• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.2
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• pp.157-164
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• 2017

A parallel slide gate valve (PSGV) is located between the heat recovery steam generator (HRSG) and the steam turbine in a combined cycle power plant (CCPP). It is used to control the flow of steam and runs with repetitive operations such as startups, load changes, and shutdowns during its operation period. Therefore, it is necessary to evaluate the fatigue damage and the structural integrity under a large compressive thermal stress due to the temperature difference through the valve wall thickness during the startup operations. In this paper, the thermal-structural analysis and the fatigue life evaluation of a 16-inch PSGV, which is installed on the HP steam line, is performed according to the fatigue life assessment method described in the ASME B&PVC VIII-2; the method uses the equivalent stress from the elastic stress analysis.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.71-78
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• 2014

Although the fatigue design curve of ASME Code has enough margin with respect to alternating stress and cycles, the welding residual stress(WRS) should be included in fatigue analysis. In this paper, WRS distribution in a nozzle with dissimilar metal weldment was obtained by finite element analysis and was added in fatigue analysis. The fatigue analysis was performed by following the ASME Code including thermal and stress analysis applying with postulated 30 transient conditions. The calculated results of a cumulative fatigue usage factors(CUF) were compared for the case of the models with or without WRS effects. The results showed that the CUF at weldment and heat affected zone was affected by the WRS.

• Journal of Welding and Joining
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• v.17 no.1
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• pp.124-132
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• 1999

Thermal fatigue strength of the solder joints is the most critical issue for TSOP(Thin Small Outline Package) because the leads of this package are extremely short and thermal deformation cannot be absorbed by the deflection of the lead. And the TSOP body can be subject to early fatigue failures in thermal cycle environments. This paper was discussed distribution of thermal stresses at near the joint between silicon chip and die pad and investigated their reliability of solder joints of TSOP with 42 alloy clad lead frame on printed circuit board through FEM and 3 different thermal cycling tests. It has been found that the stress concentration around the encapsulated edge structure for internal crack between the silicon chip and Cu alloy die pad. And using 42 alloy clad, The reliability of TSOP body was improved. In case of using 42 alloy clad die pad(t=0.03mm). $$\sigma$_{VMmax}$ is 69Mpa. It is showed that 15% improvement of the strength in the TSOP body in comparison with using Cu alloy die pad $($\sigma$_{VMmax}$=81MPa). In solder joint of TSOP, the maximum equivalent plastic strain and Von Mises stress concentrate on the heel of solder fillet and crack was initiated in it's region and propagated through the interface between lead and solder. Finally, the modified Manson-Coffin equation and relationship of the ratio of $N_{f}$ to nest(η) and cumulative fracture probability(f) with respect to the deviations of the 50% fracture probability life $(N_{f 50%})$ were achieved.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.9
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• pp.2133-2141
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• 1995

The thermo-mechanical fatigue tests were performed on the specimens extracted from 1.5Cr-0. 67Mo-0.33V alloy. The characteristics of thermo-mechanical fatigue crack propagation were examined and reviewed in view of fracture mechanics. The results obtained from the present study are summarized as follows : (1) The propagation characteristics of isothermal low-cycle fatigue crack are dominated by .DELTA.J$_{f}$ in case of PP waveform, and .DELTA.J$_{c}$ in case of CP waveform. (II)The propagation characteristics of thermo-mechanical fatigue crack are dominated by .DELTA.J$_{c}$ for in-phase case, and by .DELTA.J$_{c}$ for out-of-phase. The present results were in good agreement with the equation of propagation law for isothermal low-cycle fatigue crack in case of thermo-mechanical fatigue.tigue.e.

