• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.9
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• pp.114-121
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• 2004

Thermal design changes and analysis on the engineering model of Command Telemetry Unit(CTU) for a geostationary communications satellite arc performed for the purpose of developing an engineering qualification model. A thermal model is developed by using power consumption measurement values of each functional board and thermal cycling test results. In modeling heat dissipated EEE parts, heat dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board. All the EEE parts of CTU meet the requirement of their allowable temperature range when placed on the engineering qualification level of thermal vacuum environments in accordance with the proposed thermal design changes.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.11 s.242
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• pp.1480-1487
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• 2005

Metal matrix composites(MMCs) have been rapidly becoming one of the strongest candidates for structural materials fur many high temperature application. However, among the various high temperature environments in which metal matrix composites was applied, thermal shock is known to cause significant degradation in most MMC system. Due to the appreciable difference in coefficient of thermal expansion(CTE) between reinforcement and metal matrix, internal stresses are generated following temperature changes. Infernal stresses affect degradation of mechanical properties of MMC by causing microscopic damage in interface and matrix during thermal cycling. Therefore, the nondestructive evaluation on thermal shock damage behavior of SiC/A16061 composite has been carried out using ultrasonics. For this study, SiC fiber reinforced metal matrix composite specimens fabricated by a squeeze casting technique were thermally cycled in the temperature range 298$\~$673 K up to 1000cyc1es. Three point bending test was conducted to investigate the efffct of thermal shock damage on mechanical properties. The relationship between thermal shock damage behavior and the propagation characteristics of surface wave and SH-ultrasonic wave was discussed by considering the result of SEM observation of fracture surface.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.7-15
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• 2008

In this paper, the Chip-On-Flex (COF) assembly process using anisotropic conductive films (ACFs) was investigated and the reliability of COF assemblies using ACFs was evaluated. Thermo-mechanical properties of ACFs such as coefficient of thermal expansion (CTE), storage modulus (E'), and glass transition temperature $(T_g)$ were measured to investigate the effects of ACF material properties on the reliability of COF assemblies using ACFs. In addition, the bonding conditions for COF assemblies using ACFs such as time, temperature, and pressure were optimized. After the COF assemblies using ACFs were fabricated with optimized bonding conditions, reliability tests were then carried out. According to the reliability test results, COF assemblies using the ACF which had lower CTE and higher $T_g$ showed better thermal cycling reliability. Consequently, thermo-mechanical properties of ACFs, especially $T_g$, should be improved for high thermal cycling reliability of COF assemblies using ACFs for compact camera module (CCM) applications.

• Advanced Composite Materials
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• v.18 no.1
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• pp.61-75
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• 2009

The effect of porous matrix on thermal fatigue behavior of 3D-orthogonally woven SiC/SiC composite was evaluated in comparison with that having relatively dense matrix. The porous matrix yields open air passages through its thickness which can be utilized for transpiration cooling. On the other hand, the latter matrix is so dense that the air passages are sealed. A quantity of the matrix was varied by changing the number of repetition cycles of the polymer impregnation pyrolysis (PIP). Strength degradation of composites under thermal cycling conditions was evaluated by the $1200^{\circ}C$/RT thermal cycles with a combination of burner heating and air cooling for 200 cycles. It was found that the SiC/SiC composite with the porous matrix revealed little degradation in strength during the thermal cycles, while the other sample showed a 25% decrease in strength. Finally it was demonstrated that the porous structure in 3D-SiC/SiC composite improved the thermal fatigue durability.

• Bulletin of the Korean Chemical Society
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• v.28 no.12
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• pp.2226-2230
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• 2007

As a cathode material of lithium rechargeable batteries, charged Li[Co0.1Ni0.15Li0.2Mn0.55]O2 electrodes, which were aged thermally at 25 oC and 90 oC respectively, were characterized by means of charge/discharger, impedance spectroscopy, and X-ray diffraction. The discharge capacity diminution of the electrodes aged at 25 oC and 90 oC for 1 week was 4% and 23%, respectively. The cell aged at 25 oC was recovered on cycling. However, the capacity loss after ageing at 90 oC was not recovered in a subsequent cycling test, which demonstrates that the reaction occurring during ageing at 90 oC is irreversible. A significant impedance increase of aged electrode at 90 oC is associated with irreversible capacity loss. The structural changes including phase transformation were not detected by XRD analysis, because it could be due to out of detection limit. After ageing, impedance was slightly decreased during subsequent cycling test. It could be explained the cyclic performance of aged sample is stable. The thermal stability was not deteriorated by ageing even at the high temperature of 90 oC.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

