• Title/Summary/Keyword: Thermal Uniformity

검색결과 295건 처리시간 0.022초

공동주택단지배치의 간극비와 바람장의 상관관계에 관한 연구 (A Study on Correlations of the Gap Ratio of Apartment Houses Arrangement and the Wind Field)

  • 문출성;오세규;조성우
    • KIEAE Journal
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    • 제11권2호
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    • pp.75-82
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    • 2011
  • In Korea, the ratio of population in urban areas used to be only 50.1% in 1970, but with the value risen to 90.8% in 2009, urbanization is going on rapidly. Urbanization, which occurs by the rampantly planted buildings, has become major source of raising building density, changing wind direction and reducing wind amount, and such reductions are affecting even inside the building. In each year, among the total energy consumption in Korea, residential portion takes up significant ratio, and specifically the ratio of apartment house is shown to be highest. In order to solve such problem, many studies are being conducted for the improvement of natural ventilation performance. The natural ventilation performance of apartment house are significantly determined by the characteristics of external and internal structure, but in macroscopic perspective, the performance is established fundamentally by the layout characteristics of the main building of the apartment house in preparation for wind conditions. So far researches on raising the thermal comfort through elevation of ventilation performance have been conducted actively, but many of them propose only theoretical concepts deduced through wind path analysis, and do not include any indicator to measure ventilation performance simply only with area data from layout planning stage. Therefore, in this study, gap ratio a wind field measuring indicator was developed, and after the ventilation characteristics by layout types and main building uniformity were identified, the scope of gap ratio efficient for ventilation and that of uniformity were clarified, followed by verification through simulation.

Plasma source ion implantations for shallow $p^+$/n junction

  • Jeonghee Cho;Seuunghee Han;Lee, Yeonhee;Kim, Lk-Kyung;Kim, Gon-Ho;Kim, Young-Woo;Hyuneui Lim;Moojin Suh
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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    • pp.180-180
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    • 2000
  • Plasma source ion implantation is a new doping technique for the formation of shallow junction with the merits of high dose rate, low-cost and minimal wafer charging damage. In plasma source ion implantation process, the wafer is placed directly in the plasma of the appropriate dopant ions. Negative pulse bias is applied to the wafer, causing the dopant ions to be accelerated toward the wafer and implanted below the surface. In this work, inductively couples plasma was generated by anodized Al antenna that was located inside the vacuum chamber. The outside wall of Al chamber was surrounded by Nd-Fe-B permanent magnets to confine the plasma and to enhance the uniformity. Before implantation, the wafer was pre-sputtered using DC bias of 300B in Ar plasma in order to eliminate the native oxide. After cleaning, B2H6 (5%)/H2 plasma and negative pulse bias of -1kV to 5 kV were used to form shallow p+/n junction at the boron dose of 1$\times$1015 to 5$\times$1016 #/cm2. The as-implanted samples were annealed at 90$0^{\circ}C$, 95$0^{\circ}C$ and 100$0^{\circ}C$during various annealing time with rapid thermal process. After annealing, the sheet resistance and the junction depth were measured with four point probe and secondary ion mass spectroscopy, respectively. The doping uniformity was also investigated. In addition, the electrical characteristics were measured for Schottky diode with a current-voltage meter.

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MIT characteristic of VO2 thin film deposited by ALD using vanadium oxytriisopropoxide precursor and H2O reactant

  • Shin, Changhee;Lee, Namgue;Choi, Hyeongsu;Park, Hyunwoo;Jung, Chanwon;Song, Seokhwi;Yuk, Hyunwoo;Kim, Youngjoon;Kim, Jong-Woo;Kim, Keunsik;Choi, Youngtae;Seo, Hyungtak;Jeon, Hyeongtag
    • Journal of Ceramic Processing Research
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    • 제20권5호
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    • pp.484-489
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    • 2019
  • VO2 is an attractive candidate as a transition metal oxide switching material as a selection device for reduction of sneak-path current. We demonstrate deposition of nanoscale VO2 thin films via thermal atomic layer deposition (ALD) with H2O reactant. Using this method, we demonstrate VO2 thin films with high-quality characteristics, including crystallinity, reproducibility using X-ray diffraction, and X-ray photoelectron spectroscopy measurement. We also present a method that can increase uniformity and thin film quality by splitting the pulse cycle into two using scanning electron microscope measurement. We demonstrate an ON / OFF ratio of about 40, which is caused by metal insulator transition (MIT) of VO2 thin film. ALD-deposited VO2 films with high film uniformity can be applied to next-generation nonvolatile memory devices with high density due to their metal-insulator transition characteristic with high current density, fast switching speed, and high ON / OFF ratio.

