• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1413-1414
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• 2003

일렉트렛을 이용한 전자제품의 시공정에 주로 이용되고 있는 Teflon FEP 일렉트렛의 전하 저장 특성을 개선하기 위하여 FEP 필름 위에 Teflon AF 1${\mu}m$를 적충한 후 그 전기적 특성을 분석하였다. AF/FEP 이중 필름을 음극 코로나 방전에 의해 하전시켰으며, 반복 하전 및 열처리에 따른 표면전위 변화를 관찰하였다.

• 한국재료학회지
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• 제15권3호
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• pp.149-154
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• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제36회 동계학술대회 초록집
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• pp.233.1-233.1
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• 2009

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1998년도 금형가공 심포지엄
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• pp.8-18
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• 1998

The effect of press warm forming in cylindrical deep drawing of stainless-aluminum clad sheet metals are examined . The temperature of die and blank holder is varied from room temperature to 20$0^{\circ}C$, while the punch is kept cooled during test to increase the fracture strength of workpiece on the punch corner area. Test materials chosen for experiments are STS304-Al050-STS304, STS304-A1050-STS430-, STS304 and Al050 metals and teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ration as well as quality of drawn cups (distribution of thickness and hardness)are investigated and discussed.

• 한국정밀공학회지
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• 제13권5호
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• pp.53-59
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• 1996

Warm deep drawing of single-action dies using local heating has appeared to be an alternative attractive production method of multi-operation die sets generally used at room temperature in deep drawing of rectangular cup. Uniaxial tensile tests and deep drawing tests of various materials are carried out and the effect of temperature on tensile properties and drawability are examined at temperatures up to 200 .deg. C under three kinds of lubricants of teflon film, vinyl film and drawing oil. Good formability is achieved when punch and die temperature were differentiated intentionally in order to get large tensile strength(TS) at punch shoulder protion and small TS at die side. Throughout the experiments, it has been shown that the limiting drawing height of STS316L was increased with heating die and blank holder at 100 .deg. C, but that of STS430 wasn't. When vinyl or teflon film was attached on the plates, the drawability was increased considerably.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.21-28
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• 2004

Polytetrafluoroethylene (PTFE/Teflon ) 인쇄회로기판용 미세 피치 솔더 범프 형성을 위해 dry film photoresist (DFR)를 photolithography 공정에 적용하였다. DFR lamination을 위한 test board는 폭 100$\mu\textrm{m}$와 두께 18$\mu\textrm{m}$의 copper line들이 100-200$\mu\textrm{m}$의 간격으로 배열된 형태로 디자인하였다. 15$\mu\textrm{m}$의 두께를 갖는 DFR을 hot roll laminator를 사용하여 lamination 온도와 속도를 변화시켜가면서 lamination 공정 실험을 수행하였다. 실험 결과, PTFE 인쇄회로기판에 DFR을 lamination하는 공정의 최적 조건은 lamination 온도 $150^{\circ}C$, 속도 약 0.63cm/s였다. UV exposure 및 development 공정을 거쳐 저융점 솔더 재료인 인듐을 증착하였다. DFR 박리 순서에 따른 두 가지 다른 reflow 공정을 통해 최소 지름 50$\mu\textrm{m}$, 최소 피치 100$\mu\textrm{m}$를 갖는 인듐 솔더 범프를 형성하였다.

• 대한기계학회논문집A
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• 제24권1호
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• pp.87-93
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• 2000

Warm, forming technique which is one of the new forming technologies to improve formability of sheet metal is applied to the cylindrical cup drawing of stainless-aluminum. clad sheets. In experiments the temperature of die and blank holder is varied from room temperature to 18$0^{\circ}C$, while the punch is cooled by circulation of coolant to increase the fracture strength of workpiece on the punch corner area. Test materials chosen for experiments are STS304-A1050-STS304, STS304-A1050-STS430 clad sheets and A1050-0 aluminum sheet. Teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ratio as well as quality of drawn cups(distribution of thickness and hardness)are investigated and validity of warm drawing process is also discussed.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2002년도 금형가공 심포지엄
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• pp.136-143
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• 2002

