• 한국국방경영분석학회지
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• 제17권2호
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• pp.100-112
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• 1991

Software system is a hierarchical structure with collection of program units. Software system can import external packages globally or locally depending on the usage within a system. If the imported package is used globally, the soft-ware system can be influenced globally by any change of package and programmer's debugging time for the program maintenance will be greater. To solve these problems, it is desirable to use the imported package locally right on the usage point within the system. The model presented in this paper analyzed entity usage of package in structure of program, identified the usage level to obtain localization and provided information for restructure of the program to localize package usage. To obtain localization, it identified declared entities inside the imported package and analyzed the specification and body part of program unit to identify entities referenced from the imported package. The proposed model can be used to improve the maintainability of software system and contributed to reduction of programmer's debugging time in program maintenance.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2410-2413
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAB, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. In the pre-processor of 3D FEM package, a new 3D mesh generating algorithm can make information on 3D Delaunay tetrahedral mesh elements for analyses of 3D FEM problems. The solver of the 3D FEM package offers three methods for solving the linear algebraic matrix equation, i.e., Gauss-Jordan elimination solver, Band solver, and Skyline solver. The post-processor visualizes the results for 3D FEM problems such as the deformed position and the stress. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• 한국통신학회논문지
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• 제29권1A호
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• pp.107-112
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• 2004

본 논문은 SFF/SFP 광 송수신기에 사용되는 TO-38 패키지의 대역폭 향상을 위해 여러 구조적 변수를 변화시켜 최적화하여 3dB대역폭의 성능향상을 제안하였다. 먼저 실험을 통해 PIN PD 칩에 인가된 바이어스에 따른 캐패시턴스 값을 구하였으며 TO-can 패키지의 주파수 응답을 측정하여 3.5GHz의 3dB 대역폭을 얻었다. 또한 3차원 시뮬레이션으로 측정치와의 주파수 응답 특성의 일치를 재확인하였다. 더 나은 주파수 응답을 얻기 위해 TO-can 패키지 여러 물리적 구조 변수를 변화시켜 최적화시킨 TO-38 패키지는 3dB대역폭 15GHz의 아주 우수한 성능향상을 보였으며 이는 10Gbps대의 bit rate 성능을 만족할 수 있는 SFF/SFP 광 송수신기 모듈에 적용이 가능하다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 D
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• pp.2568-2570
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• 2004

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new FEM (Finite Element Method) package in CEMTool environment. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words. Also, we can control the mesh in a very effective way With the introduction of new mesh generation algorithm and NDM (Hosted Dissection Method), our FEM package can guarantee the shorter computational time than MATLAB PDE Toolbox. In addition, using the advanced electromagnetics library of CEMTool FEM package, we can analyze the practical problems such as the motor field analysis. Consequently, with our new FEM package, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• ETRI Journal
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• 제35권1호
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• pp.1-6
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• 2013

In this paper, we present an implemented serial 40-Gb/s receiver optical subassembly (ROSA) module by employing a proposed TO-CAN package and flexible printed circuit board (FPCB). The TO-CAN package employs an L-shaped metal support to provide a straight line signal path between the TO-CAN package and the FPCB. In addition, the FPCB incorporates a signal line with an open stub to alleviate signal distortion owing to an impedance mismatch generated from the soldering pad attached to the main circuit board. The receiver sensitivity of the ROSA module measures below -9 dBm for 40 Gb/s at an extinction ratio of 7 dB and a bit error rate of $10^{-12}$.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 D
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• pp.2897-2899
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• 2005

Finite element method (FEM) has been widely used as a useful numerical method that can analyze complex engineering problems in electro-magnetics, mechanics, and others. CEMTool, which is similar to MATLAR, is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present new 3D FEM package in CEMTool environment. In contrast to the existing CEMTool 2D FEM package and MATLAB PDE (Partial Differential Equation) Toolbox, our proposed 3D FEM package can deal with complex 3D models, not a cross-section of 3D models. Consequently, with our new 3D FEM toolbox, we can analyze more diverse engineering Problems which the existing CEMTool 2D FEM package or MATLAB PDE Toolbox can not solve.

• 비파괴검사학회지
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• 제12권4호
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• pp.18-25
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• 1993

This paper is to aim the microdefect evaluation of If package into a quantitative from NDI's image processing of ultrasonic wave. (1) Automatically repeated discrimination analysis method can be devided in the category of all kind of defects on IC package, and also can be possible to have a sampling of partial delamination. (2) It is possible that the information of edge section in silicon chip surrounding can be extractor by the partial image processing of IC package. Also, the crack detection is possible between the resin part and lead frame.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 A
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• pp.441-443
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• 2002

This paper presents a window-based load management system (LMS) package developed as a decision-making tool in the competitive electricity market. The presented LMS package can help the users to monitor system load patterns, analyze their past energy consumption and schedule the future energy consumption. The LMS package can also provide the effective information on real-time energy/cost monitoring, consumed energy/cost analysis, demand schedule and cost-savings. The developed LMS package can be used to establish the optimal demand schedule and consumption strategy.

• 응용통계연구
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• 제22권5호
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• pp.893-910
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• 2009

대학교 기초통계학 교육 시 우리는 통계패키지로서 R을 사용할 수 있다. R은 대화식 처리방식을 따르기 때문에 실행결과를 즉시 볼 수 있다. 또한 R에서의 그래픽스는 아주 강력하다. 그리고 가장 큰 장점은 R의 사용이 무료라는 것이다. 이러한 많은 장점을 갖고 있는 R을 대학교 기초통계교육 현장에서 사용하는 표준 통계패키지로서 고려할 필요가 있다 본 논문은 기초통계학 내용 중 추측통계 영역을 대상으로 R의 활용에 대하여 기술하고자 한다.