• Title/Summary/Keyword: Thermal Insulator

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A Study on the Standardization of Fineness Measurement for the Thermal Insulator of Military Textiles (방한용 화섬솜의 섬도 측정방법의 표준화에 관한 연구)

  • Hong, Seong-don;Kim, Byung-soon
    • Journal of Korean Society for Quality Management
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    • v.43 no.3
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    • pp.253-272
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    • 2015
  • Purpose: The purpose of this study is to enhance the reliability of quality inspection by standardize the fineness test method of the thermal insulator of military textiles Methods: We have measured the thermal insulator of military textiles by microscope with three different ways and the effectiveness of their difference were analyzed by one-way layout design. Results: We have suggest the standardized the fineness test method of the thermal insulator of military textiles through advanced research. As a result we have verified hollow ratio of heat insulating fiber affect fineness test methods. The fineness test method for the thermal insulator applied with different methods following hollow ratio. We have verified that when the hollow ratio over 90%, the fineness of the thermal insulator measured from fiber-length, if it has over 80%, the cross-section length of hollow and if it has less 80%, the cross-section area of hollow is applied, respectively. Conclusion: This study indicated that the test method of fineness shows high reliability. Heat insulating fibers which have high evenness shows narrow variations(5/% or less, only CV 25%) irrespectively under different testing equipment or institute. Based ons the results, we have suggest the standardization of test methods for fineness by microscope method and produced the registration of Group Standard in Korean Standards Association.

A Study on Thermal Insulator Effect for Structure Design of Internal Support on Cryogenic Vessel (단열재가 극저온 용기의 내부지지대 구조설계에 미치는 영향)

  • Kim, Doo-Ho;Ji, Hyun-Jin;Kim, Ki-Youl;Cho, Sung-Baek
    • Journal of the Korea Institute of Military Science and Technology
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    • v.14 no.3
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    • pp.524-531
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    • 2011
  • The cryogenic vessel, storing a liquified solutions as LOX and $LN_2$, consists of a external vessel, internal vessel, thermal insulator and internal support. The internal support should be satisfied with mechanical strength not only to support weight of internal tank but also to maintain uniform space between external and internal tank in spite of external mechanical shock. However, excessive structure design of internal supports is able to increase the amount of heat conduction and the rate of vaporization. The thermal insulator, filled with space between a external and internal vessel, reduces the rate of heat transfer and guarantees the standing time of cryogenic vessel. Especially powder type of insulator has low thermal conductivity and reduce the specification of structure design. In order to evaluate the effect of insulator on structure design, the experiment set-up simulated cryogenic vessel was tested in shock environment according to thermal insulator. As a result, the behavior of internal support under external shock was understood and the design criteria was able to be suggested.

The thermal conductivity analysis of the SOI LIGBT structure using $Al_2O_3$ ($Si/Al_2O_3/Si$ 형태의 SOI(SOS) LIGBT 구조에서의 열전도 특성 분석)

  • Kim, Je-Yoon;Kim, Jae-Wook;Sung, Man-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.11a
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    • pp.163-166
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    • 2003
  • The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2\;and\;Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability

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Performance Improvement of Stratified Thermal Storage Tank Using Heat Insulator (단열층 사용을 통한 성층 축열조 성능개선)

  • Lim, Se Hwa;Lee, Tae Gyu;Shin, Seungwon
    • Transactions of the KSME C: Technology and Education
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    • v.2 no.1
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    • pp.65-72
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    • 2014
  • The purpose of this study is to design a heat insulator for reducing available energy loss in stratified thermal storage tank. Heat insulator is operated by buoyancy effect from density difference between hot and cold water without extra equipment. Analysis model using the Matlab Simulink was developed to estimate the internal temperature distribution in thermal storage tank and also used to select proper material and thickness of the heat insulator. Operational feasibility was confirmed through reduced scale experiment. As a result, heat insulator can effectively delay the formation of thermal boundary layer between hot and cold water. In reduced scale experiment, heat insulator can preserve additional 1540J of available energy. When applied to the real thermal storage tank, increase of 6% thermal storage efficiency can be expected.

Partial Discharge Diagnosis of Thermal Degradated PVC Cable (열열화된 PVC 케이블의 부분방전 진단)

  • Song, Ki-Tae;Lee, Sung-Ill
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.3
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    • pp.208-214
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    • 2011
  • In this thesis, the partial discharge according to applied voltage and variations of cross-sectional area and length of the conductor related to general condition for using cable was measured in order to study degradation diagnosis for 2-Core cable of the PVC insulator used in industrial fields for other safety installations. Also the thermal degradation conditions under various installation circumstances of cables were studied by assuming degradation conditions with each different degradation rate (50%, 67%, 100%) such as variation in degradated temperature, thermal exposure time, normal state, partially degradated state and overall degradated state for thermal degradation diagnosis. The quantity of electric discharge (V-Q) according to applied voltage was measured for measurement of inception voltage and extinction voltage. The quantity of electric discharge and the number of electric discharge (Q-N) were measured with applied voltage kept constantly. In addition, pictures were taken using SEM (scanning electron microscope) to compare the surface of external insulator to degradated state of internal insulator according to thermal degradation temperature and also compare the surface of external insulator to degradated surface state of internal insulator according exposure time of cables to thermal stress.

