• Title/Summary/Keyword: Temperature compensation coefficient

Search Result 54, Processing Time 0.018 seconds

Development of Bi0.5(Na0.78K0.22)0.5TiO3 Lead-free Piezoelectric Ceramic Material with Core-shell Structure for Biomedical (바이오 메디컬용 코어-쉘 구조의 Bi0.5(Na0.78K0.22)0.5TiO3계 무연압전세라믹 소재의 개발)

  • Seong-jun Yun;Joonsoo Bae
    • Journal of Korean Society of Industrial and Systems Engineering
    • /
    • v.46 no.3
    • /
    • pp.15-22
    • /
    • 2023
  • BNKT Ceramics, one of the representative Pb free based piezoelectric ceramics, constitutes a perovskite(ABO3) structure. At this time, the perovskite structure (ABO3) is in the form where the corners of the octahedrons are connected, and in the unit cell, two ions, A and B, are cations, A ion is located at the body center, B ion is located at each corner, and an anion O is located at the center of each side. Since Bi, Na, and K sources constituting the A site are highly volatile at a sintering temperature of 1100℃ or higher, it is difficult to maintain uniformity of the composition. In order to solve this problem, there should be suppression of volatilization of the A site material or additional compensation of the volatilized. In this study, the basic composition of BNKT Ceramics was set to Bi0.5(Na0.78K0.22)0.5TiO3 (= BNKT), and volatile site (Bi, Na, and K sources) were coated in the form of a shell to compensate additionally for the A site ions. In addition, the physical and electrical properties of BNKT and its coated with shell additives(= @BNK) were compared and analyzed, respectively. As a result of analyzing the crystal structure through XRD, both BNKT(Core) and @BNK(Shell) had perovskite phases, and the crystallinity was almost similar. Although the Curie temperature of the two sintered bodies was almost the same (TC = 290 ~ 300 ℃), it was confirmed that the d33 (piezoelectric coefficient) and Pr (residual polarization) values were different. The experimental results indicated that the additional compensation for a shell additive causes the coarsening, resulting in a decrease in sintering density and Pr(remanent polarization). However, coating shell additives to compensate for A site ion is an effective way to suppress volatilization. Based on these experimental results, it would be the biggest advantage to develop an eco-friendly material (Lead-free) that replaced lead (Pb), which is harmful to the human body. This lead-free piezoelectric material can be applied to a biomedical device or products(ex. earphones (hearing aids), heart rate monitors, ultrasonic vibrators, etc.) and skin beauty improvement products (mask packs for whitening and wrinkle improvement).

Preparation of Humidity Sensor Using Novel Photocurable Sulfonated Polyimide Polyelectrolyte and their Properties (광가교성 Sulfonated Polyimide 전해질 고분자를 이용한 습도센서의 제조 및 특성 분석)

  • Lim, Dong-In;Gong, Myoung-Seon
    • Polymer(Korea)
    • /
    • v.36 no.4
    • /
    • pp.486-493
    • /
    • 2012
  • Photocurable sulfonated polyimide (SPI) polyelectrolyte containing chalcone group was prepared and fabricated on an alumina electrode pretreated with chalcone-containing silane-coupling agent. SPI films with bis(tetramethyl)ammonium 2,2'-benzidinedisulfonate ($Me_4N$-BDS)/4,4'-diaminochalcone (DAC)/pyromellitic dianhydride (PA)= 90/10/100 possessed very linear response(Y = -0.04528X+7.69446, $R^2=0.99675$) and showed resistance changing from 4.48 to $2.1k{\Omega}$ between 20 and 95 %RH. The response time for absorption and desorption measurements between 33 and 94 %RH% was about 79 s, which affirmed the high efficiency of crosslinked SPI film for rapid detection of humidity. A negative temperature coefficient showing $-0.49%RH/^{\circ}C$ was found and proper temperature compensation should be considered in future applications. Moreover, pretreatment of the substrates with chalcone-containing silane-coupling agent was performed to improve the water durability and the stability of the humidity sensors at a high humidity and a high temperature and long-term stability for 480 h. The crosslinked SPI films anchored to electrode substrate could be a promising material for the fabrication of efficient humidity sensors with superior characteristics compared to the commercially available sensors.

Thermoelectric properties of SiC prepared by refined diatomite (정제 규조토로 합성한 탄화규소의 열전특성)

  • Pai, Chul-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
    • /
    • v.21 no.4
    • /
    • pp.596-601
    • /
    • 2020
  • Silicon carbide is considered a potentially useful material for high-temperature electronic devices because of its large band gap energy and p-type or n-type conduction that can be controlled by impurity doping. Accordingly, the thermoelectric properties of -SiC powder prepared by refined diatomite were investigated for high value-added applications of natural diatomite. -SiC powder was synthesized by a carbothermal reduction of the SiO2 in refined diatomite using carbon black. An acid-treatment process was then performed to eliminate the remaining impurities (Fe, Ca, etc.). n-Type semiconductors were fabricated by sintering the pressed powder at 2000℃ for 1~5h in an N2 atmosphere. The electrical conductivity increased with increasing sintering time, which might be due to an increase in carrier concentration and improvement in grain-to-grain connectivity. The carrier compensation effect caused by the remaining acceptor impurities (Al, etc.) in the obtained -SiC had a deleterious influence on the electrical conductivity. The absolute value of the Seebeck coefficient increased with increasing sintering time, which might be due to a decrease in the stacking fault density accompanied by grain or crystallite growth. On the other hand, the power factor, which reflects the thermoelectric conversion efficiency of the present work, was slightly lower than that of the porous SiC semiconductors fabricated by conventional high-purity -SiC powder, it can be stated that the thermoelectric properties could be improved further by precise control of an acid-treatment process.

0.35㎛ CMOS Low-Voltage Low-Power Voltage and Current References (0.35㎛ CMOS 저전압 저전력 기준 전압 및 전류 발생회로)

  • Park, Chan-yeong;Hwang, Jeong-Hyeon;Jo, Min-Su;Yang, Min-jae;Yoon, Eun-jung;Yu, Chong-gun
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
    • /
    • 2015.10a
    • /
    • pp.458-461
    • /
    • 2015
  • In this paper 2 types of voltage references and a current reference suitable for low-voltage, low-power circuits are proposed and designed with $0.35{\mu}m\;CMOS$ process. MOS transistors operating in weak inversion and bulk-driven technique are utilized to achieve low-voltage and low-power features. The first voltage reference consumes 1.43uA from a supply voltage of 1.2V while it has a reference voltage of 585mV and a TC(Temperature Coefficient) of $6ppm/^{\circ}C$. The second voltage reference consumes 48pW from a supply voltage of 0.3V while having a reference voltage of 172mV and a TC of $26ppm/^{\circ}C$. The current reference consumes 246nA from a supply voltage of 0.75V with a reference current of 32.6nA and a TC of $262ppm/^{\circ}C$. The performances of the designed references have been verified through simulations.

  • PDF