• Journal of the Institute of Electronics Engineers of Korea TC
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• v.39 no.6
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• pp.259-267
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• 2002

In this paper, we focus on comparison and analysis of performance for existing Topology Aggregation algorithm. For these, we designed and implemented PNNI routing simulator which contain various TA schemes, and evaluate performance of TA schemes by this simulator. The PNNI 1.0 specification of the ATM Forum is recommended that hierarchical routing protocol and topology information is aggregated in the network constructed hierarchically Aggregating topology information is known as TA(Topology Aggregation) and TA is very important for scalability and security in network. Therefore, the performance of PNNI network would vary with TA schemes and routing algorithm. PNNI routing simulator can be applied to develope Routing algorithm and TA algorithm and can be develope these algorithms in short period.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.106-111
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• 2003

Tantalum nitride(TaN) films were deposited by atomic layer deposition(ALD) and plasma assisted atomic layer deposition(PAALD). The deposition of the TaN thin film has been performed using pentakis (ethylmethlyamino) tantalum (PEMAT) and ammonia($NH_3$) as precursors at temperature of $250^{\circ}C$, where the temperature was proven to be ALD window for TaN deposition from our previous experiments. The PAALD deposited TaN film shows better physical properties than thermal ALD deposited TaN film, due to its higher density$(~11.59 g/\textrm{cm}^3$) and lower carbon(~ 3 atomic %) and oxygen(~ 4 atomic %) concentration of impurities.

• Korean Journal of Materials Research
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• v.7 no.6
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• pp.498-504
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• 1997

Cu는 AI보다 비저항이 더 낮고, 일렉트로마이그레이션 내성이 더 강하기 때문에 AI을 대체하여 사용될 새로운 상부배선 재료로 널리 연구되고 있다. 그러나 Cu는 SiO$_{2}$층을 통해 Si기판 속으로 확산하는 것과 같은 열적불안정성을 갖고 있으므로 Cu 배선을 위해서는 barrier금속을 함께 사용해야 한다. 지금까지 알려진 가장 우수한 재료는 TaSi$_{x}$N$_{y}$이다. Tasi$_{x}$N$_{y}$는 90$0^{\circ}C$에서 불량이 발생하는 것으로 보고된 바 있으나, 그것의 barrier특성과 관련하여 확인하고 또 새로 조사되어야 할 내용들이 많이 있다. 본 연구에서는 반응성 스퍼터링 테크닉을 사용하여 (100)Si 웨이퍼상에 TaSi$_{x}$N$_{y}$막을 증착하고, Cu에 대한 barrier재료로서 반드시 갖추어야 할 열적 안정성을 면저항의측정, X선 회절 및 AES 깊이분석 등에 의하여 조사하였다. 스퍼터링 공정에서 N$_{2}$/Ar기체의 유량비가 15%일때 열적 안정성이 가장 우수한 TaSi$_{x}$N$_{y}$막이 얻어졌다. Ta와 TaN은 각각 $600^{\circ}C$와 $650^{\circ}C$에서 불량이 발생하는 반면, TaSi$_{x}$N$_{y}$는 90$0^{\circ}C$에서 불량이 발생하였다. TaSi$_{x}$N$_{y}$의 불량기구는 다음과 같다:Cu는 TaSi$_{x}$N$_{y}$막을 통과하여 TaSi$_{x}$N$_{y}$/Si계면으로 이동한 다음 Si기판내의 Si원자들과 반응한다. 그 결과 TaSi$_{x}$N$_{y}$Si가 생성된다.

• Korean Journal of Materials Research
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• v.4 no.8
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• pp.855-860
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• 1994

Ta-silicide films in polycide structure were prepared by rapid thermal annealing of sputtered Ta film on poly-Si and doped poly-Si. Effects of phosphorus on Ta-silicide formation were investigated. Independent of the ion dose($1 \times 10^{13}\to 5 \times 10^{15}$/ions/$\textrm{cm}^2$), Ta-silicide phases were formed at $800^{\circ}C$ and stabilized above $1000^{\circ}C$. From the result of XRD at $800^{\circ}C$ and $900^{\circ}C$, however, it was indicated that the more the doping concentration the weaker the intensity of Ta-silicide phases. Furthermore, the observation of SEM revealed that the increase of the doping concentration retarded silicidation. As the temperature increased, the dopant effect was weakened gradually and almost disappeared at $1000^{\circ}C$. Therefore the variation of the ion dose from ($1 \times 10^{13}\to 5 \times 10^{15}$/ions/$\textrm{cm}^2$) did not greatly affect the formation of Ta-silicide at high temperatures but retarded slightly the silicidation at low temperatures.

