• Journal of Korea Technology Innovation Society
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• v.13 no.4
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• pp.617-637
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• 2010

As the impact of S&T on daily life increases, efforts to predict and anticipate the adverse effects of S&T development on human society and the natural environments are reinforced. In addition, public character of S&T demands wider participation of various stakeholders in R&D process. In response to these demands, Technology Assessment (TA) was introduced in the process of S&T policy formation. The Korean TA exercises were carried out 5 times since 2003 through 2008 by Korea Institute of S&T Evaluation and Planning (KISTEP), the necessity of which was incorporated in the S&T basic law. TA in Korea has been continuously upgraded in terms of organizational structure and procedure, but still in progress to take into account of problems exposed so far. In this paper, problems of TA in Korea are examined in terms of law, sponsor, management, and utilization. Suggestions for its improvement such as sophistication of methods and linking to national S&T planning are proposed.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.05a
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• pp.59-59
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• 1997

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.310-310
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• 2012

최근 전자산업의 발달에 따른 전자제품의 소형화 및 고기능화 요구에 대응하기 위하여 저항(resistor), 커패시터(capacitor), IC (integrated circuit) 등의 수동소자를 개별 칩(discrete chip) 형태로 형성하여 기판의 표면에 실장하는 기술이 일반화되고 있다. 그러나, 수동 소자의 내장 기술은 기판의 패턴 밀도의 급격한 향상과 더불어 수동소자의 내장 공간도 협소해지는 문제점이 있다. 상기의 문제점을 해결하기 위해 개별 칩 형태의 내장형 저항체를 박막 형태의 내장 저항체를 구현하는 기술의 개발이 최근 주목을 받고 있다. 박막 저항체는 기존의 권선저항 및 후막저항과 비교하여 정밀한 온도저항계수를 가지며 이동통신에 적용시 고주파 영역(GHz)에서의 안정성과 주파수 특성이 좋다는 장점들을 가지고 있다. 박막 저항 물질로는 높은 경도와 우수한 열적 안정성을 가지고 있는 TaN (tantalum nitride)이 주로 사용되고 있다. 일반적으로, TaN 박막은 스퍼터링을 사용하며 제조되며 TaN 박막의 성질은 탄탈륨과 질소의 화학정량비, 박막의 결함 정도, 또는 공정압력 및 증착 온도, 플라즈마 파워 등과 같은 공정조건 등의 변화에 민감하게 변화하므로, TaN 박막의 다양한 연구가 더 필요한 실정이다. 본 연구에서는 반응성 마크네트론 스퍼터링을 사용하여 TaN 박막을 Si 기판 위에 증착하였고 TaN 박막의 원하는 특성을 제어할 수 있도록 질소 분압과 total gas volume을 조절하여 공정을 최적화하는 연구를 진행하였다. 또한 tensile pull-off 방법을 이용하여 TaN 박막의 부착강도를 평가하였고, 온도 사이클 및 고온고습 환경에 노출된 TaN 박막들의 열화 특성들에 대하여 연구하였다.

• Korean Journal of Materials Research
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• v.7 no.10
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• pp.877-883
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• 1997

Ar 및 Ar과 $N_{2}$ 분위기하에서 rf 마그네트론 스퍼터링방법으로 Ta-AI과 Ta-AI-N합금막을 제조하였다. Ta-7.9at.% AI계열, Ta-26.7 at% AI게열과 Ta-45.4at.%AI계열에 Ar에 대한 질서유량비로 26%까지 질소를 첨가하여 Ta-AI-N박막을 증착한후, 300-$600^{\circ}C$온도 구산에서 열처리 전후의 구조 및 전기적 특성과 열적안정성을 통하여 레지스터의 적용가능성을 조사하였다. 구조 및 조성 분석은 X-선 회절과 Rutherford Backscattering Spectrometry(RBS)로 관찰하였고 열적안정성은 4단자법(four point probe method)을 이용한 저항변화를 통하여 측정하였다. 순수 Ta에 AI을 첨가하면 확장된 $\beta$($\beta$-Ta)N 합금박막에서 가장 열적안정성이 우수하게 나타났던 질소첨가 범위는 Ta $N_{hcp}$또는 TaN/ sub fcc/또는 Ta $N_{fcc}$와 비정질과의 혼합상순으로 상천이를 나타내었다. Ta-AI-N 합금박막에서 가장 열적안정성이 우수하게 나타났던 질서첨가 범위는 Ta-26.7at. % AI계열의 경우 19-36at.% $N_{2}$구간이었고, Ta-45.5at.% AI계열의 경우는 30-45at.%구간이었다. Ta-AI합금박막은 질소가 첨가되지 않아도 열처리 온도 및 시간에 따라 약 10% 이내의 비교적 작은 저항변화를 보여 열적안정성이 우수하지만 질소를 첨가하여 Ta-AI-N합금박막을 형성시킬경우, 증착된 상태에서 이미 큰 비저항을 나타내었고 열처리 동안 3%이내의 매우 작은 저항변화를 나타내었기 때문에 레지스터용 재료로써 열적안정성에 대한 잠재력이 크다.

