• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2002년도 proceedings of the second asia international conference on tribology
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• pp.229-230
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• 2002

This paper presents the hot spot behaviors on the rubbing surface of ventilated disk brake by using finite element method. The depth of asperities on the rubbing surface is usually $2-3\;{\mu}m$ so the real contact area is microscopically. Non-uniform contacts between the disk and the pads lead to high local temperatures, which may cause the material degradation, and develops hot spots, thermal cracking, and brake system failures at the end. High contact asperity flash temperatures in rubbing systems, which is strongly related to the hot spot. It was generally known that high temperature over about $700^{\circ}C$ may form martensite on the cast iron which is material for automotive disk brakes. In this paper, the contact stress, temperature distribution and strain have been presented for the specific asperities of real contact area microscopically by using coupled thermal-mechanical analysis technique.

• Bulletin of the Korean Chemical Society
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• 제35권8호
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• pp.2277-2280
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• 2014

The contact properties between gold and poly(3-hexylthiophene) (P3HT) films having either of two distinct molecular orientations and orderings were investigated. Thermal treatment increased the molecular ordering of P3HT and remarkably reduced the contact resistance at the electrode/semiconductor interface, which enhanced the electrical performance. This phenomenon was understood in terms of a small degree of metal penetration into the P3HT film as a result of the thermal treatment, which formed a sharp interface at the contact interface between the gold electrode and the organic semiconductor.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2003년도 학술대회지
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• pp.335-340
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• 2003

This paper presents contact behavior of a perfluoroelastomer bonded door seal by a non-linear finite element method using the mechanical and thermal analysis. The shape effects are investigated for sealing performance of bonded door seal. Also maximum stress, temperature distribution and contact force are investigated. A bonded door seal was modeled three shape. The highest contact force occurs at model III(sunflower shape). The maximum stress of model III is lower than that of the others. The calculated FEM results show that the model III has excellent performance compared with other seal models.

• 소성∙가공
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• 제20권1호
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• pp.29-35
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• 2011

In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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• pp.513-514
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• 2006

A CFD analysis for a thermal mixing experiment during steam jet discharge was performed to develop the analysis methodology for the thermal mixing between steam and subcooled water and to find the optimized numerical method. In the CFD analysis, the steam condensation phenomena by a direct contact was modelled by the so-called condensation region model. The comparison of the CFD results with the test data showed a good agreement as a whole, but a small temperature difference was locally found at some locations. However, the commercial CFD code of CFX4.4 together with the condensation region model can simulate the thermal mixing behaviour reasonably well when a sufficient number of mesh distribution and a proper numerical method are adopted

• 한국분말재료학회지
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• 제24권5호
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• pp.377-383
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• 2017

Microstructure, electric, and thermal properties of the Ta-Cu composite is evaluated for the application in electric contact materials. This material has the potential to be used in a medium for a high current range of current conditions, replacing Ag-MO, W, and WC containing materials. The optimized SPS process conditions are a temperature of $900^{\circ}C$ for a 5 min holding time under a 30 MPa mechanical pressure. Comparative research is carried out for the calculated and actual values of the thermal and electric properties. The range of actual thermal and electric properties of the Ta-Cu composite are 50~300 W/mk and 10~90 %IACS, respectively, according to the compositional change of the 90 to 10 wt% Ta-Cu system. The results related to the electric contact properties, suggest that less than 50 wt% of Ta compositions are possible in applications of electric contact materials.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.416-423
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• 2004

This paper presents the thermal characteristic analysis of a high-speed horizontal machining center with spindle speed of 50,000rpm and feedrate of 120m/fin. The spindle system is designed based on the built-in motor, angular contact ceramic ball bearings, oil-air lubrication and oil-jacket cooling method. The X-axis and Y-axis feeding systems are composed of the linear motors and linear motion guides, and the Z-axis feeding system is composed of the servo-motor, ball screw and linear motion guides. The thermal characteristics such as the temperature distribution, temperature rise, thermal deformation and step response, are estimated based on the finite element model of machining center and the heat generation rates of heat sources related to the machine operation conditions. Especially, the thermal time constant assessed from the step response function is introduced as an index of thermal response characteristics.

• 한국공작기계학회논문집
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• 제13권5호
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• pp.30-37
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• 2004

This paper presents the thermal characteristic analysis of a high-speed horizontal machining center with spindle speed of 50,000rpm and feedrate of 120m／min. The spindle system is designed based on the built-in motor, angular contact ceramic ball bearings, oil-air lubrication and oil-jacket cooling method. The X-axis and Y-axis feeding systems are composed of the linear motors and linear motion guides, and the Z-axis feeding system is composed of the servo-motor, ball screw and linear motion guides. The thermal characteristics such as the temperature distribution, temperature rise, thermal deformation and step response, are estimated based on the finite element model of machining center and the heat generation rates of heat sources related to the machine operation conditions. Especially, the thermal time constant assessed from the step response function is introduced as an index of thermal response characteristics.

• 한국초전도ㆍ저온공학회논문지
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• 제4권1호
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• pp.30-34
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• 2002

In this Paper, Insulation of current lead in the conduction-cooled DC reactor for the 1.2kV class 3 high-Tc superconducting fault current limiter(SFCL) is studied. Thermal link which conducts heat energy but insulates electrical energy is selected as a insulating device for the current lead in the conduction-cooled Superconducting DC reactor. It consists of oxide free copper(OFC) sheets, Polyimide films, glass fiberglass reinforced Plastics (GFRP) plates and interfacing material such an indium or thermal compound. Through the test of dielectric strength in L$N_2$, polyimide film thickness of 125 ${\mu}{\textrm}{m}$ is selected as a insulating material. Electrical insulation and heat conduction are contrary to each other. Because of low heat conductivity of insulator and contact area between electrical insulator and heat conductor, thermal resistance of conduction-cooled system is increased. For the reducing of thermal resistance and the reliable contact between Polyimide and OFC, thermal compound or indium can be used As thermal compound layer is weak layer in electrical field, indium is finally selected for the reducing of thermal resistance. Thermal link is successfully passed the test. The testing voltage was AC 2.5kVrms and the testing time was 1 hour.

• 한국전기전자재료학회논문지
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• 제24권2호
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• pp.152-155
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• 2011

Even though nano-scale materials were very advantageous for various applications, there are still problems to be solved such as the stabilization of surface state and realization of low contact resistances between a semiconducting nanowire and electrodes in nano-electronics. It is well known that the effects of contacts barrier between nano-channel and metal electrodes were dominant in carrier transportation in individual nano-electronics. In this report, it was investigated the electrical properties of GaN nanorod devices after chemical etching and rapid thermal annealing for making good contacts. After KOH wet-etching of the contact area the devices showed better electrical performance compared with non-treated GaN individual devices but still didn't have linear voltage-current characteristics. The shape of voltage-current properties of GaN devices were improved remarkably after rapid thermal annealing as showing Ohmic behaviors with further bigger conductivities. Even though chemical etching of the nanorod surfaces could cause scattering of carriers, in here it was shown that the most important and dominant factor in carrier transport of nano-electronics was realization of low contact barrier between nano-channel and metal electrodes surely.