• Title/Summary/Keyword: Technology Transfer

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Numerical Study on the Heat Transfer Enhancement of Trapezoidal Vortex Generator in a Rectangular Channel (사각채널에서 사다리꼴 와류발생기에 의한 열전달 촉진에 대한 수치해석)

  • Park, T.H.;Lee, S.R.
    • Journal of the Korean Society of Mechanical Technology
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    • v.20 no.6
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    • pp.852-857
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    • 2018
  • Vortex Generators are used in heat exchanger to enhance the heat transfer of air side. 3-D numerical analysis is performed on heat transfer characteristics of a channel with trapezoidal vortex generator. We investigate the effects of vortex generators with two different inclined angles to flow direction which are forward and backward vortex generators. The thermal hydraulic performance such as Nu and pressure drop, is compared quantitatively. The results show that vortex generator enhances the heat transfer by developing boundary layers and secondary flow in the downstream. The downwash flow region corresponds to the maximum Nu, while the upwash flow region corresponds to Nu minimum. In the view of the heat transfer characteristics, FVG is better than BVG. However, when flow is turbulent as Re increases, the pressure drop for FVG is higher than that for BVG.

Changes in the Information Transfer of Wooden Post and Beam Construction with Precutting in Japan

  • Ren SAKURAGAWA;Hideto KANEKO;Tomoyuki GONDO
    • International conference on construction engineering and project management
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    • 2024.07a
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    • pp.495-500
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    • 2024
  • This paper aims to make clear the transition process of information transfer in wooden post and beam construction in Japan during the introduction and development of machine precutting technology. The machine precutting technology started from 1970s and developed toward line production or automated CAD-CAM production and have got over 90 % market share in the Japanese newly built wooden houses. Based on literature review and interviews with manufacturers of precutting machines, the transition of wooden post and beam construction houses was divided into four periods: i) before the introduction of precutting, ii) the introduction of precutting (the early stage), iii) the automation of precutting, and iv) the maturity of precutting, and the review reveals how the information of design and processing was made and transfered in each period. In addition, the modeling and comparison of information transfer in each period visually shows the transition of information transfer with the development of machine precutting technology. Before the introduction of precutting, when carpenters were responsible for the generation of both design and processing information, information was coordinated at each stage of the process based on expert knowledge, but highly precise and uniform processing of machine precutting reduced the need for such coordination skills. On the other hand, the review suggested that the precut processing technology has changed step by step based on the traditional technical system, which has maintained the rational transfer of information.

A Study on the Complex Automation Die Manufacturing Technology for an Automotive Seat Cushion Panel (자동차 시트 쿠션 판넬의 복합 자동화 금형 제조기술에 관한 연구)

  • Park, D.H.;Jung, C.S.
    • Transactions of Materials Processing
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    • v.23 no.2
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    • pp.75-81
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    • 2014
  • Progressive dies are used for metal stamping during which multiple operations are performed in a sequence. Material is fed automatically from a coil into the press and advances from one die station to the next with each press stroke. Transfer dies are used in high-volume manufacturing for round, deep-drawn, and medium-to-large parts. Several different operations may be incorporated within a transfer die such as blanking, bending, piercing, trimming, and deep drawing. The main challenge in the current study is how to deform a seat cushion panel meeting the design specifications without any defects. A complex automation die manufacturing technology for the automotive seat cushion panel, mixing both semi-progressive die and transfer die for continuous production, was developed.

Direct-Current Based Remedial Technologies for Contaminated Soils and Groundwaters

  • Lee, Suk-Young;Lee, Chae-Young;Yoon, Jun-Ki;Kim, Kil-Hong
    • Proceedings of the Korean Society of Soil and Groundwater Environment Conference
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    • 2002.09a
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    • pp.3-6
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    • 2002
  • Electron transfer is the major natural process governing the behavior of contaminants in soils and groundwaters. Biological degradation of contaminants, i.e., microbial transformation of hazardous compounds, is a well known irreversible electron transfer process. Although it is not well defined as a separate process, abiotic electron-transfer is also an important process for mobilizing/demobilizing inorganic contaminants in soils and groundwaters. Therefore, numerous remedial technologies have been developed on the basis of electron transfer concept. Among them,

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Developing a Model to Explain the Process of Technology Transfer at Entrepreneurial University

  • Soleimani, Mohsen;Tabriz, Akbar Alem;Shavarini, Sohrab Khalili
    • Industrial Engineering and Management Systems
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    • v.15 no.4
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    • pp.298-306
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    • 2016
  • The gap between universities, scientific centers and industrial-production units is one of higher education concerns. In academic entrepreneurship, the university work simultaneously in education, research and entrepreneurship. The universities play a key and important role in providing educational opportunities in economic development. This research aims to develop and expand science as well as help managers to explain the process of technology transfer in entrepreneurial university. This research is applied-developmental type and on the other hand, data driven theories have been used in this study. Current model is generally tried to meanwhile compensate previous shortcomings, include some strengths such as considering domestic factors of Iran as well as update effective factors on the process of technology transfer. Finally the suggested model has been compared with existing well-known models that each one of those models have some drawbacks which have been tried to be minimized in suggested model as much as possible.

