attained was employed. Nanostructured W-Cu powders prepared by mechanical alloying showed W grain size ranged of 20-50 nm and were able to be efficiently sintered owing to the fine particle size as well as uniform distribution of Cu phase. The thermal properties such as electrical resistivity, coefficient of thermal expansion and thermal conductivity were evaluated as functions of temperature and Cu content. It was found that the coefficient of thermal expansion could be controlled by changing Cu content. The measured electrical resistivities and thermal diffusivities were also varied with Cu content. The thermal conductivities calculated from the values of resistivities and diffusivities showed similar tendency as a function of temperatures. However, this is in contradiction with thermal conductivities of pure W and Cu which decrease with increasing temperature.

• Journal of the Korean earth science society
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• v.32 no.6
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• pp.629-639
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• 2011

Based on Maxwell-Eucken(ME) model, which is one of structural models, a new model for predicting the effective thermal conductivity of variably saturated porous materials is proposed. The new model is a linear combination of three ME models having matrix, water, and air as a continuous phase. The coefficient of the corresponding linear equation is defined by a parameter referred to as 'the continuity coefficient', which provides a relative degree of continuity of each phase. The continuity coefficient of matrix is assumed to be linearly proportional to porosity. The model can be linear or nonlinear depending on how the continuity coefficients of water and air vary with water saturation. The feasibility of the proposed model was examined by both numerical and experimental results. Both linear and nonlinear models showed a high accuracy of prediction with $R^2$ values of 0.86-0.98 and 0.88-0.99, respectively. The numerical and experimental results also showed that the continuity coefficient of matrix was linearly proportional to porosity. Therefore, the proposed prediction model can be effectively used to estimate effective thermal conductivity of unsaturated porous materials by measuring porosity, water content and mineralogical compositions of matrix.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.3
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• pp.182-186
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• 2005

In this work, thermal evaporation system was employed to deposit thin films of SiC on glass substrates in order to determine the parameters of them. Measurements included transmission, absorption, Seebak effect, resistivity and conductivity, absorption coefficient, type of energy band-gap, extinction coefficient as functions of photon energy and the effect of increasing film thickness on transmittance. Results explained that SiC thin film is an n-type semiconductor of indirect energy band-gap of ${\sim}3eV$, cut-off wavelength of 448nm, absorption coefficient of $3.4395{\times}10^{4}cm^{-1}$ and extinction coefficient of 0.154. The experimental measured values are in good agreement with the typical values of SiC thin films prepared by other advanced deposition techniques.