• Title/Summary/Keyword: Thermal Sensor

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Design of Thermal Displacement Compensation Sensor for High Reliability Machine Tools (고신뢰 머시닝센터를 위한 열변위 보상 센서 설계기술)

  • Kim, Il-Hae;Jang, Dong-Young;Park, Jeong-Hoon;Park, Sung-Wook;Shim, Poong-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.28 no.8
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    • pp.886-893
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    • 2011
  • To increase the reliability and positional accuracy of a machine tool, a novel capacitive displacement sensor having a cylindrical shape is presented to measure the axial displacement of a machine tool spindle. Characteristics of the sensor were analyzed by numerical simulation. The sensor was built into a specific machine tool spindle and its performance was experimentally investigated. The accuracy of a thermal error compensation system of a machine tool can be enhanced greatly using proposed sensor.

Development of a New Sensor with Divided Multiple Long and Short Wires in Transient Hot-wire Technique (다수의 분할된 긴 열선과 짧은 열선을 갖는 새로운 비정상열선법 센서개발)

  • Lee, Shin-Pyo;Lee, Myung-Hoon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.28 no.5
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    • pp.510-517
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    • 2004
  • A fine hot-wire is used both as a heating element and a temperature sensor in transient hot-wire method. The traditional sensor system is unnecessarily big so that it takes large fluid volume to measure the thermal conductivity. To dramatically reduce this fluid volume, a new sensor fabrication and a data processing method are proposed in this article. Contrast to the conventional and most popular two wire sensor, the new sensor system is made up of divided multiple long and short wires. Through validation experiments, it is found that the measured thermal conductivities of the glycerin are exactly same each other between the conventional and proposed new method. Also some technical considerations in arranging the multiple wires are briefly discussed.

Development of a New Sensor and Data Processing Method in Transient Hot-wire Technique for Nanofluid (나노유체의 열전도율 측정을 위한 새로운 비정상열선법 센서설계와 자료처리방법)

  • Lee, Shin-Pyo;Lee, Myung-Hoon;Kim, Min-Tae;Oh, Je-Myung
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.210-215
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    • 2003
  • A fine hot-wire is used both as a heating element and a temperature sensor in transient hot-wire method. The traditional sensor system is unnecessarily big so that it takes large fluid volume to measure the thermal conductivity. To dramatically reduce this fluid volume, a new sensor fabrication and a data processing method are proposed in this article. Contrast to the conventional and most popular two wire sensor, the new sensor system is made up of divided multiple long and short wires. Through validation experiments, it is found that the measured thermal conductivities of the glycerin are exactly same each other between the conventional and proposed new method. Also some technical considerations in arranging the multiple wires are briefly discussed.

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A Study on Geothermal Evaluation of Alluvium and Riverbed using Thermal Line Temperature Monitoring (다중 온도 모니터링을 통한 충적층 및 하상의 지열특성 평가 연구)

  • Jung, Woo-Sung;Kim, Hyoung-Soo;Park, Dong-Soon;Ahn, Young-Sub
    • Proceedings of the Korean Geotechical Society Conference
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    • 2006.03a
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    • pp.171-178
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    • 2006
  • In advanced countries, state-of-the-art temperature monitoring technique is widely used for effective use of geothermal resources. But these kind of modern tools such as Thermal Line Sensor has not been applied to find geothermal characteristics of alluvium and riverbed in domestic area. In this research, state-of-the-art thermal line temperature sensor monitoring was introduced. And long term field test using this type of sensor was performed to find geothermal characteristics of alluvium and riverbed and evaluate the availability for heat energy source. As a result, temperature monitoring technique through thermal line sensor was very effective to obtain basic geothermal information of alluvium deposit and riverbed. Also, it was found that the groundwater temperature phase showed its potential of utilization as a energy source of heat pump. It is estimated that further study shows a specific corelation between temperature monitoring data and its availability as a energy source.

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Development of the Ubiquitous Thermal Sensor Unit for Transformers (유비쿼터스형 변압기 권선온도 측정장치 개발)

  • Kim, Il-Kwon;Cho, Hyun-Kyung;Lee, Dong-Zoon;Kim, Young-Il
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1427_1428
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    • 2009
  • In this paper, we designed and fabricated the ubiquitous thermal sensor unit for high voltage facilities. This sensor unit generates electric power from a current transformer which was mounted in the high voltage wires and transmitted thermal data by using a Zigbee module. We simulated the high voltage facilities that temperature was going up to $80^{\circ}C$ gradually. From the experimental results, it was confirmed that sensibility of the ubiquitous thermal sensor unit is in ranges from $-0.7^{\circ}C$ to $0.3^{\circ}C$.