Thermal Conductivity Characteristic of Carbon Nanotube Composites and XLPE Insulator (탄소나노튜브 복합체와 XLPE 절연체의 열전도도 특성)

  • Yang, Jong-Seok;Kook, Jeong-Ho;Park, Noh-Joon;Nah, Chang-Woon;Park, Dae-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.11a
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    • pp.160-161
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    • 2006
  • To Improve the mean-life and the reliability of power cable, we have investigated thermal conductivity of XLPE insulator and semiconducting materials in l54[kV] underground power transmission cable. Specimens were made of sheet form with the nine of specimens for measurement. Thermal conductivity were measured by Nano Flash Diffusivity thermal conductivity measurement temperature ranges of XLPE insulator were from 20[$^{\circ}C$] to 90[$^{\circ}C$], and the heating rate was 1[$^{\circ}C$/mm]. In case of semiconducting materials. the measurement temperature ranges of thermal conductivity were from 20[$^{\circ}C$] to 60[$^{\circ}C$], and the heating rate was 1[$^{\circ}C$/min].

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The thermal conductivity analysis of the SOI/SOS LIGBT structure (Latch up 전후의 SOI(SOS) LIGBT 구조에서의 열전도 특성 분석)

  • Kim, Je-Yoon;Kim, Jae-Wook;Sung, Man-Young
    • 한국컴퓨터산업교육학회:학술대회논문집
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    • 2003.11a
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    • pp.79-82
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    • 2003
  • The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2$ and $Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability.

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Thermal modeling of microcellular foamed polymer matrix (초미세 발포 성형 고분자 물질의 열전달 모델링)

  • Moon, Byeong_Gi;Cha, Sung-Woon;Oh, Sei-Woong
    • Proceedings of the KSME Conference
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    • 2000.04b
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    • pp.367-372
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    • 2000
  • By the means of microcellular (earning, we can make polymers with $10{\mu}m$ sized gas bubbles. After the $CO_2$ gas bubbles solve, diffuse and leave the polymer matrix, the thermal properties of polymer matrix are changed. Expecially, thermal conductivity becomes low. So, the polymer matrixes with gas bubbles can be used as insulator In this paper, we make model after microcellular foamed polymer matrix to know the change of thermal properties. Most of all, the purpose of this paper is the mlcrocellular foamed polymer matrix's availability as a insulator Beside of thermal properties the surface of microcellular foamed polymer is polished and easy to be colored. Above all the mechanical properties are better than the other insulator. So, microcellular foamed polymer can be used as exterior of building or it can be replaced as a tile.

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Specific Heat and Thermal Conductivity Measurement of CNT/EEA Semiconducting Materials and XLPE Insulator (CNT/EEA 반도전층 재료와 XLPE 절연체의 열적 특성)

  • Yang, Jong-Seok;Lee, Kyoung-Yong;Shin, Dong-Hoon;Park, Dae-Hee
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.11
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    • pp.514-519
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    • 2006
  • To improve the mean-life and the reliability of power cable, we have investigated specific heat (Cp) and thermal conductivity of XLPE insulator and semiconducting materials in 154[kV] underground power transmission cable. Specimens were made of sheet form with the seven of specimens for measurement. Specific heat (Cp) and thermal conductivity were measured by DSC (Differential Scanning Calorimetry) and Nano Flash Diffusivity. Specific-heat measurement temperature ranges of XLPE insulator were from $20[^{\circ}C]\;to\;90[^{\circ}C]$, and the heating rate was $1[^{\circ}C/min]$. And the measurement temperatures of thermal conductivity were $25[^{\circ}C],\;55[^{\circ}C]\;and\;90[^{\circ}C]$. In case of semiconducting materials, the measurement temperature ranges of specific heat were from $20[^{\circ}C]\;to\;60[^{\circ}C]$, and the heating rate was $1[^{\circ}C/min]$. And the measurement temperatures of thermal conductivity were $25[^{\circ}C]\;and\;55[^{\circ}]C$. From these experimental results both specific heat and thermal conductivity were increased by heating rate because volume of materials was expanded according to rise in temperature. We could know that a small amount of CNT has a excellent thermal properties.

The aging test method of insulator and development prospect of polymer insulator (배전용애자의 경년시험방법과 폴리머애자의 개발 동향)

  • Song, I.K;Kim, S.J.;Kim, J.Y.;Kwak, H.R.
    • Proceedings of the KIEE Conference
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    • 1996.07c
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    • pp.1791-1793
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    • 1996
  • This paper describes Thermal-Mechanical performance and Ultimate Mechanical-Strength test for the purpose of aging analysis of suspension insulator. The temperature difference of insulator surface according to the aging of suspension insulator brought out about $2^{\circ}C$ to $7-8^{\circ}C$ difference comparing with the atmospheric temperature. Quality standard and Mechanical-Strength of used suspension insulator deteriorate more remarkably than that of new suspension insulator. It is required that Thermal-Mechanical performance test standard be revised in the future. And it is described about the development prospect of polymer insulators

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