• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.77-77
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• 1998

Present silicon dioxide (SiOz) 떠m as intennetal dielectridIMD) layers will result in high parasitic c capacitance and crosstalk interference in 비gh density devices. Low dielectric materials such as f f1uorina뼈 silicon oxide(SiOF) and f1uoropolymer IMD layers have been tried to s이ve this problem. I In the SiOF ftlm, as fluorine concentration increases the dielectric constant of t뼈 film decreases but i it becomes unstable and wa않r absorptivity increases. The dielectric constant above 3.0 is obtain어 i in these ftlms. Fluoropolymers such as polyte$\sigma$따luoroethylene(PTFE) are known as low dielectric c constant (>2.0) materials. However, their $\alpha$)Or thermal stability and low adhesive fa$\pi$e have h hindered 야1리ru뚱 as IMD ma따"ials. 1 The concept of a plasma processing a찌Jaratus with 비gh density plasma at low pressure has r received much attention for deposition because films made in these plasma reactors have many a advantages such as go여 film quality and gap filling profile. High ion flux with low ion energy in m the high density plasma make the low contamination and go어 $\sigma$'Oss피lked ftlm. Especially the h helicon plasma reactor have attractive features for ftlm deposition 야~au똥 of i앙 high density plasma p production compared with other conventional type plasma soun:es. I In this pa야Jr, we present the results on the low dielectric constant fluorocarbonated-SiOF film d밑JOsited on p-Si(loo) 5 inch silicon substrates with 00% of 0dFTES gas mixture and 20% of Ar g gas in a helicon plasma reactor. High density 띠asma is generated in the conventional helicon p plasma soun:e with Nagoya type ill antenna, 5-15 MHz and 1 kW RF power, 700 Gauss of m magnetic field, and 1.5 mTorr of pressure. The electron density and temperature of the 0dFTES d discharge are measUI벼 by Langmuir probe. The relative density of radicals are measured by optic허 e emission spe따'Oscopy(OES). Chemical bonding structure 3I피 atomic concentration 따'C characterized u using fourier transform infrared(FTIR) s야3띠"Oscopy and X -ray photonelectron spl:’따'Oscopy (XPS). D Dielectric constant is measured using a metal insulator semiconductor (MIS;AVO.4 $\mu$ m thick f fIlmlp-SD s$\sigma$ucture. A chemical stoichiome$\sigma$y of 야Ie fluorocarbina$textsc{k}$영-SiOF film 따~si야영 at room temperature, which t the flow rate of Oz and FTES gas is Isccm and 6sccm, res야~tvely, is form려 야Ie SiouFo.36Co.14. A d dielec$\sigma$ic constant of this fIlm is 2.8, but the s$\alpha$'!Cimen at annealed 5OOt: is obtain려 3.24, and the s stepcoverage in the 0.4 $\mu$ m and 0.5 $\mu$ m pattern 킹'C above 92% and 91% without void, res야~tively. res야~tively.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.128-128
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• 2010

