• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1542-1547
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• 2007

Laser surface treatment technologies have been used to improve characteristics of wear and to enhance the fatigue resistance for mold parts. The optical lens with the elliptical profile is designed to obtain a wide surface hardening area with a uniform hardness. The objective of this research work is to investigate the influence of the process parameters, such as power of laser and defocused spot position, on the characteristics of laser surface treatment for the case of SKD61 steel and SCM4 steel. From the results of the experiments, it has been shown that the maximum average hardness is approximatly 700${\sim}$780 Hv when the power, focal position and the travel of laser are 1,095 W, 0mm and 0.3 m/min, respectively. In samples treated with lower scanning speeds, some small carbide particles appear in the interdendritic regions. This region contains fine martensite and carbide in proportions which depend on the local thermal cycle.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.4
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• pp.165-172
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• 2008

Urea-SCR, the selective catalytic reduction using urea as reducing agent, has been investigated for about 10 years in detail and today is a well established technique for deNOx of stationary diesel engines. In the case of the SCR-catalyst a non-uniform velocity and $NH_3$ profile will cause an inhomogeneous conversion of the reducing agent $NH_3$, resulting in a local breakthrough of $NH_3$ or increasing NOx emissions. Therefore, this work investigates the effect of flow and $NH_3$ non-uniformities on the deNOx performance and $NH_3$ slip in a Urea-SCR exhaust system. From the results of this study, it is found that flow and $NH_3$ distribution within SCR monolith is strongly related with deNOx performance of SCR catalyst. It is also found that multi-hole injector shows better $NH_3$ uniformity at the face of SCR monolith face than one hole injector.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1010-1013
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• 2001

Zinc oxide(ZnO) films were prepared by ultrasonic spray pyrolysis on indium (In) films deposited by evaporation and subsequently submitted to rapid thermal annealing (RTA). The RTA was processed in air or a vacuum ambient. The crystallographic properties and surface morphologies of the films were characterized before and after the RTA by X-ray diffraction (XRD) and scanning electron microscopy(SEM), respectively. The resistivity variation of the films with RTA temperature and time was measured by the 4-point probe method. Auger electron spectroscopy(AES) was carried out to figure out the distribution of indium atoms in the ZnO films. The resistivity of the ZnO on In(ZnO/In) films decreased to 2${\times}$10$\^$-3/ $\Omega$cm by diffusion of the In. The In diffusion into the ZnO films roughened the surface of the ZnO films. The results of depth profile by AES showed a hump of In atoms around ZnO/In interface after the RTA at 800$^{\circ}C$, which disappeared by the RTA at 1000$^{\circ}C$. The effects of temperature, time and ambient during the RTA on the structural and electrical properties of the ZnO/In films were discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.10
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• pp.828-834
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• 2001

Zinc oxide (ZnO) films deposited on indium (In) films were post-annealed in a rapid thermal anealing (RTA) system. The ZnO/In films were RTA-treated in air or a vacuum ambient. The crystallographic properties and surface morphologies of the films were studied before and after the RTA by X-ray diffraction(XRD) and scanning electron microscopy (SEM), respectively. The resistivity variation of the films with RTA temperature and time was measured by the 4-point probe method. Auger electron spectroscopy (AES) was carried out to figure out the redistribution of indium atoms in the ZnO films. The resistivity of the ZnO/In films decreased to 2$\times$10$\^$-3/ Ωcm by diffusion of the In. The In diffusion into the ZnO films roughened the surface of ZnO films. The results of depth profile by AES showed a hump of In atoms around ZnO/In interface after the RTA at 800 $\^{C}$. The effects of temperature time and ambient during the RTA on the structural and electrical properties of the ZnO/In films were discussed.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.1-9
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• 2003

Epoxy-amine liquid prepolymers are extensively applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. Overall performances of such systems depend on the created interphase between the organic layer and the substrate. When epoxy-amine liquid mixtures are applied onto more or less hydrated metallic oxide layer, concomitant amine chemical sorption and hydroxide dissolution appear lending to the chelate formation. As soon as the chelate concentration is higher than the solubility product, these species crystallize as sharp needles. Moreover, intrinsic and thermal residual stresses are developed within painted or bonded systems. When residual stresses are higher than the organic layer/substrate adhesion, buckling, blistering, debonding may occur leading to a catastrophic drop of system performances. Practical adhesion can be evaluated with either ultimate parameters (Fmax or Dmax) or the critical strain energy release rate, using the three point flexure test (ISO 14679-1997). We observe that, for the same system, the ultimate load decreases while residual stresses increase when the liquid/solid time increases. Ultimate loads and residual stresses depend on the metallic surface treatment. For these systems, the critical strain energy release rate which takes into account the residual stress profile and the Young's modulus gradient remains quite constant whatever the metallic surface treatment was. These variations will be discussed and correlate to the formation mechanisms of the interphase.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.4
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• pp.154-160
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• 2005

