• Atmosphere
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• v.27 no.4
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• pp.423-433
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• 2017

The spatial and temporal variations in radiative forcing (RF) and mean temperature changes of greenhouse gases (GHGs), such as $CO_2$, $CH_4$, and $N_2O$, were analyzed at urban center (Yeon-dong) and background sites (Gosan) on Jeju Island during 2010~2015, based on a modeling approach (i.e., radiative transfer model). Overall, the RFs and mean temperature changes of $CO_2$ at Yeon-dong during most years (except for 2014) were estimated to be higher than those at Gosan. This might be possibly because of its higher concentrations at Yeon-dong due to relatively large energy consumption and small photosynthesis and also the difference in radiation flux due to the different input condition (e.g., local time and geographic coordinates of solar zenith angle) in the model. The annual mean RFs and temperature changes of $CO_2$ were highest in 2015 ($2.41Wm^{-2}$ and 1.76 K) at Yeon-dong and in 2013 ($2.22Wm^{-2}$ and 1.62 K) at Gosan (except for 2010 and 2011). The maximum monthly/seasonal mean RFs and temperature changes of $CO_2$ occurred in spring (Mar. and/or Apr.) or winter (Jan. and/or Feb.) at the two sites during the study period, whereas the minimum RFs and temperature changes in summer (Jun.-Aug.). In the case of $CH_4$ and $N_2O$, their impacts on the RF and mean temperature changes were very small (an order of magnitude lower) compared to $CO_2$. The spatio-temporal differences in these RF values of GHGs might primarily depend on the atmospheric profile (e.g., ozone profile), surface albedo, local time (or solar zenith angle), as well as their mass concentrations.

• International Journal of Industrial Entomology and Biomaterials
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• v.24 no.2
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• pp.69-74
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• 2012

Tropical tasar silkworm Antheraea mylitta Drury experiences extreme temperature stress conditions during its life cycle particularly during diapauses and first crop. The present study witnessed the impact of high temperature on some biochemical profiles and egg production (fecundity) of semi-domesticated Daba and Shorea robusta (Sal) based wild ecorace Laria during seed cocoon (pupa) preservation. Cocoons of Daba and Laria were treated with high temperature at $40^{\circ}C$ for 10 days in a BOD incubator. The protein profile and carbohydrate content in the hemolymph and fat body and total haemocyte count (THC) in the hemolymph of pupa were investigated. Further, the fecundity and fertility of egg was assessed. Significant increase in the protein concentration was observed in the hemolymph with reduction in the fat body (p<0.05). The difference in protein concentration was highly significant between the semidomesticated Daba and wild ecorace Laria (p<0.05). High pupal mortality (20%) and reduced fecundity (10-15%) in Daba was noticed compared to wild Laria. Also an increased THC (>28000) was recorded in Laria. The study infers the potentials of wild ecoraces in sustaining the extreme temperature conditions and need of adopting suitable package of practices for the preservation of diapause seed cocoons during extreme summer conditions. There is possibility to introgression thermal stress resistant traits in the semi-domesticated races of tasar silkworm by resorting to conventional breeding plans with wild races and keeping the thermal stress induced response as markers.

• Analytical Science and Technology
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• v.6 no.2
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• pp.217-223
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• 1993

Thin films of the Au/Cr, Au/Ni/Cr and Au/Pd/Cr systems were deposited on alumina substrates at ambient temperature and $250^{\circ}C$ in a high-vacuum resistance heating evaporator and annealed at $300^{\circ}C$, $450^{\circ}C$ and $600^{\circ}C$ for 1 hour in air, respectively. The film thicknesses of Au, Ni(or pd), and Cr were $1000{\AA}$, $300{\AA}$, and $50{\AA}$, respectively. The substrate temperature during deposition and the post-deposition annealing temperature affected the sheet resistance of thin-films due to the inter-diffusion of each layer. As a result of Auger depth profile analysis, in the Au/Cr system Cr already diffused out to Au surface during deposition at the substrate temperature of $250^{\circ}C$ and Au distribution changed after heat treatment. In the Au/Ni/Cr and Au/Pd/Cr systems, diffusion phenomena of Ni and Pd were found and especially Ni (approximately 45 at.%) diffused out to Au surface and oxidized.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.475-475
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• 2010

