• 제목/요약/키워드: Thermal Fatigue

검색결과 573건 처리시간 0.026초

타이어코드용 PEN섬유의 반복신장 피로에 따른 미세구조와 물성(II) - 피로 온도에 따른 영향 (Fine Structure and Physical Properties of PEN Fiber with the Repeated Extension Fatigue(II) - Thermal Effect -)

  • 김명우;방윤혁;박종범;조현혹
    • 한국섬유공학회:학술대회논문집
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    • 한국섬유공학회 2002년도 봄 학술발표회 논문집
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    • pp.247-250
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    • 2002
  • Poly(ethylene 2,6-naphthalene dicarboxylate)(PEN)은 그 주사슬에 PET의 벤젠고리 대신 나프탈렌 고리로 치환된 구조로 인하여 PEN섬유는 내열성, 탄성계수(modulus), 형태안정성(dimensional stability), 내화학성 등에서 PET에 비해 우수한 장점을 갖고 있으며, 따라서 고온, 고습한 환경에서도 기계적 성질을 오랫동안 유지할 수 있다. 그리고 중합 및 방사 등의 제조 공정이 PET와 유사하여 향후 고강력, 고형 태안정성 산업용사에서 획기적인 변화를 가져올 것으로 기대된다. (중략)

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플립칩 언더필을 위한 몰드 설계 및 공정 연구

  • 정철화;차재원;서화일;김광선
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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    • pp.64-68
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    • 2002
  • 플립칩 공정에서는 반도체 칩과 기판사이의 열팽창계수(CTE : Coefficient of Thermal Expansion)의 차와 외적 충격과 같은 이유로 인해 피로균열(Fatigue crack)이나 치명적인 전기적 결함이 발생하게 된다. 이런 부정적인 요인들로부터 칩을 보호하고 신뢰성을 향상시키기 위해서 플립칩 언더필 공정이 적용되고 있다. 본 연구에서는 기존의 몰딩 공정을 응용한 플립칩 언디필 방법을 소개하였다. 공정 이론과 디바이스를 소개하였으며, 시뮬레이션 및 수식을 통하여 최적의 언더필을 위한 몰더 설계 조건을 구하였다. 그리고 본 연구를 통해 기대되는 공정의 장점을 제시하였다.

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발전 계획에서 순환 물 펌프 고장 분석 (Failure Analysis of Circulating Water Pump Shaft in Power Plant)

  • Lee, Jaehong;Jung, Nam-gun
    • KEPCO Journal on Electric Power and Energy
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    • 제7권1호
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    • pp.125-128
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    • 2021
  • This paper presents the root cause failure analysis of the circulating water pump in the 560 MW thermal power plant. A fractured austenitic stainless-steel shaft operated for 24 years was examined. Fracture morphology was investigated by micro and macro-fractographic analysis. The metallurgical analyses including chemical analysis, metallography and hardness testing were performed. The analysis reveals that the pump shaft was fractured due to the reverse bending load with combination of rotating bending load. Corrective actions for plant operator was recommended based on the analysis.

습도 변화에 따른 뇌파 기반 생체신호 변화에 관한 연구 (A Study on the Variation of Physiology Signals based on EEG with Humidity)

  • 김명호;김정민
    • 전기학회논문지P
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    • 제62권1호
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    • pp.50-55
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    • 2013
  • Subjects with 0.7[clo]'s amount of clothing were estimated on their thermal comfort, concentrativeness, heart rate variability, stress and fatigue degree when given variation in relative humidity to 30, 40, 50, 60, 70, and 80[RH%], in an environmental test room of temperature 25[$^{\circ}C$], illumination 1000[lux] and air velocity 0.02[m/sec], by using EEG, learning ability and HRV. At the result, it was at 50~60[RH%] of relative humidity that subject's thermal comfort and concentrativeness were at the highest while stress were at the lowest, and it was at 60[RH%] of relative humidity that heart rate variability was most stabilized. It was found that when temperature and humidity of the environmental test room are at 25[$^{\circ}C$] and 50~60[RH%], subject's productivity and psychological state are least affected.

