• Title/Summary/Keyword: Thermal Stresses Relaxation

Search Result 39, Processing Time 0.021 seconds

Study on Residual Stress in Viscoelastic Thin Film Using Curvature Measurement Method

  • Im, Young-Tae;Park, Seung-Tae;Park, Tae-Sang;Kim, Jae-Hyun
    • Journal of Mechanical Science and Technology
    • /
    • v.18 no.1
    • /
    • pp.12-19
    • /
    • 2004
  • Using LSM (laser scanning method) , the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100$^{\circ}C$ and 20% at 150$^{\circ}C$ for two hours.

Theoretical Study of Design Parameters for the Thermal Stress in Engine Exhaust Manifold (엔진 배기매니폴드의 열응력 발생에 관한 설계 인자들의 이론적 연구)

  • Choi, Bok-Lok
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.6 no.1
    • /
    • pp.50-56
    • /
    • 2007
  • Exhaust manifold is generally subjected to thermal cycle loadings ; at hot condition, large compressive plastic deformations are generated, and at cold condition, tensile stresses are remained in highly deformed critical zones. These phenomena originate from the fact that thermal expansions of the runners are restricted by inlet flange clamped to the cylinder head, because the former is less stiff than the latter and, the temperature of the inlet flange is lower than that of the runners. Since the failure of an exhaust manifold is mainly caused by geometric constraints between the cylinder head and the manifold, the thermal stress can be controlled by geometric factors. The generic geometric factors include the inter distance (2R), the distance from the head to the outlet (L), the tube diameter(d) and the tube thickness (t). This criteria based on elastic analysis up to onset of yield apparently indicate that the pre-stress also reduces the factor; however, high temperature relaxation may reduce this effect at later operation stage.

  • PDF

A Study on Design of Functionally graded Materials (경사기능재료의 설계에 관한 연구)

  • 최덕기;경사기
    • Transactions of the Korean Society of Automotive Engineers
    • /
    • v.6 no.2
    • /
    • pp.144-154
    • /
    • 1998
  • A functionally graded material is a nonhomogeneous material, which is composed of several different materials to maintain structural rigidity and endure high temperature loads. An analytical method is presenter to solve the unsteady heat conduction equation for nonhomogeneous materials. A one-dimensional infinite plate made of functionally graded material is considered. The approximate Green's function solution is derived and to be used to obtain the temperature distribution them the stress distributions may be obtained. The volume fraction, the porosity, the stress difference, and the stress ratio are the design parameters and are to be used to set up a systematic design procedure.

  • PDF

A Effect of Fluid-assisted Sliding on Stress Relaxation of Bi-Te Modules in Thermoelectric Generation System (열전발전용 Bi-Te module에서 미끄럼에 따른 열응력 완화 특성)

  • 서창민;우병철
    • Journal of Ocean Engineering and Technology
    • /
    • v.14 no.4
    • /
    • pp.62-97
    • /
    • 2000
  • Recently the research for utilization of waste heat produced from electric power plants, casting factories, heat treating factories or commercial are being afforded by the need for energy saving. The objective of this study is to develop a thermoelectric generation system which unused energy from close-at-hand sources such as garbage incineration heat and industrial exhaust etc. into electricity. This paper a thermoelectric technology on a optimum system design method and efficiency and cost effective thermoelectric element on order to extract the maximum power output from energy conversion of waste energy. It is shown that the longitudinal stresses of module contacted with two point constrained Al tubes could be released more than those with a one-point constrained.

  • PDF

A Characteristic of Fluid-Assisted Sliding on Stress Relaxation of Bi-Te Modules in Thermoelectric Generation System (열전발전용 Bi-Te Module에서 미끄럼에 따른 열응력 완화 특성)

  • 우병철;이희웅
    • The Transactions of the Korean Institute of Electrical Engineers C
    • /
    • v.52 no.1
    • /
    • pp.12-18
    • /
    • 2003
  • Recently the research for utilization of waste heat produced from electric power plants, casting factories, heat treating factories or commercial building are being afforded by the need for energy saving. The objective of this study is to develop a thermoelectric generation system which converts unused energy from close-at-hand sources such as garbage incineration heat and industrial exhaust etc. into electricity. This paper presents a thermoelectric technology on a optimum system design method and efficiency and cost effective thermoelectric element on order to extract the maximum power output from energy conversion of waste energy. It is shown that the longitudinal stresses of module contacted with two point constrained AI tubes could be released more than those with a one-point constrained.

Failure simulation of nuclear pressure vessel under LBLOCA scenarios

  • Eui-Kyun Park;Jun-Won Park;Yun-Jae Kim;Kukhee Lim;Eung-Soo Kim
    • Nuclear Engineering and Technology
    • /
    • v.56 no.7
    • /
    • pp.2859-2874
    • /
    • 2024
  • This paper presents the finite element deformation and failure simulation of a typical Korean high-power reactor vessel under a severe accident characterized by large break loss of coolant (LBLOCA) with in-vessel retention of molten corium through external reactor vessel cooling (IVR-ERVC) conditions. Temperature distributions calculated using Modular Accident Analysis Program Version 5 (MAAP5) as thermal boundary conditions were used, and ABAQUS thermal and structural analyses were performed. After full ablation, the temperature of the inner surface in the thinnest section remained high (920 ℃), but the stress remained relatively low (less than 6 MPa). At the outer surface, the stress was as high as 250 MPa; however, the resulting plastic strain was small owing to the low temperature of 200 ℃. Variations in stress, inelastic strain, and temperature with time in the thinnest section suggest that the plastic and creep strains are saturated owing to stress relaxation, resulting in low cumulative damage. Thus, the lower head of the vessel can maintain its structural integrity under LBLOCA with IVR-ERVC conditions. The sensitivity analysis of internal pressure indicates the occurrence of failure in the thinnest section at an internal pressure >9.6 MPa via local necking followed by failure due to high stresses.