We have generated Ar plasma in dense plasma focus device with coaxial electrodes for extreme ultraviolet (EUV) lithography and investigated an emitted visible light for electro-optical plasma diagnostics. We have applied an input voltage 4.5 kV to the capacitor bank of 1.53 uF and the diode chamber has been filled with Ar gas of pressure 8 mTorr. The inner surface of the cylindrical cathode has been attatched by an acetal insulator. Also, the anode made of tin metal. If we assumed that the focused plasma regions satisfy the local thermodynamic equilibrium (LTE) conditions, the electron temperature and density of the coaxial plasma focus could be obtained by Stark broadening of optical emission spectroscopy (OES). The Lorentzian profile for emission lines of Ar I of 426.629 nm and Ar II of 487.99 nm were measured with a visible monochromator. And the electron density has been estimated by FWHM (Full Width Half Maximum) of its profile. To find the exact value of FWHM, we observed the instrument line broadening of the monochromator with a Hg-Ar reference lamp. The electron temperature has been calculated using the two relative electron density ratios of the Stark profiles. In case of electron density, it has been observed by the Stark broadening method. This experiment result shows the temporal behavior of the electron temperature and density characteristics for the focused plasma. The EUV emission signal whose wavelength is about 6 ~ 16 nm has been detected by using a photo-detector (AXUV-100 Zr/C, IRD). The result compared the electron temperature and density with the temporal EUV signal. The electron density and temperature were observed to be $10^{16}\;cm^{-3}$ and 20 ~ 30 eV, respectively.

• Clean Technology
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• v.15 no.4
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• pp.245-252
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• 2009

Profiles development of melt spinning process of poly(lactic acid) (PLA) was simulated via a numerical method and the radial temperature distribution was calculated using finite difference method. The spinning speed ranged from 1 km/min to 5 km/min was analyzed and the effect of spinning conditions on the radial temperature distribution was investigated. At low spinning speed, the difference between PLA and poly(ethylene terephthalate) (PET) was relatively small. As the spinning speed increased, the difference in velocity profile became prominent. PLA showed a slower spinning speed than PET and solidified more slowly. The temperature difference between the core and surface of the PLA filament reached 4.6 K, which was less than that of PET filament with a difference of 10.4 K. The radial temperature difference increased with increasing the cooling-air velocity and the spinning temperature.

• Korea-Australia Rheology Journal
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• v.13 no.2
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• pp.97-106
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• 2001

Three-dimensional flow analysis was performed by using the control volume finite-element method for design of a profile extrusion die. Because polymer melt behavior is complicated and cross-sectional shape of the profile extrusion die is changing continuously, the fluid flow within the die must be analyzed three-dimensionally. A commercially available polypropylene is used for theoretical and experimental investigations. Material properties are assumed to be constant except for the viscosity. The 5-constant modified Cross model is used for the numerical analysis. A test problem is examined in order to verify the accuracy of the numerical method. Simulations are performed for conditions of three different screw speeds and three different die temperatures. Predicted pressure distribution is compared with the experimental measurements and the results of the previous two-dimensional study. The computational results obtained by using three dimensional CVFEM agree with the experimental measurements and are more accurate than those obtained by using the two-dimensional cross-sectional method. The velocity profiles and the temperature distributions within several cross-sections of the die are given as contour plots.

• Transactions of Materials Processing
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• v.27 no.5
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• pp.289-295
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• 2018

The profile ring rolling process can realize various ring shapes unlike conventional rectangular cross-sectional ring products. In this paper, the defective groove in the bottom surface of L-shaped ring products was analyzed. Grooves are generated by non-uniform external forces due to profile main roll and initial blank shape. Process parameters such as the motion of dies and working temperature were determined. Mechanism of groove formation was analyzed by FE simulation on the basis of local external forces acting on the blank. Analysis results were similar to the groove actually occurring in the production line. Based on results of the analysis, two solutions were proposed for the groove. The position of the base plate supporting the blank was adjusted and edge length of the main roll was extended to suppress growth of grooves. It has been verified that groove was improved by applying two proposed methods in the shop-floor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.10
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.9
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• pp.665-671
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• 1999

The paper represents the effects of the drive-in process parameters on the residual stress profile of the $p^+$ silicon film. Since the residual stress profile is notuniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All the coefficients of the polynomial can be determined by measuring of the thicknesses and the deflections of cantilevers and the deflection of a rotating beam with a surface profiler meter and a microscope. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Then, near the surface of the $p^+$ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.