LNG 저장탱크용 멤브레인 개발을 위한 유한요소해석 (The FEM Analysis of Membrane for LNG Storage Tank)

  • 오병택;김영균;홍성호;윤인수;서흥석
    • 한국가스학회지
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    • 제6권4호
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    • pp.47-52
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    • 2002
  • 멤브레인은 LNG온도에 따른 열수축과 팽창을 흡수하는 주름을 가지고 있는 스테인레스판으로 저장탱크 내부에 설치된다. 유한요소 해석법을 적용하여 LNG저장탱크용 멤브레인을 개발하였다. 액압 및 온도 하중 조건에 따른 멤브레인 주름부의 변형 거동 특성 및 강도 그리고 앵커 고정부의 반력을 구하였고 이 해석 데이터를 바탕으로 멤브레인의 안정성과 피로강도를 확인하였다.

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하니콤 샌드위치 구조물의 수리 시 반복 경화에 따른 강도 특성 평가 (Evaluation of Strength Characteristics of HoneyComb Sandwitch Structure Due to the Repeated Curing Cycle in Repair Process)

  • 손영준;이기현;김국진;한중원;김윤해
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 추계학술발표대회 논문집
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    • pp.83-87
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    • 2002
  • Aerospace industries are widely using honeycomb sandwich structures that it has high specific strength and stiffness, chemical material resistance and fatigue resistance. But, in repairing process of damaged areas, one of the problems is that delamination can be occurred in the sound areas during and/or after the exposure to the elevated curing temperature in case that the repair process is repeated. Therefore, this study was conducted Flatwise tensile, Drum peel and Long beam flexural strength tests to evaluate the degree of degradation of mechanical properties of the honeycomb sandwich structures by affecting thermal aging. As the results, the decrease of mechanical strength was observed at the specific specimen which is exposed over 50hrs at $127^{\circ}C$.

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무도상 판형교 레일 장대화에 따른 궤도 유지관리 비교연구 (A comparison study for the track maintenance system for the non-ballast steel plate bridge)

  • 남보현;장태철;우용근;민경주
    • 한국철도학회:학술대회논문집
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    • 한국철도학회 2007년도 추계학술대회 논문집
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    • pp.401-410
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    • 2007
  • Form the application of long rail system the non-ballast steel plate bridges, fatigue strength increase and rail noise reduction can be expected. This is mainly form the reduction of the rail impact at the rail joint locations which already made to behave together from welds. In the high speed rail, application of long rail system is essential because without long rail system, the required serviceability level can not be achieved. But even with this long rail systems, the thermal expansion from the girder can not be absorbed in the normal bearing systems, and these expansion cause between girder and rail. Also unexpected rail buckling and fracture through rail thermal tension may happen. It was found through numerical analysis and field measurement that these problems can be avoided by semi-fixed bearing system. In this study, the benefits of non-ballast plate bridge through long rail system, especially at the point of girder stability, girder stiffness increase and bearing maintenance will be reviewed.

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가속화 시험을 통한 플립칩 패키지의 열적 기계적 특성 평가 (Thermo-mechanical reliability evaluation of flip chip package using a accelerated test)

  • 김대곤;하상수;김종웅;신영의;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년도 춘계 학술대회 개요집
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    • pp.21-23
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    • 2006
  • The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.

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공작기계용 고속 볼베어링의 최적 끼워맞춤에 관한 연구 (A Study on the Optimum Shrink-fit for High Speed Ball Bearing of Machine Tool)

  • 김웅;이춘만;황영국
    • 한국정밀공학회지
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    • 제27권9호
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    • pp.94-102
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    • 2010
  • The spindle is the main component in machine tools. To develop high speed machine tools, a lot of studies have been carried out for high speed spindle. Bearing is very important part in spindle. The bearing clearance is influenced by shrink fit and thermal expansion during operation. The designer must take into account the reduction of shrink fits. The aims of this study are to grasp the shrink fits and behavior of a bearing which is a deeply connected with fatigue life of bearing and performance of spindle through FEM(Finite Element Method). This paper proposed optimum value of shrink fit considering deformation of spindle and stress of fitting area using design of experiments. Thus, the proposed formula can be used to obtain bearing internal clearance.