• Corrosion Science and Technology
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• 제21권4호
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• pp.243-249
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• 2022

The objective of the present study was to perform failure analysis of double-layered bellow (expansion joint), a core part of stress reliever, used to relieve axial stresses induced by thermal expansion of heat-transport pipes in a district heating system. The bellow underwent tensile or compressive stresses due to its structure in terms of position. A leaked position sufferred a fatigue with a tensile component for decades. A cracked bellow contained a higher fraction of martensitic phase because of manufacturing and usage histories, which induced more brittleness on the component. Inclusions in the inner layer of the bellow acted as a site of stress concentration, from which cracks initiated and then propagated along the hoop direction from the inner surface of the inner layer under fatigue loading conditions. As the crack reached critical thickness, the crack propagated to the outer surface at a higher rate, resulting in leakage of the stress reliever.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국의류산업학회지
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• 제1권3호
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• pp.288-295
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• 1999

This study was conducted to examine the fatigue phenomenon of mechanical properties in tencel fabrics by repeated washing & shear and tensile deformation. The obtained results are as follows. After performing repeated shear tensile deformation, RT of tencel showed higher increase rate than that of cotton and rayon, whereas its WT and EM was a smaller decrease rate than that of them. This means that tencel's resistance to tensile deformation was the greatest. In the repeated washing and shear tensile deformation, tencel's 2HB, 2HG and 2HG5 showed a remarkable increase rate. In terms of deformation frequency, the greatest change rate appeared at the time of 1000 cycles of repeated shear tensile deformation and 15 times of repeated washing. In the hand value and THV, KOSHI showed a higher increase rate for tencel than for cotton and rayon in both repeated washing and shear tensile deformation, and NUMERI showed a higher increase rate. In the THV the change rate of rayon and cotton could be rarely seen but for tencel, it decreased. tencel's change rate of thermal insulation value by materials was 1.08%, and it increased as the washing frequency increased, compared to the grey fabrics, whereas the change rates of cotton and rayon were 0.74% and 0.22%, respectively. The qmax decreased in the order of cotton>tencel>rayon as the washing frequency increased.

• The Journal of Advanced Prosthodontics
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• 제13권5호
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• pp.304-315
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• 2021

PURPOSE. Esthetic expectations have increased the use of polyetheretherketone (PEEK) clasps as alternatives to Cr-Co in removable partial dentures (RPDs). The objective of this study was to evaluate the retentive force and dimensional change of clasps with different thickness and undercut made from PEEK by the thermo-mechanical fatigue. MATERIALS AND METHODS. PEEK clasps (N = 48) with thicknesses of 1 or 1.50 mm and 48 premolar monolithic zirconia crowns with undercuts of 0.25 mm or 0.50 mm were fabricated. Samples are divided into four groups (C1-C4) and were subjected to 7200 thermal aging cycles (at 5 - 55℃). The changes in the retentive force and dimensions of the clasps were measured by micro-stress testing and micro-CT devices from five measurement points (M1 - M5). One-way ANOVA, paired t-test, two-way repeated ANOVA, and post-hoc tests were used to analyze the data (P < .05). RESULTS. The retentive forces of C1, C2, C3, and C4 groups in initial and final test were found to be 4.389-3.388 N, 4.67 - 3.396 N, 5.161 - 4.096 N, 5.459 - 4.141 N, respectively. The effects of retentive force of all PEEK clasps groups were significant decreased. Thermo-mechanical cycles caused significant dimensional changes at points with M2, M4, and M5, and abraded the clasp corners and increased the distance between the ends of the clasp, resulting in reduced retentive forces (P^* = .016, P^* = .042, P < .001, respectively). CONCLUSION. Thermo-mechanical aging decreases the retentive forces in PEEK clasps. Increasing the thickness and undercut amount of clasps decreases the amount of dimensional change. The values measured after aging are within the clinically acceptable limits.