We have investigated thermal properties showed by changing the content of carbon black which is the component parts of semiconductive shield in underground power transmission cable. Specimens were made of sheet with the nine of those for measurement. Density of specimens was measured by density meter, and then stress-strain of specimens was measured by TENSOMETER 2000. A speed of measurement was 200[mm/min], ranges of stress and strain were 400(Kgf/$cm^2$) and 600[$\%$]. In addition, tests of stress-strain were progressed by aging specimens at air oven. Finally surface profile was shown in order to looking for protrusion of specimens by using smoothness tester. Density was highly measured according to increasing the content of carbon black from this experimental result, and stress was decreased, while strain was increased according to increasing the content of carbon black. And stress-strain were decreased some after aging because of oxidation reaction of chemical defect. Lastly surface of specimens smoothed generally.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.252-252
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• 2008

The microhotplates consisting of a Pt-ased heating element on AlN/poly 3C-SiC layers were fabricated. The microhotplate has a $600{\mu}m{\times}600{\mu}m$ square shaped membrane which made of $1{\mu}m$ thick ploycrystalline 3C-SiC suspended by four legs. 3C-SiC is known for excellent chemical durability, mechanical strength and sustaining of high temperature. The membrane is fabricated by surface micromachining using oxidized Si sacrificial layer. The Pt thin film is used for heating material and resist temperature sensor. The fabrication methodology allows intergration of an array of heating material and resist temperature detector. For reasons of a short response time and a high sensitivity a uniform temperature profile is desired. The dissipation of microhotplate was examined by a IR thermoviewer and the power consumption was measured. Measured and simulated results are compared and analyzed. Thermal characterization of the microhotplates shows that significant reduction in power consumption was achieved using suspended structure.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.25-35
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• 1999

LTCC (Low Temperature Cofired Ceramic) or LTCC-M (Low Temperature Cofired ceramic on Metal) technology is one of MCM-C (Multichip Module on Ceramic) technologies and becomes to be widely used in consumer, RF and automotive electronics. As green sheets for LTCC are cofired below $1000^{\circ}C$ in comparison with those for HTCC (High Temperature Cofired Ceramic), high conductivity metal traces such as gold, silver and copper can be used. The dimensional stability in LTCC-M technology enables embedded passives to be integrated inside modules, which enhances the electrical performance and increases the reliability of the modules. Coefficient of thermal expansion and dielectric constant can be controlled by changing composition and heating profile for cofiring. In this technical review, LTCC and LTCC-M technologies are introduced and advantages of those technologies are explained.

• International Journal of Fluid Machinery and Systems
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• v.5 no.2
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• pp.91-99
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• 2012

The Fighter aircraft transmission system consists of a light weight, High Speed Flexible Coupling (HSFC) known as Power Take-Off shaft (PTO) for connecting Engine gearbox (EGB) with Accessory Gear Box (AGB). The HSFC transmits the power through series of specially contoured metallic annular thin flexible plates whose planes are normal to the torque axis. The HSFC operates at high speed ranging from 10,000 to 18,000 rpm. The HSFC is also catered for accommodating larger lateral and axial misalignment resulting from differential thermal expansion of the aircraft engine and mounting arrangement. The contoured titanium alloy flexible plates are designed with a thin cross sectional profile to accommodate axial and parallel misalignment by the elastic material flexure. This paper investigates the effect of misalignment on the transmission characteristics of the HSFC couplings. A mathematical model for the HSFC coupling with misalignment has been developed for analyzing the torque transmission and force interaction characteristics. An extensive testing has been conducted for validating characteristics of the designed coupling under various misalignment conditions. With this the suitability of the model adapted for the design iteration of HSFC development is validated. This method will reduce the design iteration cycles of HSFC and can be extended for the similar development of flexible couplings.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.6
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• pp.37-45
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• 1998

In this paper, we report the first three-dimensional simulation result of the transient enhanced diffusion(TED) of dopants in the ion-implanted silicon by employing our 3D semiconductor process simulator, INPROS system. In order to simulate three-dimensional TED redistribution of dopants in silicon, the dopant distributions after the ion implantation was calculated by Monte Carlo(MC) method, followed by finite element(FE) numerical solver for thermal annealing. Excellent agreement between the simulated 3D profile and the SIMS data has been obtained for ion-implanted arsenic and phosphorus after annealing the boron marker layer at 75$0^{\circ}C$ for 2 hours. Our three-dimensional TED simulation could successfully explain the reverse short channel effect(RSCE) by taking the 3D point defect distribution into account. A coupled TED simulation and device simulation allows reverse short channel effect on threshold to be accurately predicted.