• The Journal of Korean Academy of Prosthodontics
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• v.28 no.1
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• pp.165-191
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• 1990

Although a number of studies have been performed to assure that residual stress caused by a mismatch of alloy porcelain thermal expansion can contribute to clinical failure of a ceramometal restoration, the interactive influence of cooling rate on the magnitude of thermal expansion difference and on bond strength between them have not been extensively analyzed. The objective of this study was to determine the influence of cooling rate and the number of firing cycles on the expansion mismatch and the flexural failure resistance of metal porcelain strip. Tested alloys included one Pd-Ag alloy, one Ni-Cr-Be alloy with two kinds of porcelain, Vita and Ceramco. Metal specimens were cast into rods with a height of 13mm and a diameter of 5mm. Subsequently, the castings were subjected to scheduled firing cycles without porcelain. And the porcelain specimens after being fired were trimmed into a bar with a final dimension of $5{\times}5{\times}25mm$. Thermal expansions of the alloys and porcelains were measured by using a push rod or a differential dialometer respecitvely. Porcelain glass transition temperatures and expansion values were derived alloy-porcelain pairs were assessed by comparing expansion values of the components at a porcelain glass transition temperature. Calculations were made using combinations of a Ni-Cr alloy or Pd-Ag alloy with each of two porcelain products. Metal-porcelain strip specimens were subjected to four point loading in an Instron testing machine until crack occured at the metal-cramic interface at the time of sharp decrease of load on recorder. On the basis of this study, the following conclusions may be stated: 1. Regardless of the kinds of ceramometal combinations, both of calculated and experimental data revealed that the double fired specimens exhibited a significantly lower flexural strength. 2. By the rise of the amount of mismatch, bond strength were decreased. 3. Thermal expansion value of Pd-Ag alloys were higher than that of Ni-Cr alloys. 4. Expansion curves of metal were proportional to the increase of temperature and were not affected by the experimental conditions, however porcelains did not show the same magnitude of metal, and a shift of the glass transition temperature to higher temperatures was observed when cooled rapidly 5. Alloy-porcelain thermal compatibility appeared more dependent on the porcelain than the alloy.

• The Journal of Korean Academy of Prosthodontics
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• v.29 no.1
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• pp.111-137
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• 1991

Although a number of studies have been performed to assure that residual stress caused by a mismatch of alloy porcelain thermal expansion can contribute to clinical failure of a ceramometal restoratoin, the interactive influence of cooling rate on the magnitude of thermal expansion difference and on bond strength between them have not been extensively analyzed. The objective of this study was to determine the influence of cooling rate and the number of firing cycles on the expansion mismatch and the flexural failure resistance of metal porcelain strip. Tested alloys included one Pd-Ag alloy, one Ni-Cr-Be alloy with two kinds of porcelain, Vita and Ceramco. Metal specimens were cast into rods with a height of 13mm and a diameter of 5mm. Subsequently, the castings were subjected to scheduled firing cycles without porcelain. And the porcelain specimens after being fired were trimmed into a bar with a final dimension of 5 x 5 x 25mm. Thermal expansions of the alloys and porcelains were measured by using a push rod or a differential dialometer respectively. Porcelain glass transition temperatures and expansion values were derived alloy- porcelain pairs were assessed by comparing expansion values of the components at a porcelain glass transition temperature. Calculations were made using combinations of a Ni-Cr alloy or Pd-Ag alloy with each of two porcelain products. Metal- porcelain strip specimens were subjected to four point loading in an Instron testing machine until crack occured at the metal-cramic interface at the time of sharp decrease of load on recorder. On the basis of this study, the following conclusions may be stated : 1. Regardless of the kinds of ceramometal combinations, both of calculated and experimental data revealed that the double fired specimens exhibited a significantly lower flexural strength. 2. By the rise of the amount of mismatch, bond strength were decreased. 3. Thermal expansion value of Pd-Ag alloys were higher than of Ni-Cr alloys. 4. Expansion curves of metal were proportional to the increase of temperature and were not affected by the experimental conditions, however porcelains did not show the same magnitude of metal, and a shift of the glass transition temperature to higher temperatures was observed when cooled rapidly. 5. Alloy- porcelain thermal compatibility appeared more dependent on the porcelain than the alloy.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• Journal of the Korean Ceramic Society
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• v.34 no.1
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• pp.88-94
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• 1997