The Industrial Security along with the International Transfer of Technology (국제기술이전계약에서의 산업보안에 관한 연구)

  • SEO, Jung-Doo
    • THE INTERNATIONAL COMMERCE & LAW REVIEW
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    • v.76
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    • pp.1-20
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    • 2017
  • The industrial technology (including trade secrets), which is commonly understood as systematic and applied technical knowledge, can be transferred to third parties by contracting for the transfer of technology or by granting of a licence. The activity of industrial espionage, due to the gradual increase of the economic interests of intellectual property, is displaying intensively in order to gain advanced technology information. With our outstanding high technology, but compared to the level of the advanced countries, the technical protection systems, the legal protection measures and the systematic management thereof may still be insufficient. Our industrial technology outflow abroad, due to the vulnerability to the security control system in our country, has been increasing since the 2000. Computer software and SNS, such as smart devices, appear as a rapid change in the technical information environment. In order to minimize the dead zone of a new industrial security, the country's organic activity is being conducted. In 2006, Industrial Technology Outflow Prevention and Protection Law was enacted, which emphasized the responsibilities of the country. In this paper for the economic entity's efforts to prevent technology leakage oversea, I have looked to how the industrial technology can be protected in terms of national security and economic benefits of our enterprises. To solve the above-mentioned problems hereof, Korean government should willingly establish a reliable legal system for supporting to enterprise's operations, and Korean companies should autonomously introduce a synthetic technology protection system and incorporate the confidentiality clauses in an international transfer of technology agreement with third parties.

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Thermal Transfer Pixel Patterning by Using an Infrared Lamp Source for Organic LED Display (유기 발광 소자 디스플레이를 위한 적외선 램프 소스를 활용한 열 전사 픽셀 패터닝)

  • Bae, Hyeong Woo;Jang, Youngchan;An, Myungchan;Park, Gyeongtae;Lee, Donggu
    • Journal of Sensor Science and Technology
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    • v.29 no.1
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    • pp.27-32
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    • 2020
  • This study proposes a pixel-patterning method for organic light-emitting diodes (OLEDs) based on thermal transfer. An infrared lamp was introduced as a heat source, and glass type donor element, which absorbs infrared and generates heat and then transfers the organic layer to the substrate, was designed to selectively sublimate the organic material. A 200 nm-thick layer of molybdenum (Mo) was used as the lightto-heat conversion (LTHC) layer, and a 300 nm-thick layer of patterned silicon dioxide (SiO2), featuring a low heat-transfer coefficient, was formed on top of the LTHC layer to selectively block heat transfer. To prevent the thermal oxidation and diffusion of the LTHC material, a 100 nm-thick layer of silicon nitride (SiNx) was coated on the material. The fabricated donor glass exhibited appropriate temperature-increment property until 249 ℃, which is enough to evaporate the organic materials. The alpha-step thickness profiler and X-ray reflection (XRR) analysis revealed that the thickness of the transferred film decreased with increase in film density. In the patterning test, we achieved a 100 ㎛-long line and dot pattern with a high transfer accuracy and a mean deviation of ± 4.49 ㎛. By using the thermal-transfer process, we also fabricated a red phosphorescent device to confirm that the emissive layer was transferred well without the separation of the host and the dopant owing to a difference in their evaporation temperatures. Consequently, its efficiency suffered a minor decline owing to the oxidation of the material caused by the poor vacuum pressure of the process chamber; however, it exhibited an identical color property.

Measurement of Condensation and Boiling Heat Transfer Coefficients of Non-flammable Mixed Refrigerant for Design of Cryogenic Cooling System for Semiconductor Etching Process (반도체 식각 공정용 초저온 냉각 시스템 설계를 위한 비가연성 혼합냉매 응축 및 비등 열전달 계수 측정)

  • Cheonkyu Lee;Jung-Gil Lee
    • Journal of the Semiconductor & Display Technology
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    • v.22 no.3
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    • pp.119-124
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    • 2023
  • In this study, experimental approach of the measurement of condensation and evaporation heat transfer coefficients is discussed for mixed refrigerants using in the ultra low-temperature cooling system for semiconductor etching process. An experimental apparatus was described performing the condensation and evaporation heat transfer measurements for mixed refrigerants. The mixed refrigerant used in this study was composed of the optimal mixture determined in previous research, with a composition of Ar:R14:R23:R218 = 0.15:0.4:0.15:0.3. The experiments were conducted over a temperature range from -82℃ to 15℃ and at pressures ranging from 18.5 bar to 5 bar. The convection heat transfer coefficients of the mixed refrigerant were measured at flow rates corresponding to actual operating conditions. The condensation heat transfer coefficient ranged from approximately 0.7 to 0.9 kW/m2K, while the evaporation heat transfer coefficient ranged from 1.0 to 1.7 kW/m2K. The detailed discussion of the experimental methods, procedures, and results were described in this paper.

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Vibration Analysis of Three-Dimensional Piping System by Transfer Matrix Method (전달행렬법을 이용한 3차원 파이프 계의 진동해석)

  • 이동명
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.7 no.6
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    • pp.110-116
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    • 1998
  • For the vibration analysis of 3-dimensional piping system containing fluid flow, a transfer matrix method is presented. The fluid velocity and pressure were considered, that coupled to longitudinal and flexural vibrations. Transfer matrices and point matrices were derived from direct solutions of the differential equations of motion of pipe conveying fluids, and the variations of natural frequency with flow velocity for 3-dimensional piping system were investigated.

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Shape Optimization of Heat Sink for Power Amplifier by Heat Transfer Analysis (열전달 해석에 의한 파워 증폭기 방열기의 형상 최적화)

  • Lee, Dong-Ryul
    • Journal of the Korean Society of Mechanical Technology
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    • v.13 no.3
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    • pp.1-6
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    • 2011
  • In order to find better performance of heat sink, in this research, different cases were analysed by changing number of slots and shape of fins. Round shape fins which have wide surface showed 24% better heat transfer rate than vertical fins. There were not big discrepancies between 1 slot and 2 slots fins. Consequently, for better performance of heat sink, developments for widening surface and better material for high heat transfer rate are needed.