• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.9 no.1
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• pp.11-18
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• 2003

The pure $TiO_2$ particles have been prepared in vapor-phase hydrolysis of titanium tetraisopropoxide(TTIP). The rate of TTIP hydrolysis was so fast that the overall rate of formation of $TiO_2$ was controlled by the rate of mixing of TTIP and $H_2O$. Thus, the primary $TiO_2$ particles were prepared in nano sizes to form chainlike aggregates due to rapid coagulation. The pure $TiO_2$ particles as prepared were amorphous at the reactor set temperatures below $400^{\circ}C$ and became anatase at the temperatures of $450^{\circ}C$ above while the weak rutile peaks were also observed above $800^{\circ}C$. The actual size of primary particles as prepared were reduced by increasing the reactor set temperature while their crystalline sizes as well as BET sizes increased by post-sintering.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.25-35
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• 1999

LTCC (Low Temperature Cofired Ceramic) or LTCC-M (Low Temperature Cofired ceramic on Metal) technology is one of MCM-C (Multichip Module on Ceramic) technologies and becomes to be widely used in consumer, RF and automotive electronics. As green sheets for LTCC are cofired below $1000^{\circ}C$ in comparison with those for HTCC (High Temperature Cofired Ceramic), high conductivity metal traces such as gold, silver and copper can be used. The dimensional stability in LTCC-M technology enables embedded passives to be integrated inside modules, which enhances the electrical performance and increases the reliability of the modules. Coefficient of thermal expansion and dielectric constant can be controlled by changing composition and heating profile for cofiring. In this technical review, LTCC and LTCC-M technologies are introduced and advantages of those technologies are explained.

• Horticultural Science & Technology
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• v.28 no.5
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• pp.902-911
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• 2010

Oriental melon ($Cucumis$ $melo$ var. $makuwa$) is a popular and high-value market fruit cultivated in Korea. Consumers are becoming increasingly interested in oriental melon as a healthy diet over the past few years. However, the melons have relatively high quality loss because the fruit are mainly produced for a limited period of time in the summer season. Lack of the proper postharvest treatments and high temperature exposure at harvest or during distribution are the most critical environmental factors limiting postharvest life of fruit. This review focuses on the overview of current research studies for postharvest treatment and functional packaging technology of oriental melon in Korea. Major physiological problems of the harvest fruit include the ripening process in quality changes of the produce such as loss of weight, firmness, flavor, and decay during the storage periods. Low temperature at 7 to $10^{\circ}C$ with high relative humidity of 90 to 95% is the suitable environmental condition used to maintain the quality of fresh oriental melon. Controlled atmosphere (CA) storage or modified atmosphere (MA) packaging can be used as supplemental treatments to extend postharvest-life. For oriental melon, an optimum CA is currently recommended to be 2-3% oxygen and 5-10% carbon dioxide atmosphere. Precooling, pretreatments of ethylene action and functional packaging system can be applied to oriental melon after harvest in order to extend storage life. Major active packaging technologies are concerned with a selectively gas permeable film related to respiration of produce and the packaging applications of ethylene removal, antimicrobial, and antifogging substances to keep the effective freshness of fruit.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.31-35
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• 2006

This paper is studied on a protective control system for electrical fire used electrical characteristics of SCR and multilayer-type PTC thermistor. The PTC thermistor has characteristic or positive resistivity temperature coefficient according to the temperature variation, which is construction of a regular square and cube demarcation with $BaTiO_{3_}$Ceramics of positive temperature coefficient. Also PTC shows the phenomenon which is rapidly increased in the resistivity if the temperature is increased over Curie temperature point. This paper is proposed on a protective control system used multilayer-type PTC which is protected from electrical fire due to electric short circuit faults or overload faults. Some experimental results of the proposed apparatus is confirmed to the validity of the analytical results.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.35-41
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• 2015

In this study, in order to improve the reliability of ACF interconnections, solder ACF joints were investigated interms of solder joint morphology and solder wetting areas, and evaluated the electrical properties of Flex-on-Board (FOB) interconncections. Solder ACF joints with the ultrasonic bonding method showed excellent solder wetting by broken solder oxide layers on solder surfaces compared with solder joints with remaining solder oxide layer bonded by the conventional thermo-compression (TC) bonding method. When higher target temperature was used, Sn58Bi solder joints showed concave shape due to lower degree of cure of resin at solder MP by higher heating rate. ACFs with epoxy resins and SAC305 solders showed lower degree of resin cure at solder MP due to the slow curing rate resulting in concave shaped solder joints. In terms of solder wetting area, solder ACFs with $25-32{\mu}m$ diameters and 30-40 wt% showed highest wetted solder areas. Solder ACF joints with the concave shape and the highest wetting area showed lower contact resistances and higher reliability in PCT results than conventional ACF joints. These results indicate that solder morphologies and wetting areas of solder ACF joints can be controlled by adjustment of bonding conditions and material properties of solder and polymer resin to improve reliability of ACF joints.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.49-57
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• 2007

Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was $330(N/mm^2)$ for multilayer solder with Au 10wt% and $460(N/mm^2)$ for co-sputtered solder with Au 5wt%.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.331-338
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• 2005