수직하중에 의한 응력이 CMP 공정의 디싱에 미치는 영향 (Investigation of the Relationship Between Dishing and Mechanical Stress During CMP Process )

  • 김형구;김승현;김민우;임익태
    • 반도체디스플레이기술학회지
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    • 제22권2호
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    • pp.30-34
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    • 2023
  • Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

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Instrumentation of a Thermal-Optical Carbon Analyzer and Its Sensitivity in Organic and Elemental Carbon Determination to Analysis Protocols

  • Lim, Ho-Jin;Sung, Su-Hwan;Yi, Sung-Sin;Park, Jun-Hyun
    • 한국환경과학회지
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    • 제21권1호
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    • pp.1-9
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    • 2012
  • A thermal-optical transmittance carbon analyzer has been developed to determine particulate organic (OC) and elemental (EC) carbon. Several analysis factors affecting the sensitivity of OC and EC determination were investigated for the carbon analyzer. Although total carbon (TC) is usually consistent in the determination, OC and EC split is sensitive to adopted analysis protocol. In this study the maximum temperature in oxygen-free He in the analysis was examined as a main cause of the uncertainty. Prior to the sensitivity analysis consistency in OC-EC determination of the carbon analyzer and the uniformity of carbonaceous aerosol loading on a sampled filter were checked to be in acceptable range. EC/TC ratios were slightly decreased with increasing the maximum temperature between $550-800^{\circ}C$. For the increase of maximum temperature from $500^{\circ}C$ to $800^{\circ}C$, the EC/TC ratio was lowered by 4.65-5.61% for TC loading of 13-44 ${\mu}g/cm^2$ with more decrease at higher loading. OC and EC determination was not influenced by trace amount of oxygen in pure He (>99.999%), which is typically used in OC and EC analysis. The facing of sample loaded surface to incident laser beam showed negligible influence in the OC-EC split, but it caused elevated PC fraction in OC for forward facing relative to backward facing.

Temperature distribution in a full-scale steel framed building subject to a natural fire

  • Wald, Frantisek;Chladna, Magdalena;Moore, David;Santiago, Aldina;Lennon, Tom
    • Steel and Composite Structures
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    • 제6권2호
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    • pp.159-182
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    • 2006
  • Current fire design codes for determining the temperature within the structural elements that form part of a complete building are based on isolated member tests subjected to the standard fire. However, the standard time-temperature response bears little relation to real fires and doesn't include the effects of differing ventilation conditions or the influence of the thermal properties of compartment linings. The degree to which temperature uniformity is present in real compartments is not addressed and direct flame impingement may also have an influence, which is not considered. It is clear that the complex thermal environmental that occurs within a real building subject to a natural fire can only be addressed using realistic full-scale tests. To study global structural and thermal behaviour, a research project was conducted on the eight storey steel frame building at the Building Research Establishment's Cardington laboratory. The fire compartment was 11 m long by 7 m wide. A fire load of $40kg/m^2$ was applied together with 100% of the permanent actions and variable permanent actions and 56% of live actions. This paper summarises the experimental programme and presents the time-temperature development in the fire compartment and in the main supporting structural elements. Comparisons are also made between the test results and the temperatures predicted by the structural fire Eurocodes.

Isothermal Characteristics of a Rectangular Parallelepiped Sodium Heat Pipe

  • Boo Joon Hong;Park Soo Yong
    • Journal of Mechanical Science and Technology
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    • 제19권4호
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    • pp.1044-1051
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    • 2005
  • The isothermal characteristics of a rectangular parallelepiped sodium heat pipe were inves­tigated for high-temperature applications. The heat pipes was made of stainless steel of which the dimension was $140\;m\;(L)\;{\times}\;95m\;(W)\;{\times}\;46 m\;(H)$ and the thickness of the container was 5 mm. Both inner surfaces of evaporator and condenser were covered with screen meshes to help spread the liquid state working fluid. To provide additional path for the working fluid, a lattice structure covered with screen mesh wick was inserted in the heat pipe. The bottom surface of the heat pipe was heated by an electric heater and the top surface was cooled by circulating coolant. The concern in this study was to enhance the temperature uniformity at the bottom surface of the heat pipe while an uneven heat source up to 900 W was in contact. The temperature distribution over the bottom surface was monitored at more than twenty six locations. It was found that the operating performance of the sodium heat pipe was critically affected by the inner wall temperature of the condenser region where the working fluid may be changed to a solid phase unless the temperature was higher than its melting point. The maximum temperature difference across the bottom surface was observed to be $114^{\circ}C$ for 850 W thermal load and $100^{\circ}C$ coolant inlet temperature. The effects of fill charge ratio, coolant inlet temperature and operating temperature on thermal performance of heat pipe were analyzed and discussed.