The oxidation behavior of the NiCrAlY bond coat and thermal fatigue failure in the plasma-sprayed thermal barrier coating system, ZrO2.8wt%Y2O3 top coat/Ni-26Cr-5Al-0.5Y bond coat/Hastelloy X superalloy substrate, in commercial use for finned segment of gas turbine burner were investigated. The main oxides formed in the bond coat were NiO, Cr2O3, and Al2O3. It divided the oxide distribution at this interface into two types whether an Al2O3 thin layer existed beneath ZrO2/bond coat interface before operation at high temperature or not. While a continuous layer of NiO was formed mainly in the region where the Al2O3 thin layer was present, the absence of it resulted in the formation of mixture of Cr2O3 and Al2O3 beneath NiO layer. Analyses on the fracture surface of specimen spalled by thermal cycling showed that spalling occurred mainly along the ceram-ic coat near ZrO2/bond coat oxide layer interface, but slightly in the oxide layer region.

• Nuclear Engineering and Technology
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• v.53 no.4
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• pp.1236-1249
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• 2021

Although there are still controversial opinions and uncertainty on application of SiC_f/SiC composite cladding as next-generation cladding material for its great oxidation resistance in high temperature steam environment and other outstanding advantages, it cannot deny that SiC_f/SiC cladding is a potential accident tolerant fuel (ATF) cladding with high research priority and still in the engineering design stage for now. However, considering its disadvantages, such as low irradiated thermal conductivity, ductility that barely not exist, further evaluations of its in-pile behaviors are still necessary. Based on the self-developed code we recently updated, relevant thermohydraulic and mechanical models in FROBA-ATF were applied to simulate the cladding behaviors under normal and accident conditions in this paper. Even through steady-state performance analysis revealed that this kind of cladding material could greatly reduce the oxidation thickness, the thermal performance of UO₂-SiC was poor due to its low inpile thermal conductivity and creep rate. Besides, the risk of failure exists when reactor power decreased. With geometry optimization and dopant addition in pellets, the steady-state performance of UO₂-SiC was enhanced and the failure risk was reduced. The thermal and mechanical performance of the improved UO₂-SiC was further evaluated under Loss of coolant accident (LOCA) and Reactivity Initiated Accident (RIA) conditions. Transient results showed that the optimized ATF had better thermal performance, lower cladding hoop stress, and could provide more coping time under accident conditions.

• Korean Journal of Metals and Materials
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• v.47 no.12
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• pp.842-851
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• 2009

The long-term reliability of Sn-0.3wt%Ag-0.7wt%Cu solder joints was evaluated and compared with Sn-3.0wt%Ag-0.5wt%Cu under thermal shock conditions. Test vehicles were prepared to use Sn-0.3Ag-0.7Cu and Sn-3.0Ag-0.5Cu solder alloys. To compare the shear strength of the solder joints, 0603, 1005, 1608, 2012, 3216 and 4232 multi-layer ceramic chip capacitors were used. A reflow soldering process was utilized in the preparation of the test vehicles involving a FR-4 material-based printed circuit board (PCB). To compare the shear strength degradation following the thermal shock cycles, a thermal shock test was conducted up to 2,000 cycles at temperatures ranging from $-40^{\circ}C$ to $85^{\circ}C$, with a dwell time of 30 min at each temperature. The shear strength of the solder joints of the chip capacitors was measured at every 500 cycles in each case. The intermetallic compounds (IMCs) of the solder joint interfaces werealso analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS). The results showed that the reliability of Sn-0.3Ag-0.7Cu solder joints was very close to that of Sn-3.0Ag-0.5Cu. Consequently, it was confirmed that Sn-0.3Ag-0.7Cu solder alloy with a low silver content can be replaced with Sn-3.0Ag-0.5Cu.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.27 no.3
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• pp.191-198
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• 2014

