• Title/Summary/Keyword: Thermal Uniformity

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A Study on Correlations of the Gap Ratio of Apartment Houses Arrangement and the Wind Field (공동주택단지배치의 간극비와 바람장의 상관관계에 관한 연구)

  • Moon, Chul-Seong;Oh, Se-Gyu;Cho, Sung-Woo
    • KIEAE Journal
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    • v.11 no.2
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    • pp.75-82
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    • 2011
  • In Korea, the ratio of population in urban areas used to be only 50.1% in 1970, but with the value risen to 90.8% in 2009, urbanization is going on rapidly. Urbanization, which occurs by the rampantly planted buildings, has become major source of raising building density, changing wind direction and reducing wind amount, and such reductions are affecting even inside the building. In each year, among the total energy consumption in Korea, residential portion takes up significant ratio, and specifically the ratio of apartment house is shown to be highest. In order to solve such problem, many studies are being conducted for the improvement of natural ventilation performance. The natural ventilation performance of apartment house are significantly determined by the characteristics of external and internal structure, but in macroscopic perspective, the performance is established fundamentally by the layout characteristics of the main building of the apartment house in preparation for wind conditions. So far researches on raising the thermal comfort through elevation of ventilation performance have been conducted actively, but many of them propose only theoretical concepts deduced through wind path analysis, and do not include any indicator to measure ventilation performance simply only with area data from layout planning stage. Therefore, in this study, gap ratio a wind field measuring indicator was developed, and after the ventilation characteristics by layout types and main building uniformity were identified, the scope of gap ratio efficient for ventilation and that of uniformity were clarified, followed by verification through simulation.

Plasma source ion implantations for shallow $p^+$/n junction

  • Jeonghee Cho;Seuunghee Han;Lee, Yeonhee;Kim, Lk-Kyung;Kim, Gon-Ho;Kim, Young-Woo;Hyuneui Lim;Moojin Suh
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.180-180
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    • 2000
  • Plasma source ion implantation is a new doping technique for the formation of shallow junction with the merits of high dose rate, low-cost and minimal wafer charging damage. In plasma source ion implantation process, the wafer is placed directly in the plasma of the appropriate dopant ions. Negative pulse bias is applied to the wafer, causing the dopant ions to be accelerated toward the wafer and implanted below the surface. In this work, inductively couples plasma was generated by anodized Al antenna that was located inside the vacuum chamber. The outside wall of Al chamber was surrounded by Nd-Fe-B permanent magnets to confine the plasma and to enhance the uniformity. Before implantation, the wafer was pre-sputtered using DC bias of 300B in Ar plasma in order to eliminate the native oxide. After cleaning, B2H6 (5%)/H2 plasma and negative pulse bias of -1kV to 5 kV were used to form shallow p+/n junction at the boron dose of 1$\times$1015 to 5$\times$1016 #/cm2. The as-implanted samples were annealed at 90$0^{\circ}C$, 95$0^{\circ}C$ and 100$0^{\circ}C$during various annealing time with rapid thermal process. After annealing, the sheet resistance and the junction depth were measured with four point probe and secondary ion mass spectroscopy, respectively. The doping uniformity was also investigated. In addition, the electrical characteristics were measured for Schottky diode with a current-voltage meter.

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MIT characteristic of VO2 thin film deposited by ALD using vanadium oxytriisopropoxide precursor and H2O reactant

  • Shin, Changhee;Lee, Namgue;Choi, Hyeongsu;Park, Hyunwoo;Jung, Chanwon;Song, Seokhwi;Yuk, Hyunwoo;Kim, Youngjoon;Kim, Jong-Woo;Kim, Keunsik;Choi, Youngtae;Seo, Hyungtak;Jeon, Hyeongtag
    • Journal of Ceramic Processing Research
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    • v.20 no.5
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    • pp.484-489
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    • 2019
  • VO2 is an attractive candidate as a transition metal oxide switching material as a selection device for reduction of sneak-path current. We demonstrate deposition of nanoscale VO2 thin films via thermal atomic layer deposition (ALD) with H2O reactant. Using this method, we demonstrate VO2 thin films with high-quality characteristics, including crystallinity, reproducibility using X-ray diffraction, and X-ray photoelectron spectroscopy measurement. We also present a method that can increase uniformity and thin film quality by splitting the pulse cycle into two using scanning electron microscope measurement. We demonstrate an ON / OFF ratio of about 40, which is caused by metal insulator transition (MIT) of VO2 thin film. ALD-deposited VO2 films with high film uniformity can be applied to next-generation nonvolatile memory devices with high density due to their metal-insulator transition characteristic with high current density, fast switching speed, and high ON / OFF ratio.