• Journal of the Korean Magnetics Society
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• v.12 no.6
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• pp.212-217
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• 2002

The pseudo spin valve with a structure of Tl/CoFe(t $\AA$)/Cu(30 $\AA$)/NiFe(50 $\AA$)/Ta, showing giant magnetoresistance properties by utilizing coercivity difference between only two soft ferromagnetic layers were produced by d.c UHV magnetron sputtering system. In pseudo spin valve Ta/CoFe/Cu/NiFe/Ta, the magnetic and magnetoresistance properties with change of CoFe thickness were investigated. When the thickness of CoFe was 60 $\AA$, a typical MR curve of pseudo spin valve structure was obtained, showing MR ratio of 3.8 cio and the coercivity difference of 27.4 Oe with a sharp change of hard layer switching. When the CoFe thickness was varied from 20 to 100 $\AA$, coercivity difference between two layers was increased to 40 $\AA$. and decreased to 100 $\AA$ gradually. It is thought the change in coercivity of hard layer was due to the crystallinity and magnetostriction of thin CoFe layer. In order to improve the MR property in CoFe/Cu/NiFe trier layer structure, CoFe layer with change of 2-20 $\AA$ thick was inserted between Cu and NiFe. When the thickness of CoFe was 10 $\AA$, MR ratio was 6.7％, showing excellent MR property. This indicates 50 ％ higher than that of CoFe/Cu/NiFe pseudo spin valve.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.35-40
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• 2010

The variations of dielectric properties of $Ta_2O_5-SiO_2$ continuous composition spread thin films prepared by off-axis radio-frequency magnetron sputtering were investigated. The dielectric maps of dielectric constant and loss were plotted via 1500 micron-step measuring. The specific points showing superior dielectric properties of high dielectric constant (k~19.5) and loss (tan${\delta}$<0.05) at 1 MHz were found in area of the distance of 16 mm and 22 mm apart from $SiO_2$ side in $75{\times}25mm^2$ sized Pt/Ti/$SiO_2$/Si(100) substrates.

• Journal of the Korean Magnetics Society
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• v.12 no.2
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• pp.64-67
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• 2002

IrMn pinned spin valve (SV) films with stacks of Ta/NiFe/IrMn/CoFe/Cu/CoFe/NiFe/Ta were prepared by dc sputtering onto thermally oxidized Si (111) substrates at room temperature under a magnetic field of about 100 Oe. The annealing cycle number and temperature dependence of exchange coupling field (H$_{ex}$), magnetoresistance (MR) ratio, and coercivity (H$_{c}$) were investigated. By optimizing the process of deposition and post thermal annealing condition, we obtained the IrMn based SV films with MR ratio of 3.6%, H$_{ex}$ of 1180 Oe for the pinned layer. The H$_{ex}$ is stabilized after the second annealing cycle and it is thought that this SV reveals high thermal stability. The H$_{ex}$ maintained its strength of 600 Oe in operation up to 24$0^{\circ}C$ and decreased monotonically to zero at 27$0^{\circ}C$.

• Journal of the Korean Magnetics Society
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• v.9 no.6
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• pp.296-300
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• 1999

Cross-shape structures of spin tunneling junctions were fabricated using DC magnetron sputtering and metal masks. The film structures were $substrate/Ta/NiFe/FeMn/NiFe/CoFe/Al_2O_3/CoFe/NiFe$ and $substrate/Ta/NiFe/CoFe/ Al_2O_3/CoFe/NiFe/FeMn/NiFe$. Fabrication conditions of insulating layer ($Al_2O_3$) and thickness and sputtering power of each film layer were varied, and maximum magnetoresistance ratio of 24.3 % was obtained. Magnetic characteristic variations in the above mentioned two structures and two types of substrates (Corning glass 7059 and Si(111)) were compared. Annealing of the junctions was performed to find out magnetic characteristic variations expected from the device fabrication. Magneoresistance Ratio were observed to maintain as-deposited value up to 150 $^{\circ}C$ annealing and then to drop rapidly after 180 $^{\circ}C$ annealing.

• Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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• v.7 no.3
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• pp.65-75
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• 2017

This research studies the behavior patterns of a character in FIFA Online3, and the transaction patterns between the characters to present a character that acts like a real person and has social interaction with other characters. A character interacts with others mediated by balls in FIFA Online3, we analysis character's behavior and interactions more cleary. Providing the realistic behavior patterns of a character and the relation in the transaction patterns between the characters based on psychology theory, we can give a player the sense of reality. To define the behavior pattern of a character, this study applied the Ego-state as defined by Transactional Analysis(TA). Based on the Transactions in TA, this study then defined the transaction patterns between the characters, which are produced by the actions that a character in the game. This study also presented how to apply a character's transaction patterns with the examples. It showed that a character can act in the game like a real person by defining how a character acts and interacts in the game.

• Journal of the Society of Naval Architects of Korea
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• v.46 no.3
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• pp.362-371
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• 2009

Shipbuilding is a typical 'build to order' industry. It has a business model that generates revenues from building various ships and offshore products in accordance with owner's requirements at each production stage. Under uncertainty in shipping market, it is very essential for the shipbuilder to prepare the fast and competitive decision for product portfolio strategy in order to maximize contribution margin by exploiting production facilities and constraints. In this study, we introduce the unique decision supporting methodology for the optimal product portfolio sets based on Theory of Constraints(TOC). This methodology is established by adopting the concept of Drum Buffer Rope(DBR) in constraints planning and Throughput Accounting (TA) in management accounting of TOC. In addition, Decision Supporting System(DSS) is implemented. This DSS system provides a throughput estimator with reflecting the cost structure of shipbuilding industry and a resource simulator built on heuristic algorithms to operate major constraint-resources in shipyard such as dock, quay and pre-erection area etc. Several examples are presented to show that the proposed methodology and system can effectively support the strategic decision-making process of a global shipbuilding company.