• Tunnel and Underground Space
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• v.24 no.3
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• pp.224-233
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• 2014

It is well known that rock properties can be affected by loading in underground condition. In the case of flooded underground mine or tunnels, rock properties variation due to loading might be different from the loading in dry condition. In order to verify the influence of saturated loading condition on rock properties, various laboratory tests had been carried out. Loading on the rock specimen was controlled to be ranged in between 20 ~ 80% of UCS. By comparing the variation of thermal, mechanical, and physical properties of rock specimens under the same load in saturated and dry condition, it was possible to find that the rock properties can be more significantly disturbed in the saturated loading condition than in dry loading condition.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2006.04a
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• pp.820-827
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• 2006

The convection heat transfer coefficients on the top surface of a large liquid petroleum liquid injection(LPLi) engine piston are analyzed by solving an inverse thermal conduction problem. The heat transfer coefficients are numerically found so that the difference between analyzed temperatures from the finite element method and measured temperatures is minimized. Using the resulting heat transfer coefficients as the boundary condition, temperature of a large LPLi engine piston is analyzed.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.68-77
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• 2003

It is important to understand the characteristics of material strength and fracture under the dynamic loading like as earthquakes to assure the integrity of welded structures. The characteristics of dynamic strength and fracture in structural steels and their welded joints should be evaluated based on the effects of the strain rate and the service temperature. It is difficult to predict or measure temperature rise history with the corresponding stress-strain behavior. In particular, material behaviors beyond the uniform elongation can not be precisely evaluated, though the behavior at large strain region after the maximum loading point is much important for the evaluation of fracture. In this paper, the coupling phenomena of temperature and stress-strain fields under the dynamic loading was simulated by using the finite element method. The modified rate-temperature parameter was defined by accounting for the effect of temperature rise under the dynamic deformation, and it was applied to the fully-coupled analysis between heat conduction and thermal elastic-plastic behavior. Temperature rise and stress-strain behavior including complicated phenomena were studies after the maximum loading point in structural steels and their undermatched joints and compared with the measured values.

• Journal of the Korean Society of Safety
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• v.18 no.4
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• pp.39-43
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• 2003

An experimental study was conducted to develop and understanding of fracture behavior of ceramic thermal barrier coating when subjected to a thermal shock loading. The thermal loading was applied using a 1.5kW $CO_2$ laser. In the experiments, beam-shaped specimens were subjected to a high heat flux for 4sec and cooling of 7sec in air. The interface crack length was increased as the crack density, the surface pre-crack legth and the coating thickness were increased. The center surface crack length was increased as the maximum surface temperature got higher and the surface pre-crack length for shorter.

• Structural Engineering and Mechanics
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• v.87 no.1
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• pp.29-46
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• 2023

Critical thermal buckling of functionally graded porous (FGP) sandwich plates under various types of thermal loading is considered. It is assumed that the mechanical and thermal nonhomogeneous properties of FGP sandwich plate vary smoothly by distribution of power law across the thickness of sandwich plate. In this paper, porosity defects are modeled as stiffness reduction criteria and included in the rule of mixture. The thermal environments are considered as uniform, linear and nonlinear temperature rises. The critical buckling temperature response of FGM sandwich plates has been analyzed under various boundary conditions. By comparing several numerical examples with the reference solutions, the results indicate that the present analysis has good accuracy and rapid convergence. Further, the effects of various parameters like distribution shape of porosity, sandwich combinations, aspect ratio, thickness ratio, boundary conditions on critical buckling temperature of FGP sandwich plate have been studied in this paper.

• Journal of the Korean Applied Science and Technology
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• v.24 no.4
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• pp.416-426
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• 2007

Polypropylene (PP) composites with wood flour/wax/coupling agent were manufactured by melt compounding and injection molding. The influence of wood flour(WF), wax, and coupling agent on the mechanical and thermal properties of the composites was investigated. The addition of wood flour to neat PP has the higher tensile modulus and strength compared with neat PP. The presence of wax also improved the tensile modulus. At the same loading of PP and WF, the addition of coupling agent highly decreased the tensile modulus, and increased the tensile strength. From thermogravimetric analysis (TGA), the addition of wax improved the thermal stability of the composites in the later stages of degradation. The presence of MAPP and wood flour in turn decreased thermal stabilities of composites. From differential scanning calorimetry analysis (DSC), neither the loading of wax. nor the presence of MAPP has shown significant effect on the thermal transition of composites.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.131-134
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• 2000

Increased temperature adversely affects the reliability of a device. So, package material should have high thermal diffusion, i.e., high thermal conductivity. And, there are several other physical properties of polymeric materials that are important to microelectronics packaging, some of which are a low dielectric constant, a low coefficient of thermal expansion (CTE), and a high flexural strength. In this study, to get practical maximum packing fraction of AIN (granular type) filled EMC, the properties such as the spiral flow, thermal conductivity, CTE, and water resistance of AIN-filled EMC (65-vol%) were evaluated according to the size of AIN and the filler-size distribution. Also, physical properties of AIN filled EMC above 65-vol% were evaluated according to increasing AIN content at the point of maximum packing fraction (highly loading condition). The high loading conditions of EMC were set $D_L/D_S$=12 and $X_S$=0.25 like as filler of sphere shape and the AIN filled EMC in this conditions can be obtained satisfactory fluidity up to 70-vol%. As a result, the AIN filled EMC (70-vol%) at high loading condition showed improved thermal conductivity (about 6 W/m-K), dielectric constant (2.0~3.0), CTE(less than 14 ppm/$^{\circ}C$) and water resistance. So, the AIN filled EMC (70-vol%) at high loading condition meets the requirement fur advanced microelectronic packaging materials.

• Journal of Energy Engineering
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• v.28 no.3
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• pp.1-9
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• 2019

A major stress determining the remaining life of the tube in feedwater heater of fossil fuel power plant is hoop stress by the internal pressure. However, thermal stress due to temperature difference across the wall thickness also contributed to reduce the remaining life of the tube. Therefore, thermal loading must be considered even though the contribution of internal pressure loading to the stresses of the tube was known to be much higher than that of the thermal loading. In this study, thermal stress of the tubes in the de-superheating zone was estimated, which was generated due to the temperature difference across the tube thickness. Analytic equations were shown for determining the hoop stress and the radial stress of the tube with uniform thinning and for the temperature across the tube thickness. Accuracy and effectiveness of the analytic equations for the stresses were verified by comparing the results obtained by the analytic equations with those obtained from finite element analysis. Using finite element analysis, the stresses for eccentric thinning were also determined. The effect of heat transfer coefficient on thermal stress was investigated using series of finite element analyses with various values of heat transfer coefficient for both inner and outer surface of the tube. It was shown that the effect of heat transfer coefficient at outer surface was larger than that of heat transfer coefficient at inner surface on the thermal stress of the tube. Also, the hoop stress was larger than the radial stress for both cases of uniformly and eccentrically thinned tubes when the thermal loading was only considered without internal pressure loading.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.44-55
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• 1994

This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.