Investigation of the Relationship Between Dishing and Mechanical Stress During CMP Process (수직하중에 의한 응력이 CMP 공정의 디싱에 미치는 영향)

  • Hyeong Gu Kim;Seung Hyun Kim;Min Woo Kim;Ik-Tae Im
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.2
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    • pp.30-34
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    • 2023
  • Since dishing in the CMP process is a major factor that hinders the uniformity of the semiconductor thin film, many studies have focused this issue to improve the non-uniformity of the film due to dishing. In the metal layer, the dishing mainly occurs in the central part of the metal due to a difference in a selection ratio between the metal and the dielectric, thereby generating a step on the surface of the metal layer. Factors that cause dishing include the shape of the thin film, the chemical reaction of the slurry, thermal deformation, and the rotational speed of the pad and head, and dishing occurs due to complex interactions between them. This study analyzed the stress generated on the metal layer surface in the CMP process using ANSYS software, a commercial structure analysis program. The stress caused by the vertical load applied from the pad was analyzed by changing the area density and line width of the dummy metal. As a result of the analysis, the stress in the active region decreased as the pattern density and line width of the dummy metal increased, and it was verified that it was valid compared with the previous study that studied the dishing according to the dummy pattern density and line width of the metal layer. In conclusion, it was confirmed that there is a relationship between dishing and normal stress.

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Instrumentation of a Thermal-Optical Carbon Analyzer and Its Sensitivity in Organic and Elemental Carbon Determination to Analysis Protocols

  • Lim, Ho-Jin;Sung, Su-Hwan;Yi, Sung-Sin;Park, Jun-Hyun
    • Journal of Environmental Science International
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    • v.21 no.1
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    • pp.1-9
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    • 2012
  • A thermal-optical transmittance carbon analyzer has been developed to determine particulate organic (OC) and elemental (EC) carbon. Several analysis factors affecting the sensitivity of OC and EC determination were investigated for the carbon analyzer. Although total carbon (TC) is usually consistent in the determination, OC and EC split is sensitive to adopted analysis protocol. In this study the maximum temperature in oxygen-free He in the analysis was examined as a main cause of the uncertainty. Prior to the sensitivity analysis consistency in OC-EC determination of the carbon analyzer and the uniformity of carbonaceous aerosol loading on a sampled filter were checked to be in acceptable range. EC/TC ratios were slightly decreased with increasing the maximum temperature between $550-800^{\circ}C$. For the increase of maximum temperature from $500^{\circ}C$ to $800^{\circ}C$, the EC/TC ratio was lowered by 4.65-5.61% for TC loading of 13-44 ${\mu}g/cm^2$ with more decrease at higher loading. OC and EC determination was not influenced by trace amount of oxygen in pure He (>99.999%), which is typically used in OC and EC analysis. The facing of sample loaded surface to incident laser beam showed negligible influence in the OC-EC split, but it caused elevated PC fraction in OC for forward facing relative to backward facing.

Temperature distribution in a full-scale steel framed building subject to a natural fire

  • Wald, Frantisek;Chladna, Magdalena;Moore, David;Santiago, Aldina;Lennon, Tom
    • Steel and Composite Structures
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    • v.6 no.2
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    • pp.159-182
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    • 2006
  • Current fire design codes for determining the temperature within the structural elements that form part of a complete building are based on isolated member tests subjected to the standard fire. However, the standard time-temperature response bears little relation to real fires and doesn't include the effects of differing ventilation conditions or the influence of the thermal properties of compartment linings. The degree to which temperature uniformity is present in real compartments is not addressed and direct flame impingement may also have an influence, which is not considered. It is clear that the complex thermal environmental that occurs within a real building subject to a natural fire can only be addressed using realistic full-scale tests. To study global structural and thermal behaviour, a research project was conducted on the eight storey steel frame building at the Building Research Establishment's Cardington laboratory. The fire compartment was 11 m long by 7 m wide. A fire load of $40kg/m^2$ was applied together with 100% of the permanent actions and variable permanent actions and 56% of live actions. This paper summarises the experimental programme and presents the time-temperature development in the fire compartment and in the main supporting structural elements. Comparisons are also made between the test results and the temperatures predicted by the structural fire Eurocodes.

