• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1413-1414
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• 2003

일렉트렛을 이용한 전자제품의 시공정에 주로 이용되고 있는 Teflon FEP 일렉트렛의 전하 저장 특성을 개선하기 위하여 FEP 필름 위에 Teflon AF 1${\mu}m$를 적충한 후 그 전기적 특성을 분석하였다. AF/FEP 이중 필름을 음극 코로나 방전에 의해 하전시켰으며, 반복 하전 및 열처리에 따른 표면전위 변화를 관찰하였다.

• Korean Journal of Materials Research
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• v.15 no.3
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• pp.149-154
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• 2005

Teflon like fluorocarbon thin films have been deposited on silicon and oxide molds as an antistiction layer for the hot embossing process by an inductively coupled plasma (ICP) chemical vapor deposition (CVD) method. The process was performed at $C_4F_8$ gas flow rate of 2 sccm and 30 W of plasma power as a function of substrate temperature. The thickness of film was measured by a spectroscopic ellipsometry. These films were left in a vacuum oven of 100, 200 and $300^{\circ}C$ for a week. The change of film thickness, contact angle and adhesion and friction force was measured before and after the thermal test. No degradation of film was observed when films were treated at $100^{\circ}C$. The heat treatment of films at 200 and $300^{\circ}C$ caused the reduction of contact angles and film thickness in both silicon and oxide samples. Higher adhesion and friction forces of films were also measured on films treated at higher temperatures than $100^{\circ}C$. No differences on film properties were found when films were deposited on either silicon or oxide. A 100 nm silicon template with 1 to $500\;{\mu}m$ patterns was used for the hot embossing process on $4.5\;{\mu}m$ thick PMMA spun coated silicon wafers. The antistiction layer of 10 nm was deposited on the silicon mold. No stiction or damages were found on PMMA surfaces even after 30 times of hot embossing at $200^{\circ}C$ and 10 kN.

• Proceedings of the Korean Vacuum Society Conference
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• 2009.02a
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• pp.233.1-233.1
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• 2009

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1998.06b
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• pp.8-18
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• 1998

The effect of press warm forming in cylindrical deep drawing of stainless-aluminum clad sheet metals are examined . The temperature of die and blank holder is varied from room temperature to 20$0^{\circ}C$, while the punch is kept cooled during test to increase the fracture strength of workpiece on the punch corner area. Test materials chosen for experiments are STS304-Al050-STS304, STS304-A1050-STS430-, STS304 and Al050 metals and teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ration as well as quality of drawn cups (distribution of thickness and hardness)are investigated and discussed.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.5
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• pp.53-59
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• 1996

Warm deep drawing of single-action dies using local heating has appeared to be an alternative attractive production method of multi-operation die sets generally used at room temperature in deep drawing of rectangular cup. Uniaxial tensile tests and deep drawing tests of various materials are carried out and the effect of temperature on tensile properties and drawability are examined at temperatures up to 200 .deg. C under three kinds of lubricants of teflon film, vinyl film and drawing oil. Good formability is achieved when punch and die temperature were differentiated intentionally in order to get large tensile strength(TS) at punch shoulder protion and small TS at die side. Throughout the experiments, it has been shown that the limiting drawing height of STS316L was increased with heating die and blank holder at 100 .deg. C, but that of STS430 wasn't. When vinyl or teflon film was attached on the plates, the drawability was increased considerably.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.1 s.173
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• pp.87-93
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• 2000

Warm, forming technique which is one of the new forming technologies to improve formability of sheet metal is applied to the cylindrical cup drawing of stainless-aluminum. clad sheets. In experiments the temperature of die and blank holder is varied from room temperature to 18$0^{\circ}C$, while the punch is cooled by circulation of coolant to increase the fracture strength of workpiece on the punch corner area. Test materials chosen for experiments are STS304-A1050-STS304, STS304-A1050-STS430 clad sheets and A1050-0 aluminum sheet. Teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ratio as well as quality of drawn cups(distribution of thickness and hardness)are investigated and validity of warm drawing process is also discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.136-143
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• 2002

Warm draw die technique which is one of the new forming technologies to improve formability of sheet metal is applied to the cylindrical and square cup drawing of stainless-aluminum clad sheets. In experiments the temperature of die and blank holder is varied from room temperature to $180^{\circ}C$, while the punch is cooled by circulation of coolant to increase the fracture strength of workpiece on the punch comer area. Test materials chosen for experiments are STS304-A1050-STS304 clad sheets. Teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ratio and relative drawing depth as well as quality of drawn cups(distribution of thickness)are investigated and validity of warm drawing process is also discussed. No separation between each laminated material after drawing occurred through inspection by microscope as well as application of penetrant remover and bond strength test. Therefore, warm forming technique was confirmed to give better results in deep drawing of stainless clad sheet metal.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.05a
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• pp.60-62
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• 1988

In this study, the characteristic of charging current which flows into the polymer by applying the corona discharge carriers on the polymer surface was measured, so as to investigate the phenomenon of charge injection and movement if injected charge on polymer. Also. the characteristics of discharge current which flows by shorting both sides of corona charged polymers were measured. Experimental results are as follows; The amount of charges injected by corona discharge vary according to the state of surface and the type of carriers, and then the charging current varies according to the properties of injected carriers.

• Progress in Medical Physics
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• v.9 no.1
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• pp.11-21
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• 1998

Circular metal electrodes were vacuum-deposited with chromium on the both sides of Teflon-FEP and PET film characteristic of electret and the physical properties of the two polymers were observed during an irradiation by gamma-ray from $\^$60/Co. With the onset of irradiation of output 25.0 cGy/min the induced current increased rapidly for 2 sec, reached a maximum, and subsequently decreased. A steady-state induced current was reached about in 60 second. The dielectric constant and conductivity of Teflon-FEP were changed from 2.15 to 18.0 and from l${\times}$l0$\^$-17/ to 1.57${\times}$10$\^$-13/ $\Omega$-$\^$-1/cm$\^$-1/, respectively. For PET the dielectric constant was changed from 3 to 18.3 and the conductivity from 10$\^$-17/ to 1.65${\times}$10$\^$-13/ $\Omega$-$\^$-1/cm$\^$-1/. The increase of the radiation-induced steady state current I$\^$c/, permittivity $\varepsilon$ and conductivity $\sigma$ with output(4.0 cGy/min, 8.5 cGy/min, 15.6 cGy/min, 19.3 cGy/min) was observed. A series of independent measurements were also performed to evaluate reproducibility and revealed less than 1% deviation in a day and 3% deviation in a long term. Charge and current showed the dependence on the interval between measurements, the smaller the interval was, the bigger the difference between initial reading and next reading was. At least in 20 minutes of next reading reached an initial value. It may indicate that the polymers were exhibiting an electret state for a while. These results can be explained by the internal polarization associated with the production of electron-hole pairs by secondary electrons, the change of conductivity and the equilibrium due to recombination etc. Heating to the sample made the reading value increase in a short time, it may be interpreted that the internal polarization was released due to heating and it contributed the number of charge carriers to increase when the samples was again irradiated. The linearity and reproducibility of the samples with the applied voltage and absorbed dose and a large amount of charge measured per unit volume compared with the other chambers give the feasibility of a radiation detector and make it possible to reduce the volume of a detector.