중적외선 영역은 장애물에 의해서 파장의 흡수가 거의 일어나지 않기 때문에 적외선 소자에서 널리 이용되고 있다. 현재 대부분의 중적외선 소자에는 HgCdTe (MCT)가 사용되고 있지만, 3성분계 화합물이 가지는 여러 문제를 가지고 있다. 반면에, 2성분계 화합물인 인듐안티모나이드 (InSb)는 중적외선 영역 ($3-5\;{\mu}m$) 파장 대에서 HgCdTe와 대등한 소자 특성을 나타냄과 동시에 낮은 기판 가격, 소자 제작의 용이성, 그리고 야전과 우주 공간에서 소자 동작의 안정성 때문에 HgCdTe를 대체할 물질로 주목을 받고 있다. InSb는 미국과 이스라엘과 같은 일부 선진국을 중심으로 연구가 되었지만, 국방 분야의 중요한 소자로 인식되었기 때문에 소자 제작에 관한 기술적인 내용은 국내에 많이 알려지지 않은 상태이다. 따라서 본 연구에서는 InSb 소자 제작의 기초연구로 절연막과 pn 접합 형성에 대한 연구를 수행하였다. 절연막의 특성을 알아보기 위해, InSb 기판위에 $SiO_2$와 $Si_3N_4$를 PECVD (Plasma Enhanced Chemical Vapor Deposition)로 증착을 하였다. 절연막의 계면 트랩 밀도는 77K에서 C-V (Capacitance-Voltage) 분석을 통하여 계산하였으며, Terman method 방법을 이용하였다.[1] $SiO_2$는 $120-200^{\circ}C$의 온도 영역에서 계면 트랩 밀도가 $4-5\;{\times}\;10^{11}cm^{-2}$범위를 가진 반면, $240^{\circ}C$의 경우 계면 트랩 밀도가 $21\;{\times}\;10^{11}cm^{-2}$로 크게 증가하였다. $Si_3N_4$는 $SiO_2$ 절연막에 비해서 3배 정도의 높은 계면 트랩 밀도 값을 나타내었으며. Remote PECVD 장비를 이용하여 $Si_3N_4$ 절연막에 관한 연구를 추가적으로 진행하여 $7-9\;{\times}\;10^{11}cm^{-2}$ 정도의 계면 트랩 밀도 값을 구할 수가 있었다. 따라서 InSb에 대한 절연막은 $200^{\circ}C$ 이하에서 증착된 $SiO_2$와 Remote PECVD로 증착 된 $Si_3N_4$가 적합하다고 할 수 있다. 절연막 연구와 더불어 InSb 소자의 pn 접합 연구를 진행하였다. n-InSb (100) 기판 ($n\;=\;0.2-0.85\;{\times}\;10^{15}cm^{-3}$ @77K)에 $Be^+$이온 주입하여 p층을 형성하여 제작 되었으며, 열처리 조건에 따른 소자의 특성을 관찰 하였다. $450^{\circ}C$에서 30초 동안 RTA (Rapid Thermal Annealing)공정을 진행한 샘플은 -0.1 V에서 $50\;{\mu}A$의 높은 암전류가 관찰되었으며, 열처리 조건을 60, 120, 180초로 변화하면서 소자의 특성 변화를 관찰하였다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.33 no.4
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• pp.125-131
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• 2023

Ga₂O₃ thin films were deposited on Ti substrates using metal organic chemical vapor deposition (MOCVD) at temperatures ranging from 350 to 500℃. Lower deposition temperatures were chosen to minimize thermal deformation of the Ti substrate and its impact on the Ga₂O₃ film. Film surfaces tended to become rough at temperatures below 500℃ due to three-dimensional growth, but the film formed at 500℃ had the most uniform surface. All deposited films were amorphous in structure. Vertical Schottky diodes were fabricated and I-V and C-V measurements were performed. I-V measurements showed higher operating voltages compared to a typical SBD for films grown at different temperatures. The sample grown at 500℃, which had the most uniform surface, exhibited the lowest operating voltage. Higher growth temperatures resulted in higher capacitance values according to C-V measurements.

• Advanced Industrial SCIence
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• v.2 no.2
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• pp.9-15
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• 2023

Since silicone rubber heaters are flexible, they can be directly attached or installed in objects to be heated even in flat, curved or three-dimensional shapes. Since the current heating method heats the entire object to be heated and raises it to a required temperature, ignoring areas or positions where heat is not required, partial intensive heating cannot be performed. When using multi-heating zones, rather than heating the entire object to be heated, only the parts that need heat are intensively heated according to the process, so it is possible to heat quickly by local location by applying different amounts of heat with a small amount of electric capacity to each place that needs heat, and heat energy can reduce. In this study, the temperature and heating time of the partially concentrated region in the multi-heating region structure are measured so that a uniform temperature or temperature difference occurs in the region requiring thermal fusion. In order to determine the optimal power density range and reduce capacitance, the safety of a silicon rubber heater manufactured with a multi-heating zone structure is investigated. If the silicon rubber heater is manufactured in a multi-heating method, the multi-intensive heating technology can be ideally applied to all heating processes.