• Title/Summary/Keyword: Thermal Interface Material

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Shape Design Sensitivity Analysis of Two-Dimensional Thermal Conducting Solids with Multiple Domains Using the Boundary Element Method (경계요소법을 이용한 2 차원 복수 영역 열전도 고체의 형상 설계 민감도 해석)

  • 이부윤;임문혁
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.8
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    • pp.175-184
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    • 2003
  • A method of the shape design sensitivity analysis based on the boundary integral equation formulation is presented for two-dimensional inhomogeneous thermal conducting solids with multiple domains. Shape variation of the external and interface boundary is considered. A sensitivity formula of a general performance functional is derived by taking the material derivative to the boundary integral identity and by introducing an adjoint system. In numerical analysis, state variables of the primal and adjoint systems are solved by the boundary element method using quadratic elements. Two numerical examples of a compound cylinder and a thermal diffuser are taken to show implementation of the shape design sensitivity analysis. Accuracy of the present method is verified by comparing analyzed sensitivities with those by the finite difference. As application to the shape optimization, an optimal shape of the thermal diffuser is found by incorporating the sensitivity analysis algorithm in an optimization program.

A Basic Study on the Stress Field in the Electrode Interface of the Planar SOFC Single Cell (평판형 SOFC 단전지 전극계면에서 발생되는 응력장에 관한 기초적 연구)

  • Park, Chul Jun;Kwon, Oh Heon;Kang, Ji Woong
    • Journal of the Korean Society of Safety
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    • v.28 no.5
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    • pp.5-9
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    • 2013
  • Recently, eco-friendly sources of energy by fuel cells that use hydrogen as an energy source has emerged as the next generation of energy to solve the problem of environmental issues and exhaustion of energy. A solid oxide fuel cell(SOFC) classified based on the type of ion transfer mediator electrolyte has actively being researched. However, the reliability according to the thermal cycle is low during the operation of the fuel cell, and deformation problem comes from the difference in thermal expansion coefficient between the electrode material, the components made of ceramic material is also brittle, which means disadvantages in terms of the strength. Therefore, in this study, considering the states of the manufacturing and operating of SOFC single cells, the stress analyses in the each of the interfacial layer between the anode, electrolyte and the cathode were performed to get the basic data for reliability assessment of SOFC. The obtained results show that von Mises stress according to the thickness direction on operating state occurred maximum stress value in the electrolyte layer. And also the stresses inside the active area on a distance of 1 ${\mu}m$ from the electrode interface were estimated. Futhermore the evaluation was done for the variation of the stress according to the stage of the operation divided into three stages of manufacturing, stack, and operating.

Anormal Dielectric and Insulation Properties of Semiconductor/XLPE (반도전층/XLPE 의 불규칙한 유전 및 절연 특성)

  • Lee, Jong-Chan;Kim, Kwang-Soo;Park, Dae-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.05c
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    • pp.53-57
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    • 2002
  • Reduction of insulation thickness would be beneficial not only for increasing the cable length but would also improve its thermal performance. An interfacial diffusion method was devised to reduce insulation thickness by improving the interfacial properties of XLPE cable insulation. In this paper, to evaluate superficially the interface properties between XLPE insulation and semiconducting layer, the dielectric and insulation properties of tan${\delta}$ and volume resistance were measured with temperature dependence. Above the results, dielectirc and insulation properties with semiconductor/XLPE were more anormal than its bulk caused by the interfacial properties.

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Deformation Analysis of Impact Damaged Composite Tube Using Thermal Shearography

  • Kim, Koung-Suk;Chang, Ho-Seob;Jang, Su-Ok;Lee, Seung-Seok;Jang, Wan-Sik;Jung, Hyun-Chul
    • Journal of the Korean Society for Nondestructive Testing
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    • v.28 no.3
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    • pp.302-308
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    • 2008
  • Composite materials are widely used as structural materials for aerospace engineering because of its excellent mechanical properties such as light weight, high stiffness, and low thermal expansion. In driving, impact damage is one of the common but dangerous damages, caused by internal failure of the laminas interface which is not detected by in the surface. Many techniques to detect defects or delaminate between laminates have been reported. Shearography is a kind of laser speckle pattern interferometry with the advantages of non-destructive, non-contact, high resolution and displacement slope measurement. In this paper, the shearography is used to evaluate non-destructively impact damaged surface of the composite material and a measuring method using shearography for the thermal deformation of a impact damaged composite material is discussed. The basic principles of the technique are also described briefly.

Stress distribution of near the interface on high temperature fatigue in ceramic/metal bonded joints (세라믹/금속접합재의 고온피로에 따른 접합계면의 응력분포)

  • 박영철;허선철;윤두표;김광영
    • Journal of Ocean Engineering and Technology
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    • v.10 no.2
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    • pp.106-119
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    • 1996
  • The ceramic has various high mechanical properties such as heat, abrasion, corrosion resistance and high temperature strength compared with metal. It also has low speciffic weight, low thermal expansibillity, low thermal conductivity. However, it could not be used as structural material since it is brittle and difficult for the machining. Therefore, there have been many researches to attempt to join ceramic with metal which is full of ductillity in order to compensate the weakness of ceramic.The problem is that residual stress develops around the joint area while the ceramic/metal joint material is cooled from high joining temperature to room temperature due to remarkable difference of thermal expansion coefficients between ceramic and metal. Especially, the residual stress at both edges of the specimen reduces the strngth of joint to a large amount by forming a singular stress field. In this study, two dimensional finite element method is attempted for the thermal elastic analysis. The joint residual stress of ceramic/metal developed in the cooling process is investigated and the change of joint residual stress resulted from the repetitive heat cycle is also examined. In addition, it is attempted to clarify the joint stress distribution of the case of tensile load and of the case of superposition of residual stress and actual loading stress.

