• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.6
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• pp.440-443
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• 2010

We report a top-down approach based on atomic force microscopy (AFM) local anodic oxidation for the fabrication of the nano-pattern field effect transistors (FETs). AFM anodic oxidation is relatively a simple process in atmosphere at room temperature but it still can result in patterns with a high spatial resolution, and compatibility with conventional silicon CMOS process. In this work, we study nano-pattern FETs for various cross-bar distance value D, from ${\sim}0.5\;{\mu}m$ to $1\;{\mu}m$. We compare the optical characteristics of the patterned FETs and of the reference FETs based on both 2-dimensional simulation and experimental results for the wavelength from 100 nm to 900 nm. The simulated the drain current of the nano-patterned FETs shows significantly higher value incident the reference FETs from ${\sim}1.7\;{\times}\;10^{-6}A$ to ${\sim}2.3\;{\times}\;10^{-6}A$ in the infrared range. The fabricated surface texturing of photo-transistors may be applied for high-efficiency photovoltaic devices.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.6
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• pp.225-229
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• 2011

Most of the silicon cutting methods using the multi-wire with the slurry injection have been used for wafers of the crystalline solar cell. But the productivity of slurry injection cutting type falls due to low cutting speeds. Also, the direct contact with the metal wire and silicon block increases the concentration of metallic impurities in the wafer's surface. In addition, the abrasive silicon carbide (SiC) generates pollutants. And production costs are rising because it does not re-use the worn wire. On the other hand, the productivity of the cutting method using the diamond coated wire is about 2 times faster than the slurry injection cutting type. Also, the continuous cutting using the used wire of low wear is possible. And this is a big advantage for reduced production costs. Therefore, the cutting method of the diamond coated wire is more efficient than the slurry injection cutting technique. In this study, each cutting type is analyzed using the surface characteristics of the solar wafer and will describe the effects of the manufacturing process of the solar cell. Finally, we will suggest improvement methods of the solar cell process for using the diamond cutting type wafer.

• Journal of the Korean Solar Energy Society
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• v.39 no.5
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• pp.1-10
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• 2019

Recently, the installation capacity of PV (photovoltaic) systems has been increasing not only field installation but also floating PV, farm land, BIPV/BAPV. For this reason, the new design and materials of PV module are needed. In particular, in order to apply a PV system to a building, lightweight of the PV module is essential. PV modules made of generally used texturing glass are excellent in output and reliability, but there is a limit to the weight that can be reduced. For the lightweight of the PV module, it necessary to use a film instead of a glass. However, the application of film rather than a glass may cause various problems such as decrease in photocurrent by decrease in transmittance and a increase of CTM (cell to module) loss, a degradation of the reliability, and so on. In this paper, PV modules using Ultra barrier film, which is recently a lot of interest as a substitute for a glass, its characteristic analysis and reliability test were conducted. The transmittance and UV characteristics of each material were verified, and the output of the fabricated 1 cell PV module was measured. In addition, 24 cell PV modules were fabricated at the lab-scale and its reliability tests were conducted. As a result of the experiment, the reliability characteristics of the ultra barrier film PV module were excellent, and it was confirmed that it could be used as the front material of the PV module instead of glass