Isothermal Characteristics of a Rectangular Parallelepiped Sodium Heat Pipe

  • Boo Joon Hong;Park Soo Yong
    • Journal of Mechanical Science and Technology
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    • v.19 no.4
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    • pp.1044-1051
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    • 2005
  • The isothermal characteristics of a rectangular parallelepiped sodium heat pipe were inves­tigated for high-temperature applications. The heat pipes was made of stainless steel of which the dimension was $140\;m\;(L)\;{\times}\;95m\;(W)\;{\times}\;46 m\;(H)$ and the thickness of the container was 5 mm. Both inner surfaces of evaporator and condenser were covered with screen meshes to help spread the liquid state working fluid. To provide additional path for the working fluid, a lattice structure covered with screen mesh wick was inserted in the heat pipe. The bottom surface of the heat pipe was heated by an electric heater and the top surface was cooled by circulating coolant. The concern in this study was to enhance the temperature uniformity at the bottom surface of the heat pipe while an uneven heat source up to 900 W was in contact. The temperature distribution over the bottom surface was monitored at more than twenty six locations. It was found that the operating performance of the sodium heat pipe was critically affected by the inner wall temperature of the condenser region where the working fluid may be changed to a solid phase unless the temperature was higher than its melting point. The maximum temperature difference across the bottom surface was observed to be $114^{\circ}C$ for 850 W thermal load and $100^{\circ}C$ coolant inlet temperature. The effects of fill charge ratio, coolant inlet temperature and operating temperature on thermal performance of heat pipe were analyzed and discussed.

Effect of Acid Soaking and Thermal Sterilization on the Shape and Quality Characteristics of Tteokbokki Rice Cake (산침지와 가열 살균이 떡볶이 떡의 형상 변화와 품질 특성에 미치는 영향)

  • Jung, Hwabin;Yu, Chae Rin;Park, Hyeon Woo;Yoon, Won Byong
    • The Korean Journal of Food And Nutrition
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    • v.31 no.5
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    • pp.737-750
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    • 2018
  • Effects of acid soaking (AS) and thermal sterilization (TS) on the shape and quality characteristics of Tteokbokki rice cake (TRC) were investigated. The F-value of a sequential process (SP) of the combination of AS and TS was quantitatively determined with a reference microorganism of Bacillus cereus. F-values were evaluated according to the minimum and the maximum D-value of B. cereus and the reduction exponent (m=12). The heat penetration curves at cold point (CP) of TRC (400 g) were used to estimate the TS time at 121, 100, and $95^{\circ}C$. F-values of the SP were revised according to the adjusted m values after AS at different pH. The non-uniformity parameters (NUP) of TRC had no significant changes during AS but it dramatically increased after applying TS at a low pH by AS. The result of solubilized starch contents (SSC) demonstrated that the shape changes during SP are related to SSC. The texture characteristics and the whiteness were significantly influenced by a low pH condition (3.5) (p<0.05). Sensory analysis showed that a lower pH and a longer thermal processing time influenced negatively on the acceptability. This study showed that pH 4.0 and $95^{\circ}C$ was an optimum condition for the SP.

Thermal imaging sensor design using 320×240 IRFPA (320×240 적외선 검출기를 이용한 열상센서의 설계)

  • Hong Seok Min;Song In Seob;Kim Chang Woo;Yu Wee Kyung;Kim Hyun Sook
    • Korean Journal of Optics and Photonics
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    • v.15 no.5
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    • pp.423-428
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    • 2004
  • The development of a compact and high performance MWIR thermal imaging sensor based on the SOFRADIR 320${\times}$240 element IRCCD detector is described. The sensor has 20 magnification zoom optics with the maximum 40$^{\circ}$${\times}$30$^{\circ}$ of super wide field of view and 7.6 cycles/mrad of resolving power with the operation of attached micro-scanning system. In order to correct nonuniformities of detector arrays, we have proposed a multi-point correction method using defocusing of the optics and we have acquired the highest quality images. The MRTD of our system shows good results below 0.05K at spatial frequency 1 cycles/mrad at narrow field of view. Experimental data and obtained performances are presented and discussed.

A Study on the Formation of Cobalt Policide Gate Electrode (코발트 폴리사이드 게이트전극 형성에 관한 연구)

  • Shim, Hyun-Sang;Koo, Bon-Cheol;Joung, Yeon-Sil;Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.8 no.6
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    • pp.499-504
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    • 1998
  • For the formation of cobalt polycide gate electrode, CoSi, was grown on columnar poly-Si, granular poly-Si or amorphous Si by depositing either Co monolayer or Co/Ti bilayer and its thermal stability was compared to study effects of the substrate crystallinity and the silicide formation method. When specimens were rapidly heat-treated at 90$0^{\circ}C$ up to 600 seconds, using amorphous Si or Co/Ti on all substrates improved the thermal stability. This was attributed to the uniform chemical composition of initial CoSi, and its smooth interface with the substrates, induced by smooth and clean Si surface and delayed Co diffusion. The main factors determining the thermal stability were found to be composition uniformity and smooth interface of $CoSi_2$, intially formed at the early stage of the heat-treatment.

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