• 한국군사과학기술학회지
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• 제20권1호
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• pp.1-11
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• 2017

In this paper, design requirements of the large radar were investigated, and development was performed through the analysis and design. Large radar should be designed by bearing the 75 knot wind force and $20kg/m^2$ ice mass as operating conditions in order to meet structural stability, and driving torque and bearing load were calculated for securing the driving stability. Thermal dissipation analysis was performed considering TRM and DC-DC Converter's limitation temperature by $50^{\circ}C$ ambient temperature condition in order to attain thermal stability, and PSD and shock analysis were carried out by using MIL-STD-810G vibration and shock specification in order to transport and installation of the large radar. As a result, all components of large radar could secure the structural stability more than 2.8 factor of safety, and driving stability was also secured with adequate bearing fatigue life. Thermal stability was attained by allowable max temperature 88.7 C of the TRM, and structural stability for transportation and installation of the large radar was also secured more than 5 factor of safety. After it was transported and installed to the radar site, operating capability was finally verified by rotating the large radar.

• 한국철도학회논문집
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• 제11권2호
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• pp.188-194
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• 2008

철도차량의 기계제동에 사용되는 제동 디스크의 표면에는 반복적인 마찰제동에 의해 열피로에 기인한 열균열이 발생하게 된다. 이러한 열균열은 제동성능 저하, 제동장치 유지보수비용 증가를 발생시키고 심지어는 대규모 열차사고의 원인으로 작용할 수도 있다. 본 연구에서는 우리나라의 새마을 및 무궁화 열차를 대상으로 고내열성을 지닌 제동 디스크 재질을 개발하기 위하여 FC280, FC250, NCM 등의 후보 재질을 선별하여 각 재질의 화학원소 성분과 비율을 결정하였다. 선별된 후보 재질로 주물 공시재를 제작하여 화학적 성분 분석, 결정 및 흑연조직 분석을 하였고 후보재질 시편에 대한 기계적 특성 시험 및 마찰특성 시험을 실시하여 현재 사용되는 제동 디스크 재질 특성과 비교하였다. 기계적 특성시험 결과 NCM이 가장 큰 인장강도를 보이나 마찰계수는 가장 작았다. 소형 다이나모 시험기에서 마찰제동 시 제동 속도 및 제동압력 변화에 대해 가장 안정적인 마찰계수를 나타내는 것은 현재의 사용품인 것으로 나타났다.

• 마이크로전자및패키징학회지
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• 제25권3호
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• pp.21-30
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• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• 대한기계학회논문집A
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• 제38권12호
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• pp.1431-1434
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• 2014

가스터빈에 적용되는 열차폐코팅은 가동 중 반복적인 열피로에 의하여 파손되므로, 열차폐코팅의 내구성평가가 필요하다. 고온 환경에 노출된 열차폐코팅의 내부에는 열생성산화물(TGO)이 성장하게 되는데, 이러한 열생성산화물(TGO)의 성장은 열차폐코팅의 주요 파손 원인으로 알려져 있다. 따라서 TGO의 성장을 고려한 열차폐코팅의 내구성평가는 반드시 선행되어야 하는 연구이다. 본 연구에서는 김대진등의 연구 결과로부터 열화시간에 따른 TGO 성장을 고려하여 유한요소해석을 수행하였으며, 이로부터 응력과 열화시간 사이의 관계를 도출하였다. 또한 열화시간에 따른 유한요소해석 결과와 김대진 등의 접착강도 시험 결과의 비교를 통하여 열차폐코팅의 내구성을 평가하였다.

• 마이크로전자및패키징학회지
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• 제16권3호
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• pp.25-29
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• 2009

COB(chip-on-board) 플립칩 패키지에 있어서 NCP(non-conductive paste)의 적용성을 확보하기 위해 자체 포뮬레이션한 NCP와 상용 NCP에 대하여 보드레벨 플립칩 패키지를 제작하고 고온고습 및 열충격 신뢰성을 평가하였다. 실험결과 보다 작은 입도의 용융 실리카를 첨가한 NCP 시제품들이 고온고습 신뢰성에 유리한 것을 알 수 있었다. 또한, NCP 접속부에 있어서 열응력에 의한 피로보다 흡습에 의한 에폭시의 팽창이 접속부 파손에 보다큰 영향을 미치는 것으로 나타났으며, NCP의 접착강도가 높을수록 NCP 플립칩 패키지의 열충격 신뢰성이 향상되는 것을 알 수 있었다.