• Journal of the Korean Society of Visualization
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• v.16 no.3
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• pp.59-64
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• 2018

Numerical simulations were carried out to analyze the flow characteristics of the wind tunnel. Flow field characteristics with velocity uniformity at the test sections are largely affected by inlet conditions of air flow rate and temperature. Axial average velocity of the flow field inside the test area was almost linearly decreased by 0.026% each 1m. The uniformity distributions of axial velocity showed the highest reduction rate of about 24% between nozzle outlets 1 ~ 2m. In addition, average velocity and the uniformity are increased with air temperature in the wind tunnel due to density variation. The results of this paper are expected to be useful for the basic design of wind tunnel and to be used for efficient design.

• Journal of Mechanical Science and Technology
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• v.19 no.10
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• pp.1950-1956
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• 2005

An analysis has been carried out to investigate the effect of the reflectivity on the temperature distribution of a glass panel by infrared radiant heating. Halogen lamps are used to heat the panel, located near the top and bottom of the rectangular chamber. The thermal energy is transferred from the lamps to the panel only by radiation and it is considered by using view factor. The conductive transfer is limited inside the panel. The results show that the uniformity of the temperature distribution of the panel is improved and, at the same time, the time for heating increases as the wall reflectivity increases. The temperature difference between the center and the corner reaches a maximum in the early stage of the heating process and then decreases until it reaches a uniform steady-state value.

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.6
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• pp.500-505
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• 2000

This paper deals with wafer temperature uniformity control essential in rapid thermal processing (RTP). One of the important control objectives of RTP is to keep the temperature over the wafer surface as uniformly as possible. For this, a discrete time state equation around the operating point is first identified by using the subspace fitting method, and a multivariable LQG(Linear Quadratic Gaussian) controller is designed based on the identified model. Simulation and experimental results show improvement in temperature uniformity over the conventional PID method.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.358-358
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• 2000

An iterative learning control technique based on a linear quadratic optimal criterion is proposed for temperature uniformity control of a silicon wafer in rapid thermal processing.

• Journal of the Semiconductor & Display Technology
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• v.15 no.2
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• pp.74-80
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• 2016

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1329-1337
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• 2005

The OLED (Organic Light Emitting Diodes) display recently used for the information indicating device has many advantages over the LCD (Liquid Crystal Display), and its demand will be increased highly. The linear cell should be designed carefully considering the uniformity of thin film on the substrate. Its design needs to compute the temperature field analytically because the uniformity for the thin film thickness depends on the temperature distribution of the source (organic material). In the present study, the design of the linear cell will be modified or improved on the basis of the temperature profiles obtained for the simplified linear cell. The temperature distributions are numerically calculated through the STAR-CD program, and the grids are generated by means of the ICEM CFD program. As the results of the simplified linear cell, the temperature deviation was shown in the parabolic form among the both ends and the center of the source. In order to reduce the temperature deviation, the configuration of the rectangular ends of the crucible was modified to the circular type. In consequence, the uniform temperature is maintained in the range of about 90 percent length of the source. It is expected that the present methods and results on the temperature analysis can be very useful to manufacture the vapor deposition device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.300-301
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• 2006

We studied about new module technology to solve warpage problems that produce bending of cell in the LCD (Liquid crystal display). Characteristics of cell gap and glass bending of applying heat Panel's PAD part and cell at various temperature was investigated. When applies heat and compresses PAD party only in case of compressing COG(Chip on Glass), uniformity of cell gap that happen by glass bending by temperature of these compressing COG In the PAD party is decreased. However, in case of compress COG. glass bending of applying heat Panel's PAD part and cell at various temperature produced 20um. But, uniformity of cell gap was not decreased. Therefore, it is considered that applying heat Panel's PAD part and cell could decrease uniformity of cell gap and bending of glass.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.127-130
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• 2009

The uniform gas distribution between anode channels of the indirect internal reforming type molten carbonate fuel cell (MCFC) is crucial design parameter because of the electric performance and the durability problems. A three-dimensional computational fluid dynamics (CFD) analysis is performed to investigate flow characteristics in the anode channels and manifold under different pressure drop and channel temperature conditions. The combined meshes consists of hexadral meshes in the channels and polyhedral meshes in the manifold are adopted and chemical reactions inside the MCFC system are not included because of computational difficulties associated with the size and geometric complexity of the system. Results indicate that the uniformity in flow-rate is in the range of $\pm$ 0.048 % between the anode channels when the pressure drop of anode channel is about 150 Pa. A gas flow-rate uniformity decreases as the pressure drop of anode channels decreases and as the temperature difference between indirect internal reforming (IIR) channels and anode channels increases.

• Transactions of the Korean hydrogen and new energy society
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• v.33 no.5
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• pp.550-556
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• 2022

In this study, the flow uniformity was analyzed by performing numerical analysis on the 1 kWe internal manifold type solid oxide fuel cell stack according to the channel height of the separator. Also, it was examined by varying the fuel utilization rate and oxygen utilization rate. From the calculation results, we found that as the channel height of the separator decreased, the pressure drop increased exponentially. In addition, it was found that as the channel height of the separator decreased, the gas flow resistance inside the unit cell increased, and the flow resistance increased the pressure drop, thereby improving the flow uniformity inside the stack. Finally, the calculation results showed that as the fuel and oxygen utilization increased, the flow uniformity also improved.

• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.41-46
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• 2006

Wet etching process in recent semiconductor manufacturing is devided into batch and single wafer type. Batch type wet etching process provides more throughput with poor etching uniformity compared to single wafer type process. Single wafer process achieves better etching uniformity by boom-swing injected chemical on rotating wafer. In this study, etching characteristics of $SiO_2$ layer at room and elevated temperature is evaluated and compared. The difference in etching rate and uniformity of each condition is identified, and the temperature profile of injected chemical is theoretically calculated and compared to that of experimental result. Better etching uniformity is observed with single wafer tool with boom-swing injection compared to single wafer process without boom-swing or batch type tool.