• Title/Summary/Keyword: Thermal Failure

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Thermal stress of concrete structure at high temperature considering inelastic thermal strain change (고온에서의 비선형 변형도를 고려한 콘크리트 구조물에서의 열응력 분포)

  • 강석원;홍성걸;신영수
    • Proceedings of the Korea Concrete Institute Conference
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    • 2000.10b
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    • pp.1145-1150
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    • 2000
  • Concrete behaves as ductile material at high temperature. The existing stress-strain relationship is not valid at high temperature condition. Thus, stress-strain curve of concrete at high temperature is re-established by modifying Saenz's suggestion in this study. A constitutive model of concrete subjected to elevated temperature is also suggested. The model consists of three components; free thermal stain, mechanical strain and thermal creep strain. As the temperature increase, the thermal creep becomes more critical to the failure of concrete. The thermal creep strain of concrete is derived from the modified power-law relation for the steady state creep. The proposed equation for thermal creep employs a Dorn's temperature compensated time theorem

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Thermal and telemetry module design for satellite camera

  • Kong, Jong-Pil;Yong, Sang-Soon;Heo, Haeng-Pal;Kim, Young-Sun;Youn, Heong-Sik
    • Proceedings of the KSRS Conference
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    • 2002.10a
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    • pp.229-234
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    • 2002
  • Under the hostile influence of the extreme space environmental conditions due to the deep space and direct solar flux, the thermal control in space applications is especially of major importance. There are tight temperature range restrictions for electro-optical elements while on the other hand there are low power consumption requirements due to the limited energy sources on the spacecraft. So, we usually have strong requirement of thermal and power control module in space applications. In this paper, the design concept of a thermal and power control module in the MSC(Multi-Spectral Camera) system which will be a payload on KOMPSATII is described in terms of H/W & S/W. This thermal and power control module, called THTM(Thermal and Telemetry Module) in MSC, resides inside the PMU(Payload Management Unit) which is responsible for the proper management of the MSC payload for controlling and monitoring the temperature insides the EOS(Electro-Optic System) and gathering all the analog telemetry from all the MSC sub-units, etc. Particularly, the designed heater controller has the special mode of "duty cycle" in addition to normal closed loop control mode as usual. THTM controls heaters in open loop according to on/off set time designed through analysis in duty cycle mode in case of all thermistor failure whereas it controls heaters by comparing the thermistor value to temperature based on closed loop in normal mode. And a designed THTM provides a checking and protection method against the failure in thermal control command using the test pulse in command itself.

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Thermal Stress-induced Edge Failure of Thin Composite Laminates (열응력에 의한 얇은 복합적층판의 자유경계단 부위 파손)

  • 이성혁;최낙삼
    • Composites Research
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    • v.12 no.1
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    • pp.28-36
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    • 1999
  • Thermal stress-induced failure in the free edge region of various thin carbon/epoxy composite laminates(1mm thick) has been investigated using the three-dimensional finite-element stress analysis, ultrasonic C-scan and microscopic observations. High thermal in-plane and interlaminar stresses were predicted in the interior layer near the free edge boundaries of the laminates. In the interior lamina, not in the skin lamina, of the thin laminates with lay-up of $[0_2/90_2]_s,\;[45_2/-45_0]_s,\;[0_2/60_2]_s$ treated by liquid $N_2$ immersion, many transverse matrix cracks took place due to thermal stress concentration, which agreed qualitatively with the above predictions.

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Thermal Characteristics Analysis by Ambient and Operating Temperature according to the Kinds of Terminations in Underground Power Cable Systems (지중송전케이블 종단접속함 종류에 따른 외기 및 운전온도에 의한 열특성 분석)

  • Jung, Chae-Kyun;Kang, Ji-Won;Lee, Bang-Wook
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.64 no.8
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    • pp.1154-1160
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    • 2015
  • This paper describes the thermal characteristics of underground power cable system terminations according to the change of ambient temperature as well as operating temperature. Recently, the failure has been gradually increasing in outdoor termination during winter season because the power demand was increased by electricity heating system. The power demand and outdoor temperature is difference between day time and night time. The temperature difference has an influence on conductor extension and shrinkage due to conductor force as well as thermal mechanical characteristics. These phenomena have daily repeated during heating and cooling period of conductors. In these cases, the insulation of outdoor terminations might be degraded by the reduced interface pressure surrounding stress relief cone. Therefore, in this paper, the thermal characteristics are variously analysed by simulation considering power demand and ambient temperature condition during winter season at epoxy type termination as well as slip-on type termination

Root cause analysis on the phenomenon of voltage drop of connector used in the automotive throttle body control (스로틀 바디 제어신호 전달용 커넥터의 이상전압 강하 현상 원인 규명)

  • Cho, Young-Jin;Chang, Seog-Weon
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1792-1797
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    • 2007
  • This paper try to find root-cause of failure in a connector used in transmitting signals for throttle body control in automotives by analyzing possible failure causes and performing experiments to simulate the cable failure in field. The connector comprises fins, wires, and case moldings. The failure is due to degradation of initial clamping force required fixing fins and wires in the connector. Expansion and compression of the case molding material surrounding fins would cause the degradation. Investigations of strict initial claming force and control of thermal expansion property of the molding are required to prevent the failure.