A Study on High Temperature Creep and Stress Relaxation Properties of Zr-4 (Zr-4의 고온 크리프 및 응력이완 특성에 관한 연구)

  • Oh, Sea-Kyoo;Park, Chung-Bae;Han, Sang-Deok
    • Journal of the Korean Society of Fisheries and Ocean Technology
    • /
    • v.28 no.1
    • /
    • pp.71-78
    • /
    • 1992
  • Zr-4 used for a cladding and an end plug of reactor component has creep deformation under operation at high temperature. Creep is regarded as the time dependent deformation of a material under constant applied stress. Although the major source of the deformation of zirconium component in water-cooled reactors is irradiation creep, the thermal creep may give a rise to significant deformation in reactor component especially at relatively high temperatures and at various constant stresses, and therefore it must be predicted accurately. Stress relaxation is the time dependent change of stress at constant strain and it is a process related intimately to creep. In this paper, the creep behavior and stress relaxation of Zr-4 is examined at the temperature of 50$0^{\circ}C$ that is 40% of the absolute melting temperature of Zr-4 under the stress below yield stress and under the various constant strains. The results obtained are summarized as follows: 1) With an increase of stress, the steady state creep rate increases and the creep rupture time decreases. 2) The steady state creep rate $\varepsilon$(%/s) for the stress $\sigma$sub(c) (kgf/mm super(2)) of Zr-4 increases outstandingly. All the empirical equations computed for Zr-4 increases outstandingly. All the empirical equations computed for Zr-4 are in accord with Norton's model equation($\varepsilon$=K$\sigma$ sub(c) super (n)). The constants of materials computed are as follows: K=3.9881$\times$10 super(-5), n=1.9608 3) The rupture time T sub(r) (hr) decreases linearly with the increase of stress on the log-log scaled graph. The empirical equations computed for Zr-4 are in accord with Bailey's model equation (T sub(r)=K sub(1)$\sigma$sub(c) super(m)). The constants of materials computed are as follows: K sub(1)=1.2875$\times$10 super(16), m=-3.467 4) It seems clear that the strain could be quantitatively dependent on the high temperature creep properties such as creep stress, rupture time, steady state creep rate and total creep rate. It is found that these relationships are linear on the log-log graph. 5) In stress relaxation test, as the critical constant strain that can be allowed to the specimen is larger, stress relaxation becomes more rapid, and as the constant strain is smaller, the stress relaxation becomes slower.

  • PDF

A study of life predictions on very high temperture thermal stress (고온분위기에서 열응력을 받는 부재의 수명예측에 관한 연구)

  • 김성청
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.7 no.6
    • /
    • pp.117-125
    • /
    • 1998
  • The paper attempts to estimate the incubation time of a cavity in the interface between a power law creep particle and an elastic matrix subjected to a uniaxial stress. Since the power law creep particle is time dependent, the stresses in the interface relax. The volume free energy associated with Helmholtz free energy includes strain energies caused by applied stress and dislocations piled up in interface(DPI). The energy due to DPI is found by modifying the result of Dundurs and Mura[4]. The volume free energies caused by both applied stress and DPI are a function of the cavity size(r) and elapsed time(t) and arise from stress relaxation in the interface. Critical radius $r^*$ and incubation time $t^*$ to maximise Helmholtz free energy is found in present analysis. Also, kinetics of cavity formation are investigated using the results obtained by Riede [7]. The incubation time is defined in the analysis as the time required to satisfy both the thermodynamic and kinetic conditions. Through the analysis it is found that 1) strain energy caused by the applied stress does not contribute significantly to the thermodynamic and kinetic conditions of a cavity formation, 2) in order to satisfy both thermodynamic and kinetic conditions, critical radius $r^*$ decreases or holds constant with increase of the time until the kinetic condition(eq. 2.3) is satisfied. there for the cavity may not grow right after it is formed, as postulated by Harris [15], and Ishida and Mclean [16], 3) the effects of strain rate exponent (m), material constant $\sigma$0, volume fraction of the particle to matrix(f)and particle size on the incubation time are estimated using material constants of the copper as matrix.

  • PDF

Bond Strength of Wafer Stack Including Inorganic and Organic Thin Films (무기 및 유기 박막을 포함하는 웨이퍼 적층 구조의 본딩 결합력)

  • Kwon, Yongchai;Seok, Jongwon
    • Korean Chemical Engineering Research
    • /
    • v.46 no.3
    • /
    • pp.619-625
    • /
    • 2008
  • The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.