In this paper, structural integrity evaluation of reactor pressure vessel bottom head without penetration nozzles in core melting accident has been performed. Considering the analysis results of thermal load, weight of molten core debris and internal pressure, thermal load is the most significant factor in reactor vessel bottom head. The failure probability was evaluated according to the established failure criteria and the evaluation showed that the equivalent plastic strain results are lower than critical strain failure criteria. Thermal-structural coupled analyses show that the existence of elastic zone with a lower stress than yield strength is in the middle of bottom head thickness. As a result of analysis, the elastic zone became narrow and moved to the internal wall as the internal pressure increases, and it is evaluated that the structural integrity of reactor vessel is maintained under core melting accident.

• Elastomers and Composites
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• v.40 no.3
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• pp.196-203
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• 2005

In this work, the engine oil resistant evaluation and breakdown analysis of room temperature vulcanizing silicone adhesives were performed through the surface properties, thermal stabilities, adhesive strength, and morphology measurements. As a result, the permeation of engine oil into adhesive specimens was carried out from surface to center in the specimens. And the oil content in the adhesive specimens was increased and the Si-O-Si bond of the adhesives was decomposed with increasing the aging time. The TGA results indicated that the thermal degradation was mainly occurred at under and surfaces of the specimens. The tensile strength, elongation, and adhesive strength of the adhesives were significantly decreased after the engine oil resistant tests, which could be attributed to the initial lose of adhesive properties resulting from the engine oil absorption and thermal aging. And the failure mode of the adhesive specimens was changed from cohesive failure to interfacial failure.

• Journal of the Korean Society of Safety
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• v.33 no.4
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• pp.1-7
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• 2018

This paper is analyzed for the thermal characteristics(1 year) of the 6 components(DC breaker, DC filter(including capacitor and discharge resistance), IGBT(Insulated gate bipolar mode transistor), AC filter, AC breaker, etc.) of a photovoltaic power generation-based PCS(Power conditioning system) below 20 kW. Among the modules, the discharge resistance included in the DC filter indicated the highest heat at $125^{\circ}C$, and such heat resulting from the discharge resistance had an influence on the IGBT installed on the rear side the board. Therefore, risk priority through risk priority number(RPN) of FMEA(Failure modes and effects analysis) sheet is conducted for classification into top 10 %. According to thermal characteristics and FMEA, it is necessary to pay attention to not only the in-house defects found in the IGBT, but also the conductive heat caused by the discharge resistance. Since it is possible that animal, dust and others can be accumulated within the PCS, it is possible that the heat resulting from the discharge resistance may cause fire. Accordingly, there are two options that can be used: installing a heat sink while designing the discharge resistance, and designing the discharge resistance in a structure capable of avoiding heat conduction through setting a separation distance between discharge resistance and IGBT. This data can be used as the data for conducting a comparative analysis of abnormal signals in the process of developing a safety device for solar electricity-based photovoltaic power generation systems, as the data for examining the fire accidents caused by each module, and as the field data for setting component management priorities.

• Journal of Korean Society for Quality Management
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• v.32 no.4
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• pp.242-251
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• 2004

Several statistical methods are introduced 1=o analyze the accelerated failure time data. Most frequently used method is the log-linear approach with parametric assumption. Since the accelerated failure time experiments are exposed to many environmental restrictions, parametric log-linear relationship might not be working properly to analyze the resulting data. The models proposed by Buckley and James(1979) and Stute(1993) could be useful in the situation where parametric log-linear method could not be applicable. Those methods are introduced in accelerated experimental situation under the thermal acceleration and discussed through an illustrated example.