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Thermal Behaviors Analysis for SOI Wafers (SOI 웨이퍼의 열적거동 해석)

  • 김옥삼
    • Proceedings of the Korean Society of Marine Engineers Conference
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    • 2000.05a
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    • pp.105-109
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    • 2000
  • Micronization of sensor is a trend of the silicon sensor development with regard to a piezoresistive silicon pressure sensor the size of the pressure sensor diaphragm have become smaller year by year and a microaccelerometer with a size less than 200-300${\mu}m$ has been realized. In this paper we study some of the micromachining processes of SOI(silicon on insulator)for the microaccelerometer and their subsequent processes which might affect thermal loads. The finite element method(FEM) has been a standard numerical modeling technique extensively utilized in structural engineering discipline for design of SOI wafers. Successful thermal behaviors analysis and design of the SOI wafers based on the tunneling current concept using SOI wafer depend on the knowledge abut normal mechanical properties of the SCS(single crystal silicon)layer and their control through manufacturing process

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The Research of the HERO Test and Evaluation Technique (HERO 시험평가 기법 연구)

  • Shin, Seung-Je
    • Journal of the Korea Institute of Military Science and Technology
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    • v.10 no.2
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    • pp.76-83
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    • 2007
  • This report presents the test technique using optic thermal sensor for the HERO evaluation of equipment installed EED. The calibration method of EED-thermal sensor assembly is explained by relation between the current in bridge wire and voltage in thermal sensor. And the HERO test and evaluation method is indicated based on MIL-STD-464A and MIL-STD-331C. The safety and reliability levels of EED-thermal sensor assembly are evaluated when exposed in the electromagnetic environment.

A Study on the Comparison between an Optical Fiber and a Thermal Sensor Cable for Temperature Monitoring (온도 모니터링을 위한 광섬유 센서와 온도센서 배열 케이블의 비교 연구)

  • Kim, Jung-Yul;Song, Yoon-Ho;Kim, Yoo-Sung
    • Journal of the Korean Geotechnical Society
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    • v.23 no.4
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    • pp.15-24
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    • 2007
  • Two kinds of temperature monitoring technology have been introduced in this study, which can measure coincidently temperatures at many points along a single length of cable. One is to use a thermal sensor cable comprizing of addressable thermal sensors. The other is to use an optic fiber sensor with Distributed Temperature Sensing (DTS) system. The differences between two technologies can be summarized as follows: A thermal sensor cable has a concept of "point sensing" that can measure temperature only at a predefined position. The accuracy and resolution of temperature measurement are up to the capability of the individual thermal sensor. On the other hand, an optic fiber sensor has a concept of "distributed sensing" because temperature is measured practically at all points along the fiber optic cable by analysing the intensity of Raman back-scattering when a laser pulse travels along the fiber. Thus, the temperature resolution depends on the measuring distance, measuring time and spatial resolution. The purpose of this study is to investigate the applicability of two different temperature monitoring techniques in technical and economical sense. To this end, diverse experiments with two techniques were performed and two techniques are applied under the same condition. Considering the results, the thermal sensor cable will be well applicable to the assessment of groundwater flow, geothermal distribution and grouting efficiency within about loom distance, and the optic fiber sensor will be suitable for long distance such as pipe line inspection, tunnel fire detection and power line monitoring etc.

Electrical modelling for thermal behavior and gas response of combustible catalytic sensor (접촉연소식 센서의 열 특성 및 가스반응의 모델링)

  • Lee, Sang-Mun;Song, Kap-Duk;Joo, Byung-Su;Lee, Yun-Su;Lee, Duk-Dong
    • Journal of Sensor Science and Technology
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    • v.15 no.1
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    • pp.34-39
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    • 2006
  • This study provides the electrical model of combustible catalytic gas sensor. Physical characteristics such as thermal behavior, resistance change were included in this model. The finite element method analysis for sensor device structure showed that the thermal behavior of sensor is expressed in a simple electrical equivalent circuit that consists of a resistor, a capacitor and a current source. This thermal equivalent circuit interfaces with real electrical circuit using two parts. One is 'power to heat' converter. The other is temperature dependent variable resistor. These parts realized with the analog behavior devices of the SPICE library. The gas response tendency was represented from the mass transferring limitation theory and the combustion theory. In this model, Gas concentration that is expressed in voltage at the model, is converted to heat and is flowed to the thermal equivalent circuit. This model is tested in several circuit simulations. The resistance change of device, the delay time due to thermal capacity, the gas responses output voltage that are calculated from SPICE simulations correspond well to real results from measuring in electrical circuits. Also good simulation result can be produced in the more complicated circuit that includes amplifier, bios circiut, buffer part.