Warm draw die technique which is one of the new forming technologies to improve formability of sheet metal is applied to the cylindrical and square cup drawing of stainless-aluminum clad sheets. In experiments the temperature of die and blank holder is varied from room temperature to $180^{\circ}C$, while the punch is cooled by circulation of coolant to increase the fracture strength of workpiece on the punch comer area. Test materials chosen for experiments are STS304-A1050-STS304 clad sheets. Teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ratio and relative drawing depth as well as quality of drawn cups(distribution of thickness)are investigated and validity of warm drawing process is also discussed. No separation between each laminated material after drawing occurred through inspection by microscope as well as application of penetrant remover and bond strength test. Therefore, warm forming technique was confirmed to give better results in deep drawing of stainless clad sheet metal.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1988년도 춘계학술대회 논문집
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• pp.60-62
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• 1988

In this study, the characteristic of charging current which flows into the polymer by applying the corona discharge carriers on the polymer surface was measured, so as to investigate the phenomenon of charge injection and movement if injected charge on polymer. Also. the characteristics of discharge current which flows by shorting both sides of corona charged polymers were measured. Experimental results are as follows; The amount of charges injected by corona discharge vary according to the state of surface and the type of carriers, and then the charging current varies according to the properties of injected carriers.

• 한국의학물리학회지:의학물리
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• 제9권1호
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• pp.11-21
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• 1998

일렉트릿 (electret) 의 특성을 갖고 있는 Teflon-FEP 와 PET 필름의 유전체 양변에 크롬을 증착시켜 전극을 만들고 코발트-60 감마선을 찍어 이 두 유전체의 물리적 특성변화를 조사하였다. 선량률 25.0 cGy/min에서 방사선 조사하기 시작하여 2초이내에서 전류가 급격히 증가해 최대값에 이른후, 60초 이후에선 거의 안정값에 이르는 특성을 보였다. 방사선 조사동안 Teflon의 경우 유전 상수는 2.15에서 18.0으로, 전기전도도는 1$\times$$10^{-17}$ 에서 1.57$\times$$10^{-13}$ $\Omega$$^{-l}$ $cm^{-1}$ /으로 증가했고, PET는 유전상수는 3에서 18.3으로, 전기전도도는 $10^{-17}$ 에서 1.65$\times$$10^{-13}$ $\Omega$$^{-1}$$cm^{-1}$ /값으로 변하였다. 분당선량률을 변화시켰을때 (4.0 cGy/min, 8.5 cGy/min, 15.6 cGy/min, 19.3 cGy/min) 정상상태 방사선 유도전류(Ic), 유전율($\varepsilon$), 전기전도도 ($\sigma$) 가 선량률에 따라 증가함을 보였다. 정상상태방사선유도전류(Ic)값은 12시간내에선 1%내의 재현성을 보였고, 1주일간에선 3%내에서 일치하였다. 전하 및 전류값이 측정간격 (방사선 조사후 다음 조사때까지의 시간)에 의존성을 보였으며, 측정간격이 작을수록 초기측정값과 후측정값의 차가 크며, 최소 20분이상 간격을 둘 때 후측정값이 초기측정값과 같아졌다. 25.0 cGy/min. 선량률에서 유전체가 20분동안 전하를 유지하는 일펙트릿 성질을 갖고 있음을 보였다. 위 실험결과들은 2차전자에 의한 자유전자와 정공의 발생 및 이로 인한 내부편극과 전도도의 변화, 재결합등으로 인한 전자평형상태에 의한 것으로 볼 수 있다. 방사선조사직후 시료에 열을 가한 후 다시 조사하면 측정값이 상승하는 현상을 보였다. 이는 열을 가함으로 내부편극이 감소되었고 이로인해 다음 방사선 조사시 전하운반자(charge carriers)의 숫자를 높이는데 기여했음을 알 수 있다. 인가전압 및 흡수선량에 따른 선형성 및 재현성과 다른 전리함에 비해 적은 부피로 큰 전하량을 측정하는 것은 미세전류검출기로서의 사용가능성과 검출기의 부피를 크게 줄일수 있는 가능성을 보여준다.