• Corrosion Science and Technology
• /
• v.21 no.4
• /
• pp.243-249
• /
• 2022

The objective of the present study was to perform failure analysis of double-layered bellow (expansion joint), a core part of stress reliever, used to relieve axial stresses induced by thermal expansion of heat-transport pipes in a district heating system. The bellow underwent tensile or compressive stresses due to its structure in terms of position. A leaked position sufferred a fatigue with a tensile component for decades. A cracked bellow contained a higher fraction of martensitic phase because of manufacturing and usage histories, which induced more brittleness on the component. Inclusions in the inner layer of the bellow acted as a site of stress concentration, from which cracks initiated and then propagated along the hoop direction from the inner surface of the inner layer under fatigue loading conditions. As the crack reached critical thickness, the crack propagated to the outer surface at a higher rate, resulting in leakage of the stress reliever.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.233-241
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2004.09a
• /
• pp.211-219
• /
• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Fashion & Textile Research Journal
• /
• v.1 no.3
• /
• pp.288-295
• /
• 1999

This study was conducted to examine the fatigue phenomenon of mechanical properties in tencel fabrics by repeated washing & shear and tensile deformation. The obtained results are as follows. After performing repeated shear tensile deformation, RT of tencel showed higher increase rate than that of cotton and rayon, whereas its WT and EM was a smaller decrease rate than that of them. This means that tencel's resistance to tensile deformation was the greatest. In the repeated washing and shear tensile deformation, tencel's 2HB, 2HG and 2HG5 showed a remarkable increase rate. In terms of deformation frequency, the greatest change rate appeared at the time of 1000 cycles of repeated shear tensile deformation and 15 times of repeated washing. In the hand value and THV, KOSHI showed a higher increase rate for tencel than for cotton and rayon in both repeated washing and shear tensile deformation, and NUMERI showed a higher increase rate. In the THV the change rate of rayon and cotton could be rarely seen but for tencel, it decreased. tencel's change rate of thermal insulation value by materials was 1.08%, and it increased as the washing frequency increased, compared to the grey fabrics, whereas the change rates of cotton and rayon were 0.74% and 0.22%, respectively. The qmax decreased in the order of cotton>tencel>rayon as the washing frequency increased.

• The Journal of Advanced Prosthodontics
• /
• v.13 no.5
• /
• pp.304-315
• /
• 2021

PURPOSE. Esthetic expectations have increased the use of polyetheretherketone (PEEK) clasps as alternatives to Cr-Co in removable partial dentures (RPDs). The objective of this study was to evaluate the retentive force and dimensional change of clasps with different thickness and undercut made from PEEK by the thermo-mechanical fatigue. MATERIALS AND METHODS. PEEK clasps (N = 48) with thicknesses of 1 or 1.50 mm and 48 premolar monolithic zirconia crowns with undercuts of 0.25 mm or 0.50 mm were fabricated. Samples are divided into four groups (C1-C4) and were subjected to 7200 thermal aging cycles (at 5 - 55℃). The changes in the retentive force and dimensions of the clasps were measured by micro-stress testing and micro-CT devices from five measurement points (M1 - M5). One-way ANOVA, paired t-test, two-way repeated ANOVA, and post-hoc tests were used to analyze the data (P < .05). RESULTS. The retentive forces of C1, C2, C3, and C4 groups in initial and final test were found to be 4.389-3.388 N, 4.67 - 3.396 N, 5.161 - 4.096 N, 5.459 - 4.141 N, respectively. The effects of retentive force of all PEEK clasps groups were significant decreased. Thermo-mechanical cycles caused significant dimensional changes at points with M2, M4, and M5, and abraded the clasp corners and increased the distance between the ends of the clasp, resulting in reduced retentive forces (P^* = .016, P^* = .042, P < .001, respectively). CONCLUSION. Thermo-mechanical aging decreases the retentive forces in PEEK clasps. Increasing the thickness and undercut amount of clasps decreases the amount of dimensional change. The values measured after aging are within the clinically acceptable limits.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.20 no.1
• /
• pp.1-11
• /
• 2017

In this paper, design requirements of the large radar were investigated, and development was performed through the analysis and design. Large radar should be designed by bearing the 75 knot wind force and $20kg/m^2$ ice mass as operating conditions in order to meet structural stability, and driving torque and bearing load were calculated for securing the driving stability. Thermal dissipation analysis was performed considering TRM and DC-DC Converter's limitation temperature by $50^{\circ}C$ ambient temperature condition in order to attain thermal stability, and PSD and shock analysis were carried out by using MIL-STD-810G vibration and shock specification in order to transport and installation of the large radar. As a result, all components of large radar could secure the structural stability more than 2.8 factor of safety, and driving stability was also secured with adequate bearing fatigue life. Thermal stability was attained by allowable max temperature 88.7 C of the TRM, and structural stability for transportation and installation of the large radar was also secured more than 5 factor of safety. After it was transported and installed to the radar site, operating capability was finally verified by rotating the large radar.

• Journal of the Korean Society for Railway
• /
• v.11 no.2
• /
• pp.188-194
• /
• 2008

Brake disks for rolling stock are exposed to thermal fatigue during braking, and thermal cracks occur on surface of disks. Thermal cracks can cause serious accidents, deterioration of braking performance and increase of maintenance cost due to frequent exchange of friction materials. In this study, candidate materials with high-heat resistance were selected by searching the literature. By using cast specimens made of the candidate materials, chemical composition, crystal structure and graphite type were analyzed. In addition, friction coefficient and wear were measured and compared with values for the disk material in service. As a result, it was shown that the NiCrMo has highest tensile strength and lowest friction coefficient and the disk material in service has the most stable friction characteristics.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.3
• /
• pp.21-30
• /
• 2018

Driven by the recent energy saving trend, conventional silicon based power conversion modules are being replaced by modules using silicon carbide. Previous papers have focused mainly on the electrical advantages of silicon carbide semiconductors that can be used to design switching devices with much lower losses than conventional silicon based devices. However, no systematic study of their thermomechanical reliability in power conversion modules using finite element method (FEM) simulation has been presented. In this paper, silicon and silicon carbide based power devices with three-phase switching were designed and compared from the viewpoint of thermomechanical reliability. The switching loss of power conversion module was measured by the switching loss evaluation system and measured switching loss data was used for the thermal FEM simulation. Temperature and stress/strain distributions were analyzed. Finally, a thermal fatigue simulation was conducted to analyze the creep phenomenon of the joining materials. It was shown that at the working frequency of 20 kHz, the maximum temperature and stress of the power conversion module with SiC chips were reduced by 56% and 47%, respectively, compared with Si chips. In addition, the creep equivalent strain of joining material in SiC chip was reduced by 53% after thermal cycle, compared with the joining material in Si chip.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.38 no.12
• /
• pp.1431-1434
• /
• 2014

The thermal barrier coating (TBC) applied to a gas turbine can be damaged by repeated thermal fatigue during operation, so an evaluation of its durability is needed. Thermally grown oxide (TGO) is generated inside the TBC in a high-temperature environment. The growth of TGO is known to be the main cause of damage to the TBC. Therefore, the durability of TBC should be evaluated according to the growth of TGO. In this research, Kim et al.'s work on the growth of TGO with aging was used as a basis for finite element analysis. The relationship between stress and aging was derived from the finite element analysis results. The durability of the TBC with aging was evaluated through a comparison between the results of the finite element analysis and a bond strength test.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.25-29
• /
• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.