산침지와 가열 살균이 떡볶이 떡의 형상 변화와 품질 특성에 미치는 영향 (Effect of Acid Soaking and Thermal Sterilization on the Shape and Quality Characteristics of Tteokbokki Rice Cake)

  • 정화빈;유채린;박현우;윤원병
    • 한국식품영양학회지
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    • 제31권5호
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    • pp.737-750
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    • 2018
  • Effects of acid soaking (AS) and thermal sterilization (TS) on the shape and quality characteristics of Tteokbokki rice cake (TRC) were investigated. The F-value of a sequential process (SP) of the combination of AS and TS was quantitatively determined with a reference microorganism of Bacillus cereus. F-values were evaluated according to the minimum and the maximum D-value of B. cereus and the reduction exponent (m=12). The heat penetration curves at cold point (CP) of TRC (400 g) were used to estimate the TS time at 121, 100, and $95^{\circ}C$. F-values of the SP were revised according to the adjusted m values after AS at different pH. The non-uniformity parameters (NUP) of TRC had no significant changes during AS but it dramatically increased after applying TS at a low pH by AS. The result of solubilized starch contents (SSC) demonstrated that the shape changes during SP are related to SSC. The texture characteristics and the whiteness were significantly influenced by a low pH condition (3.5) (p<0.05). Sensory analysis showed that a lower pH and a longer thermal processing time influenced negatively on the acceptability. This study showed that pH 4.0 and $95^{\circ}C$ was an optimum condition for the SP.

320×240 적외선 검출기를 이용한 열상센서의 설계 (Thermal imaging sensor design using 320×240 IRFPA)

  • 홍석민;송인섭;김창우;유위경;김현숙
    • 한국광학회지
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    • 제15권5호
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    • pp.423-428
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    • 2004
  • 320${\times}$240 배열의 중적외선 대역(3.7 $\mu\textrm{m}$∼4.8 $\mu\textrm{m}$) MCT(HgCdTe) 검출기를 이용하여 분해능과 신뢰도가 대폭 향상된 소형$.$고성능의 적외선 열상센서를 설계, 제작하였다. 개발된 열상센서는 1∼20배의 고배율 줌 광학계로 설계하고 미세주사 기법을 적용하여 640${\times}$480의 화소를 재현하여 항공기의 항법 보조로부터 표적획득에 이르기까지 다양한 활용이 가능하다. 적용된 적외선 줌 광학계는 릴레이 형태의 재결상계로 설계되었으며 미세주사 장치의 개발로 7.6 cycles/mrad 까지 분해가 가능하며 최저배율에서 40$^{\circ}$${\times}$30$^{\circ}$의 초광각(super wide field of view)의 시계를 갖는다. 또한 불균일 보정기법과 히스토그램 가변방식의 결합을 통한 첨단 열 영상처리 기법을 제안하여 열상센서에 적용함으로써 고성능의 실시간 디지털 영상처리를 가능케 하였다. 본 신호처리기의 개발을 통해 획득된 열영상의 최소분해가능 온도차는 고배율에서 0.05K(@1cycles/mrad) 이하의 우수한 결과를 보였다.

코발트 폴리사이드 게이트전극 형성에 관한 연구 (A Study on the Formation of Cobalt Policide Gate Electrode)

  • 심현상;구본철;정연실;배규식
    • 한국재료학회지
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    • 제8권6호
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    • pp.499-504
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    • 1998
  • 코발트 폴리사이드 게이트 전극을 형성할 때, 원주형(columnar)과 입자형(granular)다결정 Si 및 비정질 Si 기판위에 Co 단일막(Co monolayer)또는 Co/Ti 이중막(Co/Ti bilayer)을 사용하여 형성한 $CoSi_{2}$의 열정안정을 비교하여 기판의 결정성과 CoSi/ sub 2/ 형성방법이 열적안정성에 미치는 영향을 연구하였다.$ 900^{\circ}C$에서 600초까지 급속열처리하였을 때 , 기판을 비정질을 사용하거나 기판에 관계없이 Co/Ti 이중막을 사용하면 열적안정성이 향상되었다, 이는 평탄하고 깨끗한 기판 Si표면과 지연된 Co확산으로 인해,조성이 균일하고 계면이 평탄한 CoSi$_{2}$가 형성되었기 때문이다. $ CoSi_{2}$의 열적안정성에 가장 중요한 인자는 열처리 초기 처음 형성된 실리사이드의 조성 균일성과 기판과의 계면 평탄성이었다.

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