• Korean Journal of Materials Research
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• v.15 no.6
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• pp.375-381
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• 2005

High temperature oxidation behavior of thermal barrier coating (TBC) system (IN738 substrate + NiCoCrAlY or NiAl bond coat with or without Pt + yttria stabilized zirconia) prepared by air plasma spray (APS) process has been studied in order to understand the effect of Pt addition to bond coat on the stability of TBC system. Specimens were oxidized in thermal cycling and isothermal oxidation test at $1100^{\circ}C$. The Pt addition in TBC system with NiCoCrAlY bond coat showed a longer life time compared to that without addition of Pt. Pt addition to TBC system is believed to help the formation of more stable thermally grown oxide, $Al_2O_3$, at the TBC/bond coat interface, leading to a longer lifetime of TBC system.

• Corrosion Science and Technology
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• v.18 no.5
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• pp.182-189
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• 2019

A thin spray coating of inorganic black lithium polysilicate (IBLP) on black anodized AZ31B magnesium alloy was fabricated for better corrosion resistance and thermo-optical properties for thermal control of spacecraft components. The morphology of the specimens with and without IBLP-based spray coating was characterized by SEM-EDS techniques. Impedance and potentiodynamic measurements on the specimens revealed better corrosion resistance for the specimen with a thin coating of lithium polysilicate. This was primarily due to the presence of lithium polysilicate inside the micro-cracks of the black anodized specimen, restricting the diffusion paths for corrosive media. Environmental tests, namely, humidity, thermal cycling, thermo vacuum performance, were used to evaluate the space-worthiness of the coating. The thermo-optical properties of the coating were measured before and after each environmental test to ascertain its stability. The specimen with an IBLP-based spray coating showed enhanced thermo-optical properties, greater than ~0.90. Hence, the proposed coating demonstrated better handling, better corrosion resistance, and space-worthiness during the pre-launch phase owing to its improved thermo-optical properties.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.65-71
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• 2005

At present, Electronic industries push ahead to eliminate the Pb(Lead) -a hazardous material-from all products. Especially, we have performed to select the optimum standard composition of lead free alloy for the application to products for about 3 years from 2000. These days, we have the chance for applying to the mass-production. This project constructed the system for applying the lead free solders on consumer electronic products, which is one of the major products of the LG Electronics. To select the lead free solders with corresponding to the product features, we have passed through the test and applied with Sn-3.0Ag-0.5Cu alloy system to our products, and for the application to the high melting temperature composition, we secured the thermal resistance of the many parts and substrate and optimized the processing conditions. We have operated the temperature cycling test and the high temperature storage test under the standards to confirm the reliability of the products. On these samples, we considered the consequence of our decision by the operating test. For the long life time of the product, we have operated the temperature cycling test at $-45^{\circ}C\;-\;+125^{\circ}C$, 1 cycle/hour, 1000 cycles. Also we have tested the tin whisker growth about lead free plating on lead finish. We have analyzed with the SEM, EDS and any other equipment for confirming the failure mode at the joint and the tin whisker growth on lead free finish.

• Proceedings of the Korean Reliability Society Conference
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• 2001.06a
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• pp.337-337
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• 2001

High voltage ceramic capacitors are widely applied in power electronic circuits, such as filters, snubbers, and resonant circuits, due to their excellent features of high voltage endurance and low aging. This paper presents a result of failure analysis and reliability evaluation for high voltage ceramic capacitors. The failure nodes and failure mechanisms were identified in order to understand the failure physics in a component. The causes of failure mechanisms for zero resistance phenomena under withstanding voltage test in high voltage ceramic capacitors molded by epoxy resin were studied by establishing an effective closed-loop failure analysis. Also, the condition for dielectric breakdown was investigated. Particular emphasis was placed on breakdown phenomena at the ceramic-epoxy interface. The validity of the results in this study was confirmed by the results of accelerated testing. Thermal shock test as well as pressure cooker test for high voltage ceramic capacitor mounted on a magnetron were implemented. Delamination between ceramic and epoxy, which, might cause electrical short in underlying circuitry, can occur during curing or thermal cycling. The results can be conveniently used to quickly identify defective lots, determine mean time to failure (MTTF) of each lot at the level of Inspection, and detect major changes in the vendors processes.