• Tribology and Lubricants
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• v.15 no.2
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• pp.150-155
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• 1999

The rolling fatigue lives (RFL) of five kinds of silicon nitride balls were investigated. Four kinds of Si$_3$N$_4$balls were fabricated using different raw materials, sintering aids and sintering conditions. Commercially available Si$_3$N$_4$ball was also studied for comparison. All the balls were finished up to the dimensional accuracy of Grade 10 defined in KS B 2001 (Steel Balls fer Ball Bearings) with a size of 9.525 mm. RFL tests were then conducted under the initial theoretical maximum contact stress 6.38 GPa and the spindle speed 10,000 rpm. Gear oil was provided by oiled race as lubricant. The results of RFL test indicated the prerequisitic conditions for the long rolling life of Si$_3$N$_4$ball : (1) the high density, (2) microstructures consisted of small uniformly distributed grains, (3) little glassy phase in grainboundary, and (4) little crystalline phase and secondary phase that induces residual thermal stress due to the differences of thermal expansion coefficient with Si$_3$N$_4$phase.

• Smart Structures and Systems
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• v.6 no.9
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• pp.1041-1056
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• 2010

This paper investigates the possibility of a strategy for an automatic full recover of a structural component undergoing loading-unloading (fatigue) cycles: full recover means here that no replacement is required at the end of the mission. The goal is to obtain a material capable of self healing earlier before the damage becomes irreversible. Attention is focused on metallic materials, and in particular on shape memory alloys, for which the recovering policy just relies on thermal treatments. The results of several fatigue tests are first reported to acquire a deep understanding of the physical process. Then, for cycles of constant amplitude, the self-healing objective is achieved by mounting, on the structural component of interest, a suitable microcontroller. Its input, from suitable sensors, covers the current stress and strain in the alloy. The microcontroller elaborates from the input the value of a decisional parameter and activates the thermal process when a threshold is overcome.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.4
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• pp.151-157
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• 2014

The degradation mechanisms of thermal barrier coatings (TBCs) were investigated in different thermal fatigue condition in terms of microstructural analyses. The isothermal and cyclic oxidation tests were conducted to atmospheric plasma sprayed-TBCs on NIMONIC 263 substrates. The delamination occurred by the oxide layer formation at the interface, the Ni/Cr-based oxide was formed after Al-based oxide layer grew up to ${\sim}10{\mu}m$ in the isothermal condition. In the cyclic oxidation with dwell time, the failure occurred earlier (500 hr) than in the isothermal oxidation (900 hr) at same temperature. The thickness of Al-based oxide layer of the delaminated specimen in the cyclic condition was ${\sim}4{\mu}m$ and the interfacial cracks were observed. The acoustic emission method revealed that the cracks generated during the cooling step. It was considered that the specimens were prevented from the formation of the Al-based oxide by cooling treatment, and the degradation mode in the cyclic test was dominantly interfacial cracking by the difference of thermal expansion coefficients of the coating layers.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.1
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• pp.13-19
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• 2013

This study examines thermal safety on three-way catalyst that dominates 70% among whole exhaust gas purification device in 2003. Three-way catalyst maintains high temperature in interior domain but maintains low temperature on outside surface. Therefore this device shows tensile stress on outside surface. Temperature distribution of three-way catalyst was acquired by thermal flow analysis for predicted thermal flow parameter. Thermal stress analysis for three-way catalysis was performed based on this temperature distribution. Thermal safety of three-way catalyst was estimated by strength reduction factor and failure probability.

• Journal of the Korean institute of surface engineering
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• v.34 no.1
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• pp.3-9
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• 2001

The purpose of this study is to evaluate the properties of the functional gradient thermal barrier coatings by plasma spray process. The evaluations of mechanical and thermal properties such as fatigue, oxidation and wear-resistance at high temperatures have been conducted. Furthermore, residual stress and bond strength have been evaluated. The range of thickness of coated layers was 550~600$\mu\textrm{m}$. The range of hardness of layers was 800~900 Hv and the porosity range of coatings was about 7 to 14%. The top coating layer of $ZrO_2$ in thermal barrier was composed of tetragonal structure after spraying. The coated layers of $ZrO_2$ on the Inconel substrate is the best resistance for thermal fatigue. Those coatings had the least compressive stress in comparison with other coatings. In high temperature oxidation test, the coatings on Inconel substrate was better than the coatings on SUS substrate. The bond strength of the concave type was greater than that of linear types and convex types coatings.