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Temperature, Current, and Voltage Dependences of Junction Failure in PIN Photodiodes

  • Park, Sahng-Gi;Sim, Eun-Deok;Park, Jeong-Woo;Sim, Jae-Sik;Song, Hyun-Woo;Oh, Su-Hwan;Baek, Yong-Soon
    • ETRI Journal
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    • v.28 no.5
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    • pp.555-560
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    • 2006
  • A PIN photodiode having a low dark current of 1.35 nA and a high external quantum efficiency of 95.3% fabricated for a passive optical network receiver. As the current was increased under a high voltage of 38 V and a temperature of $190^{\circ}C$, it was observed that there is a threshold current at 11 mA which induces a junction failure. Experimental data suggest that the junction failure occurs due to the crystal breaking at the end facet as a result of thermal heat or energetic carriers. This threshold behavior of junction failure is a valuable observation for the safe treatment of photodiodes. As long as the current is limited below the threshold currents, we have not observed failure events of our photodiodes.

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Prediction of Maintenance Period of Equipment Through Risk Assessment of Thermal Power Plants (화력발전설비 위험도 평가를 통한 기기별 정비주기 예측)

  • Song, Gee Wook;Kim, Bum Shin;Choi, Woo Song;Park, Myung Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.10
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    • pp.1291-1296
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    • 2013
  • Risk-based inspection (RBI) is a well-known method that is used to optimize inspection activities based on risk analysis in order to identify the high-risk components of major facilities such as power plants. RBI, when implemented and maintained properly, improves plant reliability and safety while reducing unplanned outages and repair costs. Risk is given by the product of the probability of failure (POF) and the consequence of failure (COF). A semi-quantitative method is generally used for risk assessment. Semi-quantitative risk assessment complements the low accuracy of qualitative risk assessment and the high expense and long calculation time of quantitative risk assessment. The first step of RBI is to identify important failure modes and causes in the equipment. Once these are defined, the POF and COF can be assessed for each failure. During POF and COF assessment, an effective inspection method and range can be easily found. In this paper, the calculation of the POF is improved for accurate risk assessment. A modified semi-quantitative risk assessment was carried out for boiler facilities of thermal power plants, and the next maintenance schedules for the equipment were decided.

Accelerated Thermal Aging Test for Predicting Lifespan of Urethane-Based Elastomer Potting Compound

  • Min-Jun Gim;Jae-Hyeon Lee;Seok-Hu Bae;Jung-Hwan Yoon;Ju-Ho Yun
    • Elastomers and Composites
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    • v.59 no.2
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    • pp.73-81
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    • 2024
  • In the field of electronic components, the potting material, which is a part of the electronic circuit package, plays a significant role in protecting circuits from the external environment and reducing signal interference among electronic devices during operation. This significantly affects the reliability of the components. Therefore, the accurate prediction and assessment of the lifespan of a material are of paramount importance in the electronics industry. We conducted an accelerated thermal aging evaluation using the Arrhenius technique on elastic potting material developed in-house, focusing on its insulation, waterproofing, and contraction properties. Through a comprehensive analysis of these properties and their interrelations, we confirmed the primary factors influencing molding material failure, as increased hardness is related to aggregation, adhesion, and post-hardening or thermal-aging-induced contraction. Furthermore, when plotting failure times against temperature, we observed that the hardness, adhesive strength, and water absorption rate were the predominant factors up to 120 ℃. Beyond this temperature, the tensile properties were the primary contributing factors. In contrast, the dielectric constant and loss tangent, which are vital for reducing signal interference in electric devices, exhibited positive changes(decreases) with aging and could be excluded as failure factors. Our findings establish valuable correlations between physical properties and techniques for the accurate prediction of failure time, with broad implications for future product lifespans. This study is particularly advantageous for advancing elastic potting materials to satisfy the stringent requirements of reliable environments.

Microstructure and Thermal Fatigue Properties of Flame-Sprayed Nickel-Based Coatings (니켈계 용사층의 조직 및 열피로 특성)

  • 김형준;권영각
    • Journal of the Korean institute of surface engineering
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    • v.29 no.3
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    • pp.163-175
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    • 1996
  • Flame-sprayed Ni-based coatings are investigated in order to improve the thermal fatigue properties of gray cast iron in the presence of water spraying. The results of thermal cycling tests from room temperature to $1100^{\circ}C$ indicate that thermal fatigue endurance is increased in the order of Ni-20%Cr, NiCr-6%Al, and Ni-5%Al. The thermal fatigue failure is caused by the formation of iron oxides between the coating and the substrate and then the thermal fatigue cracks have propagated either along the brittle iron oxide layer resulting in the spatting of the coatings in case of Ni-5%Al and NiCr-6%Al coatings or to the substrate resulting in the whole specimen fracture in case of Ni-20%Cr coating. It seems that the most governing factor for thermal fatigue resistance is the thermal expansion coefficient difference between the coating and the substrate. Microstructural variations before and after the tests are also discussed.

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Thermal Hazards of Polystyrene Polymerization Process by Bulk Polymerization (벌크 중합법에 의한 폴리스티렌 중합공정의 열적위험성)

  • Han, In-Soo;Lee, Jung-Suk;Lee, Keun-Won
    • Journal of the Korean Institute of Gas
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    • v.17 no.4
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    • pp.1-8
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    • 2013
  • The aim of this study is to assess thermal hazards of polystyrene polymerization process by bulk polymerization with accelerating rate calorimeter(ARC) and Multimax reactor system(MM). From this study, we found out that the polymerization process should be operated at reaction temperature of $120^{\circ}C{\sim}130^{\circ}C$. At reaction temperature over $130^{\circ}C$, there was a runaway reaction hazard due to the temperature control failure following a viscosity increase of reaction products. With a cooling failure of a reactor in the early stage of process operation at the reaction temperature ($120^{\circ}C{\sim}130^{\circ}C$), there was a high thermal hazard of burst of a reactor's rupture disk or explosion of a reactor caused by the rapid rise of temperature and pressure to $340^{\circ}C$, 5.3 bar respectively within 30 - 50 minutes.