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Thermal Distribution Analysis of Triple-Stacked ZnO Varistor (3층으로 적층된 ZnO 바리스터의 열분포 해석)

  • Kyung-Uk Jang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.4
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    • pp.391-396
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    • 2023
  • Recently, as power and electronic devices have increased in frequency and capacity, it has become a major concern to protect electronic circuits and electronic components used in these devices from abnormal voltages such as various surges and pulse noise. To respond to variously rated voltages applied to power electronic devices, the rated voltages of various varistors can be obtained by controlling the size of internal particles of the varistor or controlling the number of layers of the varistor. During bonding, the problem of unbalanced thermal runaway occurring between the electrode and the varistor interface causes degradation of the varistor and shortens its life of the varistor. In this study, to solve the problem of unbalanced heat distribution of stacked varistors to adjust the operating voltage, the contents of the ZnO-based varistor composition were 96 wt% ZnO, 1 mol% Sb2O3, 1 mol% Bi2O3, 0.5 mol% CoO, 0.5 mol% MnO, and 1 mol% TiO2. A multi-layered ZnO varistor was modeled by bonding a single varistor with a composition in three layers according to the operating voltage. The thermal distribution of the triple-layered ZnO varistor was analyzed for the thermal runaway phenomenon that occurred during varistor operation using the finite element method according to Comsol 5.2.

Properties and Thermal Characteristics of Phenol Foam for Heat Insulating Materials (단열재용 페놀폼의 물성과 열적특성)

  • Kim, Dong-Kwon;Lee, Soo-Bok
    • Applied Chemistry for Engineering
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    • v.17 no.4
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    • pp.357-360
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    • 2006
  • In this study, we studied the physical properties and application of PF foam as heat insulating materials. In the experimental results, the density of PF foam showed $0.030g/cm^3$ and the thermal conductivity showed $0.026kcal/m.h.^{\circ}C$. Also, thermal resistance of the prepared PF foam was volatilized about 71.7 wt% when the temperature was $500^{\circ}C$ (1 h). And the chemical structure of PF foam have a closed cell type in the important properties as heat insulating materials. Therefore, it was confirmed that the prepared PF foam had excellent performance as heat insulating materials.

Thermal Contact Resistance Measurement of Metal Interface at Cryogenic Temperature (극저온에서 금속표면의 열 접촉 저항 측정)

  • Kim, Myung Su;Choi, Yeon Suk
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.26 no.1
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    • pp.32-37
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    • 2014
  • The thermal contact resistance (TCR) is one of the important resistance components in cryogenic systems. Cryogenic measurement devices using a cryocooler can be affected by TCR because the device has to consist of several metal components that are in contact with each other for heat transfer to the specimen without a cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement devices using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as the roughness of the metal surface, the contact area and the contact pressure. In this study, we designed a TCR measurement system at variable temperature using a cryocooler as a heat sink. Copper was selected as a specimen in the experiment because it is widely used as a heat transfer medium in cryogenic measurement devices. We measured the TCR between Cu and Cu for various temperatures and contact pressures. The effect of the interfacial materials on the TCR was also investigated.

Properties of the oxynitride films formed by thermal reoxidation in $N_2{O}$ gas ($N_2{O}$가스로 재산화시킨 oxynitride막의 특성)

  • 김태형;김창일;최동진;장의구
    • Electrical & Electronic Materials
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    • v.7 no.1
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    • pp.25-31
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    • 1994
  • Properties of oxynitride films reoxidized by $N_2{O}$ gas after thermal oxidation and $N_2{O}$ oxide films directly oxidized by using $N_2{O}$ gas on the bare silicon wafer have been studied. From the AES analysis, nitrogen pile-up at the interface of Si/oxynitride and Si/$N_2{O}$ oxide has observed. $N_2{O}$ oxide and oxynitride films have the self-limited characteristics. Therefore, it will be possible to obtain ultra-thin films. Nitrogen pile-up at the interfaces of Si/oxynitride and Si/$N_2{O}$ oxide strengthens film structure and improves dielectric reliability. Although fixed charge densities and interface trap densities of N20 oxide and oxynitride films have somewhat higher than those of thermal $SiO_2{O}$, $N_2{O}$ oxide and oxynitride films showed improved I-V characteristics and constant current stress.

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Analysis of the Solidification Process at a Vertical Wall With Thermal Contact Resistance (접촉열저항이 있는 수직벽에서의 응고과정 해석)

  • 이진호;모정하;황기영
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.1
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    • pp.193-201
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    • 1995
  • The role of thermal contact resistance between a casting and a metal mold as well as natural convection in the melt during solidification of a pure metal is numerically studied. Numerical simulation is performed for a rectangular cavity using the coordinate transformation by boundary-fitted coordinate and pure aluminum is used as the phase- change material. The influences of thermal contact resistance on the interface shape and position, solidified volume fraction, temperature field and local heat transfer are investigated.