• Structural Engineering and Mechanics
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• 제22권3호
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• pp.331-349
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• 2006

The stresses and deflections in a laminated rectangular plate under thermal vibration are determined by using the moving least squares differential quadrature (MLSDQ) method based on the first order shear deformation theory. The weighting coefficients used in MLSDQ approximation are obtained through a fast computation of the MLS shape functions and their partial derivatives. By using this method, the governing differential equations are transformed into sets of linear homogeneous algebraic equations in terms of the displacement components at each discrete point. Boundary conditions are implemented through discrete grid points by constraining displacements, bending moments and rotations of the plate. Solving this set of algebraic equations yields the displacement components. Then substituting these displacements into the constitutive equation, we obtain the stresses. The approximate solutions for stress and deflection of laminated plate with cross layer under thermal load are obtained. Numerical results show that the MLSDQ method provides rapidly convergent and accurate solutions for calculating the stresses and deflections in a multi-layered plate of cross ply laminate subjected to thermal vibration of sinusoidal temperature including shear deformation with a few grid points.

• 대한기계학회논문집A
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• 제33권4호
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.767-768
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• 2007

• Composites Research
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• 제31권6호
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• pp.404-411
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• 2018

복합재료는 주어진 경화 사이클(cure cycle)로 오토클레이브 공정이 진행됨에 따라 수지의 화학수축, 열팽창계수 등에 의한 제품 내 잔류응력(residual stress)이 발생한다. 이로 인해 spring-in, warpage와 같은 열 변형이 발생하고 최종 제품의 수치 정확성이 감소한다. 구조물의 정밀한 제작이 요구되는 항공우주분야에서는 열변형으로 인한 문제를 해결하는 것이 중요하다. 따라서 복합재료의 경화과정을 예측하고 이해하기 위한 연구가 활발히 이루어지고 있다. 본 연구에서는 공정과정에 따른 복합재료의 경화메커니즘을 유한요소해석을 통해 예측하였고, 공정에 의해 발생하는 열변형에 대한 화학수축의 영향을 열팽창계수와 비교하여 분석하였다.

• Journal of Advanced Marine Engineering and Technology
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• 제33권4호
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• pp.524-532
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• 2009

In the mechanical clutches, the pressure plate is one of the important parts for transferring the power and reducing the vibration. Instead of gray and ductile irons, CGI(Compacted Graphite Cast Iron) is concerned to be the replacement recently. A thermo-mechanical coupled analysis was performed to investigate the behavior of the pressure plate for manual clutches. Thermal and mechanical properties of three kinds of cast irons were obtained from the mechanical experiments and referred other technical reports. The results of FEM analysis, were well match with the experimental ones. In this designated FEM method, temperature distribution, stress distribution and thermal deformation were successfully gained and these results will help to design the pressure plate which was made by cast irons including CGI.

• Steel and Composite Structures
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• 제51권2호
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• pp.139-151
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• 2024

In this research, a semi-analytical solution is presented for computing mechanical displacements and thermal stresses in rotating thick cylindrical pressure vessels made of functionally graded material (FGM). The modulus of elasticity, linear thermal expansion coefficient, and density of the cylinder are assumed to change along the axial direction as a power-law function. It is also assumed that Poisson's ratio and thermal conductivity are constant. This cylinder was subjected to non-uniform internal pressure and thermal loading. Thermal loading varies in two directions. The governing equations are derived by the first-order shear deformation theory (FSDT). Using the multilayer method, a functionally graded (FG) cylinder with variable thickness is divided into n homogenous disks, and n sets of differential equations are obtained. Applying the boundary conditions and continuity conditions between the layers, the solution of this set of equations is obtained. To the best of the researchers' knowledge, in the literature, there is no study carried out bi-directional thermoelastic analysis of clamped-clamped rotating FGM thick-walled cylindrical pressure vessels under variable pressure in the longitudinal direction.

• 한국정밀공학회지
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• 제28권8호
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• pp.894-903
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• 2011

In this paper, the capability index is introduced in order to improve the reliability of new concept machine tools and the method to improve the machine accuracy from the analysis of cutting process, statistical methodology and influence factors are proposed. In addition, the rib structure of bed and column in machine tools is analyzed by using the thermal impact method in order to analogize the rib pattern which has the small thermal deformation under thermal boundary condition. In the analysis of column rib structure, thermal boundary condition is separated to heat conduction and heat transfer to appropriate real boundary condition. Finally, performance chart of bed and column rib structure is provided for designer to estimate each rib pattern and select rib structure appropriating to thermal condition.

• 동력기계공학회지
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• 제11권3호
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• pp.22-28
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• 2007

Liquefied gas vaporizer is a machine to vaporize liquefied gas such as liquid nitrogen($LN_{2}$), liquefied natural gas(LNG), liquid oxygen($LO_{2}$) etc. For the air type vaporizer, the frozen dew is created by temperature drop (below 273 K) on vaporizer surface. The layer of ice make a contractions on vaporizer. The structure analysis on the heat transfer was studied to see the effect of geometric parameters of the vaporizer, which are length 1000 mm of various type vaporizer. Structure analysis result such as temperature variation, thermal stress and thermal strain have high efficiency of heat emission as increase of thermal conductivity. As the result, Frist, With-fin model shows high temperature distribution better than without-fin on the temperature analysis. Second, Without-fin model shows double contractions better then with-fin model under the super low temperature load on the thermal strain analysis. Third, Vaporizer fin can be apply not only heat exchange but also a stiffener of structure. Finally, we confirm that All model vaporizer can be stand for sudden load change because of compressive yield stress shows within 280 MPa on thermal stress analysis.

• 항공우주시스템공학회지
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• 제17권4호
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• pp.18-27
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• 2023

본 논문에서는 열해석의 하중조건으로 레이저 열원을 설정하여 반사경의 구조-열-광학 성능 분석을 수행하였다. 레이저 열원 모델은 가우시안 빔을 바탕으로 반투명한 소재를 고려한 Beer-Lambert 법칙을 적용하여 하중조건으로 선정하였으며, 반사경만의 성능 분석을 위하여 기구부는 고려하지 않았다. 열변형해석을 수행하여 반사경 표면의 온도 변화로 인한 열응력과 열변형 데이터를 얻었다. 열변형에 의한 반사경 표면의 변위 데이터를 Zernike 다항식에 피팅하여 파면오차를 계산하였으며, 이를 통해 고에너지 레이저가 반사경으로 입사될 때 반사경의 광학 성능을 예측할 수 있었다.

• 한국공작기계학회논문집
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• 제11권4호
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• pp.12-18
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• 2002

Silicon on insulator(SOI) wafer is used in a variety of microsensor applications in which thermal deformations and other mechanical effects may dominate device Performance. One of major Problems associated with the manufacturing Processes of the microaccelerometer based on the tunneling current concept is thermal deformations and thermal stresses. This paper deals with finite element analysis(FEA) of residual thermal deformations causing popping up, which are induced in micrormaching processes of a microaccelerometer. The reason for this Popping up phenomenon in manufacturing processes of microaccelerometer may be the bending of the whole wafer or it may come from the way the underetching occurs. We want to seek after the real cause of this popping up phenomenon and diminish this by changing manufacturing processes of mic개accelerometer. In microaccelerometer manufacturing process, this paper intend to find thermal deformation change of the temperature distribution by tunnel gap and additional beams. The thermal behaviors analysis intend to use ANSYS V5.5.3.