• 한국정밀공학회지
• /
• 제20권8호
• /
• pp.175-184
• /
• 2003

A method of the shape design sensitivity analysis based on the boundary integral equation formulation is presented for two-dimensional inhomogeneous thermal conducting solids with multiple domains. Shape variation of the external and interface boundary is considered. A sensitivity formula of a general performance functional is derived by taking the material derivative to the boundary integral identity and by introducing an adjoint system. In numerical analysis, state variables of the primal and adjoint systems are solved by the boundary element method using quadratic elements. Two numerical examples of a compound cylinder and a thermal diffuser are taken to show implementation of the shape design sensitivity analysis. Accuracy of the present method is verified by comparing analyzed sensitivities with those by the finite difference. As application to the shape optimization, an optimal shape of the thermal diffuser is found by incorporating the sensitivity analysis algorithm in an optimization program.

• 한국안전학회지
• /
• 제28권5호
• /
• pp.5-9
• /
• 2013

Recently, eco-friendly sources of energy by fuel cells that use hydrogen as an energy source has emerged as the next generation of energy to solve the problem of environmental issues and exhaustion of energy. A solid oxide fuel cell(SOFC) classified based on the type of ion transfer mediator electrolyte has actively being researched. However, the reliability according to the thermal cycle is low during the operation of the fuel cell, and deformation problem comes from the difference in thermal expansion coefficient between the electrode material, the components made of ceramic material is also brittle, which means disadvantages in terms of the strength. Therefore, in this study, considering the states of the manufacturing and operating of SOFC single cells, the stress analyses in the each of the interfacial layer between the anode, electrolyte and the cathode were performed to get the basic data for reliability assessment of SOFC. The obtained results show that von Mises stress according to the thickness direction on operating state occurred maximum stress value in the electrolyte layer. And also the stresses inside the active area on a distance of 1 ${\mu}m$ from the electrode interface were estimated. Futhermore the evaluation was done for the variation of the stress according to the stage of the operation divided into three stages of manufacturing, stack, and operating.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
• /
• pp.53-57
• /
• 2002

Reduction of insulation thickness would be beneficial not only for increasing the cable length but would also improve its thermal performance. An interfacial diffusion method was devised to reduce insulation thickness by improving the interfacial properties of XLPE cable insulation. In this paper, to evaluate superficially the interface properties between XLPE insulation and semiconducting layer, the dielectric and insulation properties of tan${\delta}$ and volume resistance were measured with temperature dependence. Above the results, dielectirc and insulation properties with semiconductor/XLPE were more anormal than its bulk caused by the interfacial properties.

• 비파괴검사학회지
• /
• 제28권3호
• /
• pp.302-308
• /
• 2008

Composite materials are widely used as structural materials for aerospace engineering because of its excellent mechanical properties such as light weight, high stiffness, and low thermal expansion. In driving, impact damage is one of the common but dangerous damages, caused by internal failure of the laminas interface which is not detected by in the surface. Many techniques to detect defects or delaminate between laminates have been reported. Shearography is a kind of laser speckle pattern interferometry with the advantages of non-destructive, non-contact, high resolution and displacement slope measurement. In this paper, the shearography is used to evaluate non-destructively impact damaged surface of the composite material and a measuring method using shearography for the thermal deformation of a impact damaged composite material is discussed. The basic principles of the technique are also described briefly.

• 한국해양공학회지
• /
• 제10권2호
• /
• pp.106-119
• /
• 1996

The ceramic has various high mechanical properties such as heat, abrasion, corrosion resistance and high temperature strength compared with metal. It also has low speciffic weight, low thermal expansibillity, low thermal conductivity. However, it could not be used as structural material since it is brittle and difficult for the machining. Therefore, there have been many researches to attempt to join ceramic with metal which is full of ductillity in order to compensate the weakness of ceramic.The problem is that residual stress develops around the joint area while the ceramic/metal joint material is cooled from high joining temperature to room temperature due to remarkable difference of thermal expansion coefficients between ceramic and metal. Especially, the residual stress at both edges of the specimen reduces the strngth of joint to a large amount by forming a singular stress field. In this study, two dimensional finite element method is attempted for the thermal elastic analysis. The joint residual stress of ceramic/metal developed in the cooling process is investigated and the change of joint residual stress resulted from the repetitive heat cycle is also examined. In addition, it is attempted to clarify the joint stress distribution of the case of tensile load and of the case of superposition of residual stress and actual loading stress.

• 한국전기전자재료학회논문지
• /
• 제36권4호
• /
• pp.391-396
• /
• 2023

Recently, as power and electronic devices have increased in frequency and capacity, it has become a major concern to protect electronic circuits and electronic components used in these devices from abnormal voltages such as various surges and pulse noise. To respond to variously rated voltages applied to power electronic devices, the rated voltages of various varistors can be obtained by controlling the size of internal particles of the varistor or controlling the number of layers of the varistor. During bonding, the problem of unbalanced thermal runaway occurring between the electrode and the varistor interface causes degradation of the varistor and shortens its life of the varistor. In this study, to solve the problem of unbalanced heat distribution of stacked varistors to adjust the operating voltage, the contents of the ZnO-based varistor composition were 96 wt% ZnO, 1 mol% Sb₂O₃, 1 mol% Bi₂O₃, 0.5 mol% CoO, 0.5 mol% MnO, and 1 mol% TiO₂. A multi-layered ZnO varistor was modeled by bonding a single varistor with a composition in three layers according to the operating voltage. The thermal distribution of the triple-layered ZnO varistor was analyzed for the thermal runaway phenomenon that occurred during varistor operation using the finite element method according to Comsol 5.2.

• 공업화학
• /
• 제17권4호
• /
• pp.357-360
• /
• 2006

본 연구에서는 단열재로서의 페놀수지(PF) 발포폼의 물성과 응용가능성을 검토하였다. 실험결과 페놀수지 발포폼의 밀도는 $0.030g/cm^3$를 나타내었고, 열전도율은 $0.026kcal/m.h.^{\circ}C$를 나타내었다. 또한 페놀수지 발포폼은 $500^{\circ}C$로 1 h 동안 열을 가했을 경우 약 71.7 wt%가 휘발되었다. 그리고 페놀수지 발포폼의 화학구조는 단열재로서의 중요 물성인 closed cell 구조형태를 갖는 것으로 분석되었다. 따라서 제조된 페놀수지 발포폼은 단열소재로서의 우수한 물성을 갖는 것으로 확인되었다.

• 설비공학논문집
• /
• 제26권1호
• /
• pp.32-37
• /
• 2014

The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

• E2M - 전기 전자와 첨단 소재
• /
• 제7권1호
• /
• pp.25-31
• /
• 1994

Properties of oxynitride films reoxidized by $N_2{O}$ gas after thermal oxidation and $N_2{O}$ oxide films directly oxidized by using $N_2{O}$ gas on the bare silicon wafer have been studied. From the AES analysis, nitrogen pile-up at the interface of Si/oxynitride and Si/$N_2{O}$ oxide has observed. $N_2{O}$ oxide and oxynitride films have the self-limited characteristics. Therefore, it will be possible to obtain ultra-thin films. Nitrogen pile-up at the interfaces of Si/oxynitride and Si/$N_2{O}$ oxide strengthens film structure and improves dielectric reliability. Although fixed charge densities and interface trap densities of N20 oxide and oxynitride films have somewhat higher than those of thermal $SiO_2{O}$, $N_2{O}$ oxide and oxynitride films showed improved I-V characteristics and constant current stress.

• 대한기계학회논문집
• /
• 제19권1호
• /
• pp.193-201
• /
• 1995

The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.