The rapid advances in high power light sources and arrays as encountered in incandescent lamps have induced dramatic increases in die heat flux and power consumption at all levels of high power LED packaging. The lifetime of such devices and device arrays is determined by their temperature and thermal transients controlled by the powering and cooling, because they are usually operated under rough environmental conditions. The reliability of packaged electronics strongly depends on the die attach quality, because any void or a small delamination may cause instant temperature increase in the die, leading sooner or later to failure in the operation. Die attach materials have a key role in the thermal management of high power LED packages by providing the low thermal resistance between the heat generating LED chips and the heat dissipating heat slug. In this paper, thermal transient characteristics of die attach in high power LED package have been studied based on the thermal transient analysis using the evaluation of the structure function of the heat flow path. With high power LED packages fabricated by die attach materials such as Ag paste, solder paste and Au/Sn eutectic bonding, we have demonstrated characteristics such as cross-section analysis, shear test and visual inspection after shear test of die attach and how to detect die attach failures and to measure thermal resistance values of die attach in high power LED package. From the structure function oi the thermal transient characteristics, we could know the result that die attach quality of Au/Sn eutectic bonding presented the thermal resistance of about 3.5K/W. It was much better than those of Ag paste and solder paste presented the thermal resistance of about 11.5${\~}$14.2K/W and 4.4${\~}$4.6K/W, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.47-53
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• 2002

In this study, two different (NiCuZn)-ferrite which were fabricated by using ultra-fine powders synthesized by the wet processing and conventionally commercialized powder, were investigated and compared each other in terms of the low temperature sintering and electromagnetic properties. Composition of x and w in $(Ni_{0.4-x}Cu_xZn_{0.6})_{1+w}(Fe_2O_4)_{1-w}$ were controlled as 0.2 and 0.03, respectively. The sintering temperature were $900^{\circ}C$ for ultra-fine powders by way of initial heat treatment and $1150^{\circ}C$ for commercialized powders. The (NiCuZn)-ferrite by ultra-fine powders showed love. sintering temperature than that of commercialized powders by over $200^{\circ}C$, and excellent electromagnetic properties such as the quality factor which is a important factor in the multi-layered chip inductor. In addition, characteristics of B-H hysteresis, crystallinity, microstructure and powder morphology were analyzed by a vibrating sample method(VSM), x-ray diffractometer(XRD), transmission electron microscope (TEM) and scanning electron microscope(SEM).

• Horticultural Science & Technology
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• v.32 no.2
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• pp.184-192
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• 2014

Various types of unit packaging methods were applied for 'Fuji' apples during short-term cold storage and export simulation. Gas tightness of the package was controlled stepwise in the successive two-year experiments using different perforation treatments (none, punch hole, or pinhole) and sealing methods (tie v s. heat seal). Risk of tight packaging and effectiveness of macroperforation on weight loss and quality maintenance were analyzed as related to changes in gas concentration inside the packages. Immediately after harvest, each 5 apple units were packaged in $40{\mu}m$ polypropylene (PP) film bags, stored 4 weeks at $0^{\circ}C$, and then put on the shelf for one week at ambient temperature in the preliminary experiment, In the main experiment, export process was imposed after storage simulating 2 week refrigerated container shipment at $0^{\circ}C$ plus one week local marketing at ambient temperature. Non-perforated film packaging with relatively high gas tightness induced flesh browning caused by carbon dioxide accumulation regardless of the sealing methods. Among perforated film packaging, in contrast, atmospheric modification was partly established only in the pinhole treatment and flesh browning symptom was not observed in all the treatments. Even the punch hole perforated film packaging without gas tightness effectively reduced the weight loss, whereas had slight benefits for quality maintenance. Reduced perforation using pinhole treatment seemed to improve sensory texture, while effects on physicochemical quality were insignificant. Overall results suggest the need of more minute perforation treatments on the packaging film to ensure modified atmosphere effects on quality maintenance.

• Food Science and Preservation
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• v.21 no.1
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• pp.25-33
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• 2014

The effects of the ice pack and aluminum coated board in the corrugated boxes for maintaining the quality of fresh oriental melons (Cucumis melo var. makuwa) were investigated. The harvested oriental melons were stored at a temperature of $30^{\circ}C$ for 21 days after placing them in the corrugated boxes treated with control, including ice pack and aluminum coated board. The treatment with the ice pack and aluminum coated board was identified to have maintained the relative low temperature in the corrugated box against the high temperature from the environment. For the storage study of the oriental melon, the treatments with the ice pack and aluminum coated board reduced the respiration rate, the development of external color, and total weight loss. All treatments were also effective in maintaining the firmness and decreasing the decay ratio of the oriental melon as compared to those that were controlled. However, the value of total soluble solids regarding the fruit was insignificantly affected by the ice pack treatment. The results indicated that the application of the ice pack and aluminum coated board in the corrugated box played an important role in maintaining the quality of oriental melons during storage. The combination with the ice pack and aluminum coated board had more effective values on the storage qualities for oriental melons than that with the ice pack only. Based on the results of this study, the ice pack and aluminum coated board were the useful treatments for reducing the loss of quality of the fresh oriental melons in high temperature storage conditions.