• KIEAE Journal
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• 제15권5호
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• pp.95-105
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• 2015

Purpose: This paper presents a framework development for BIM (Building Information Modeling)-based OOPM (Object-Oriented Physical Modeling) for Building Thermal Simulation. The framework facilitates decision-making in the design process by integrating two object-oriented modeling approaches (BIM and OOPM) and efficiently providing object-based thermal simulation results into the BIM environment. Method: The framework consists of a system interface between BIM and OOPM-based building energy modeling (BEM) and the visualization of simulation results for building designers. The interface enables a BIM models to be translated into OOPM-based BEM automatically and the thermal simulation from the created BEM model immediately. The visualization module enables the simulation results to be presented in BIM for building designers to comprehend the relationships between design decisions and the building performances. For the framework implementation, we utilized the Modelica Buildings Library developed by the Lawrence Berkeley National Laboratory as a thermal simulation solver. We also conducted an experiment to validate the framework simulation results and demonstrate our framework. Result: This paper demonstrates a new methodology to integrate BIM and OOPM-based BEM for building thermal simulation, which enables an automatic translation BIM into OOPM-based BEM with high efficiency and accuracy.

• 한국태양에너지학회 논문집
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• 제29권6호
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• pp.45-55
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• 2009

Deterioration of the outdoor thermal environment in urban areas has become worse and worse due to the urbanization and overpopulation, etc. Most of existing researches about thermal environment are focused on the indoor environment in which the radiation heat exchange is relatively constant. However, the outdoor thermal environment is changed with time passages, because the thermal environment is highly effected by solar radiation. Thus, to simulate the outdoor thermal environment with accuracy, the solar radiation calculation should be considered, and the radiation heat exchange between building surface and ground surface should be calculated. The purpose of this study is to develop the simulator that can be possible to evaluate the outdoor thermal environment and pedestrian thermal comfort. In this paper, a new method which is coupled with convective heat transfer simulation and radiative heat transfer simulation will be proposed. And the coupled simulation method will be described through case study for outdoor thermal environment. From the results of simulation, the coupled simulation proposed in this study can assess the outdoor thermal environment with accuracy.

• KEPCO Journal on Electric Power and Energy
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• 제1권1호
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• pp.145-150
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• 2015

This paper described the medium voltage high temperature superconducting cable thermal simulation and its application. New simulation method for HTS cable modeling using PSCAD/EMTDC is introduced in this paper. The developed simulation method consists of electrical model part and thermal model part. In electrical model part, power loss and thermal capacitance can be calculated in each layer, then the temperature of each layer can be calculated by power loss and thermal capacitance in thermal model part. This paper also analyzes the electrical and thermal characteristic in the case of normal operating condition and transient including single line to ground fault and line to line ground fault using new simulation method.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2008년 영문 학술대회
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• pp.751-755
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• 2008

During the rapid startup transient of a centrifugal pump, in order to investigate its transient characteristics, the torque equations are deduced. Based on these equations, numerical simulation is carried out with the Large Eddy Simulation(LES) method and UDFs(User Defined Functions) are applied during the simulation. Comparison between simulation and experiment results of pump heads and rotational speed shows that they are in good agreement, indicating that the dynamic characteristics of this pump can be predicted accurate comparatively through simulation with LES method during its startup process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.567-570
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. the thermal analysis for the proposed planar structure including temperature distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of an actual device to investigate the acceptability of the computer simulation.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2000년도 추계학술대회 논문집
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• pp.84-89
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• 2000

Thermal simulation of typical stack-type and newly proposed planar-type micro-gas sensors were studied by FEM method. The thermal analyses for the proposed planar structure including temperatur distribution over the sensing layer and power consumption of the heater were carried using finite element method by computer simulation and well compared with those of typical stack-type micro-gas sensor. The thermal properties of the microsensor from thermal simulation were compared with those of a actual device to investigate the acceptability of the computer simulation.

• 한국화재소방학회논문지
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• 제10권2호
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

• KIEAE Journal
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• 제15권4호
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• pp.5-11
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• 2015

Purpose: Recently, renewable energy system has been widely used to reduce the energy consumption and CO2 emission of building. A photovoltaic/thermal(PVT) system is a kind of efficient energy uses, which is combined with photovoltaic module and solar thermal collector. PVT system removes heat from PV module by through thermal fluid to raise the performance efficiency of the PV system. However, though PVT system has the merit of the improved efficiency in theoretical approach, there have been few performance analysis for PVT system using the dynamic energy simulation. In this study, in order to establish the optimum design method of this system, simulation was conducted by using individual system modules. Method: For the dynamic simulation, TRNSYS17 was used and local weather data was utilized. Furthermore, the system performance in various installation condition was calculated by case studies. Result: As a result, the amount of electric generation and heat production in each case was found by the simulation. The gap of system performance was also evident according to the installation condition.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.1115-1117
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• 2005

This paper describes the three dimension model and simulation results of a thermal actuator based on polyMUMPs process, known as thermal multimorph actuator. The device has potential application in micro-transducers such as atomic force microscope (AFM) tip and scanning tunneling microscope (STM) tip. This device made of a multi-layer materials stack together with consisted of polysilicon, $SiO_2$ and gold. A mask layout design, three dimension model and simulation results are reported and discussed.

• 한국해양공학회지
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• 제22권6호
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• pp.27-34
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• 2008

The temperature distribution in the weldment is not uniform because a weldment is locally heated. Thermal plastic deformation results from the local expansion and shrinkage by the heating and cooling of metal. Therefore, residual stresses and distortion occur in the weldment. In this study, we had conducted on the weld thermal cycle simulation that is supposed as the HAZ on SS400 steel and STS304 steel. The residual stresses that were obtained from the drawing and the weld thermal cycle simulation were estimated by X-ray diffraction. We also carried out ultrasonic test for the weld thermal cycle simulated specimens, and then conducted on nondestructive evaluation by the ultrasonic parameters obtained ultrasonic test. From the results, residual stresses of weld thermal cycle simulated specimens after the residual stress removal heat treatment are lower than that of the drawing.