• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.4
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• pp.102-106
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• 2002

Development of high speed feed drive system has been a major issue for the past few decades in machine tool industries. The reduction of the tool change time as well as rapid travel time can enhance the productivity. However, the high speed feed drive system generates more heat in nature, which leads thermal expansion that has adverse effects on the accuracy of machined parts. The detail of the model proposed is described in the paper together with the experimental methodologies using a proposed compact measurement system to examine the validity of the proposed approach. The results showed the machining accuracy could be maintained to better than $\pm$ 5$\mu\textrm{m}$ while using this sensor.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.263-268
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• 1998

Development of high speed feed drive system has been a major issue for the past few decades in machine tool industries. The reduction of the tool change time as well as rapid travel time can enhance the productivity. However, the high speed feed drive system generates more heat in nature, which leads thermal expansion that has adverse effects on the accuracy of machined parts. The detail of the model proposed is described in the paper together with the experimental methodologies using a proposed compact measurement system to examine the validity of the proposed approach. The results showed the machining accuracy could be maintained to better than $\pm$5${\mu}{\textrm}{m}$ while using this T-18 sensor

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Transactions of Materials Processing
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• v.19 no.7
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• pp.405-410
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• 2010

Double layered tube that has been used for transportation and oil piping system is occasionally exposed to elevated temperature. The change in stress state at elevated temperature is important for the safe design of double layered tube. In this study, the variation of stress state for hydroformed double layered tube of which inner tube is stainless steel and outer tube is mild steel has been analytically analyzed. To characterize the thermal stress at elevated temperature, analytical model to provide thermal stresses between outer tube and inner tube was developed by using theories of elasticity and Lame equation. The feasibility of analytical model is verified by finite element analysis using ANSYS $CLASSIC^{TM}$, commercially available code. The variation of thermal stress at various thickness combination of inner and outer tube has also been investigated by proposed analytical model.

• Journal of the Korean Society for Nondestructive Testing
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• v.17 no.2
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• pp.89-99
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• 1997

Although discontinuously reinforced metal matrix composite(MMC) is one of the most promising materials for applications of aerospace, automotive industries, the thermal residual stresses developed in the MMC due to the mismatch in coefficients of thermal expansion between the matrix and the fiber under a temperature change has been pointed out as one of the serious problem in practical applications. There are very limited nondestructive techniques to measure the residual stress of composite materials. However, many difficulties have been reported in their applications. Therefore it is important to establish analytical model to evaluate the thermal residual stress of MMC for practical engineering application. In this study, an elastic model is developed to predict the average thermal residual stresses in the matrix and fiber of a misoriented short fiber composite. The thermal residual stresses are induced by the mismatch in the coefficient of the thermal expansion of the matrix and fiber when the composite is subjected to a uniform temperature change. The model considers two-dimensional in-plane fiber misorientation. The analytical formulation of the model is based on Eshelby's equivalent inclusion method and is unique in that it is able to account for interactions among fibers. This model is more general than past models to investigate the effect of parameters which might influence thermal residual stress in composites. The present model is to investigate the effects of fiber volume fraction, distribution type, distribution cut-off angle, and aspect ratio on thermal residual stress for in-plane fiber misorientation. Fiber volume fraction, aspect ratio, and distribution cut-off angle are shown to have more significant effects on the magnitude of the thermal residual stresses than fiber distribution type for in-plane misorientation.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.365-370
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.523-524
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• 2010

• Laser Solutions
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• v.4 no.3
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• pp.40-44
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• 2001

Microbump formation during CO$_2$ laser texturing of glass substrates is examined in this paper. Experimental results show that different bump shapes (dome-shaped, with a central dimple, and with a peripheral rim) are generated depending on the laser fluence. A theoretical model for the process is suggested based on thermoelastic behavior but limited only to the dome-shaped bump. The dimensions (maximum height and base area) of the bump shows a logarithmic dependence on laser fluence as expected from the theory. Numerical computation reveals that the effect of thermal diffusion is not negligible for relatively long laser pulses.

• Composites Research
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• v.12 no.6
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• pp.1-7
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• 1999

The change of the coefficients of thermal expansion(CTE) of Carbon/Epoxy was investigated for the temperature variation and a prediction model for the change of CTE was proposed. Elastic properties and CTEs in the principal material directions were measured in the range of room temperature to cure temperature and characterized as functions of temperature. By applying the characterized properties to the classical lamination theory, a computational method to predict the change of CTEs of a general laminate for temperature variation was proposed. the coefficients of thermal expansion of laminates with various stacking sequences were measured and compared with those predicted. Good agreements between the predicted results and the experimental data show that the c hanges of CTEs of a general laminate for temperature variation can be predicted well by using the proposed method.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.53 no.9
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• pp.538-544
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• 2004

This paper presents the interruption capability of serial-hybrid type GCB (gas circuit breaker) compared with that of puffer type. First a puffer type model interrupter which has the stroke length of 80 mm has been designed and manufactured. And also, a serial-hybrid type interrupter which has the same design parameters as the puffer type interrupter except the serially arranged thermal-expansion chamber and puffer cylinder has been fabricated. Using a simplified synthetic test facility, the critical interruption capabilities of the two GCBs have been estimated. The critical di/dt, the critical dV/dt of ITRV (initial transient recovery voltage) and the minimum arcing time of the puffer type model GCB were 10.7 A/${\mu}\textrm{s}$, 5.5 kV/${\mu}\textrm{s}$, and 15.0 ms respectively. In the case of serial-hybrid type model GCB, each of the values was 16.6A/${\mu}\textrm{s}$, 11.5 kV/${\mu}\textrm{s}$ and 13.0 ms. As a conclusion of this work, it has been quantitatively confirmed that the hybrid type interrupter can obtain the sufficient interruption capability at the operating force which is so low that puffer type interrupter has not the interruption capability.