• Korean Journal of Materials Research
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• v.7 no.12
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• pp.1052-1057
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• 1997

현재 전기, 전자, 우주, 자동차, 무기 등의 여러 분야에서 응용되고 있는 TaNx 다층박막저항체의 특성을 개선하기 위하여 magnetron sputtering법으로 TaNx박막을 제조한 후, 온도와 질소분압에 따른 전기저항 및 TCR특성 변화를 조사하였고, 미세조직이 이들 전기적 성질에 미치는 영향을알아보기 위해 상분석과 morphology를 관찰하였다. 그 결과, TaNx을 코팅한 박막의 전기저항은 $N_{2}$Ar이 0.4 이상에서, 금속전도특성에서 이온전도특성으로 변화하였으며,Cr이 TCR효과를 안정시키는 역할은 하여 TaNx/A $I_{2}$ $O_{3}$보다 TaNx/Cr/A $i_{2}$ $O_{3}$박막의 TCR특성이 더 안정하게 나타났다. 또한 TaNx/A $I_{2}$ $O_{3}$박막과 TaNx/Cr/A $i_{2}$ $O_{3}$박막의 경우 모두 $N_{2}$/Ar이 0-0.4정도에서 TCR효과에 좋은 특성을 나타내었다. X-선회절 실험 결과 $N_{2}$/Ar비가 1일 경우에 T $a_{2}$ $N_{.8}$이 생성되었고, 분압이 증가함에 따라 비정질이 생성되었다. morphology가 $N_{2}$/Ar이 증가함에 따라 입자의 모양이 불연속아일랜드 형태로 변화하였으며, 이것은 질소분압에 따른 전기저항 변화와 일치하였다.다.

• Journal of the Mineralogical Society of Korea
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• v.25 no.4
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• pp.233-247
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• 2012

We have researched the distribution and characteristics of seafloor hydrothermal deposits for the development of economic mineral deposits in the Lau Basin, Tonga since 2009. In this study, we interpreted hydrothermal alteration around TA 26 seamounts of the Tofua volcanic arc using X-ray diffraction analysis for bulk sample and preferred-oriented specimen of clay fraction. We used 2 core samples and several surface samples. Plagioclase and quartz are dominant mineral in the basement rock, whereas kaolin mineral and smectite are superior in marine surface sediments. Especially sulfate and sulfide minerals such as gypsum, barite, sphalerite, and pyrite are predominant in the vent sediments. When we compare the mineral composition between basement rock and sea surface sediments, argillic alteration zone composed of kaolin mineral and smectite could be produced by hydrothermal fluids. Based on the downcore variation of mineral assemblages, most portion of MC08H-06 core could be interpreted as argillic alteration zone composed of kaolin mineral and smectite except top 2 cm area. Various sulfate or sulfide minerals and argillic alteration zone suggest a high probability of massive sulfide deposits in the seafloor of the TA 26 seamount.

• Korean Journal of Materials Research
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• v.8 no.10
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• pp.945-949
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• 1998

Ta(OC2H5)5와 NH3를 이용하여 Cycle-CVD법으로 산화탄탈륨 막을 증착하였다. Cycle-CVD법에서는 Ta(OC2H5)5와 NH3사이에 불활성 기체를 주입한다. 하나의 cycle은 Ta(OC2H5)5주입, Ar주입, NH3 주입, Ar 주입의 네 단계로 이루어진다. Cycle-CVD법으로 산화탄탈륨 막을 증착할 때, 온도 $250-280^{\circ}C$에서 박막의 증착 기구는 원자층 증착(Atomic Layer Deposition:ALD)이었다. $265^{\circ}C$에서 Ta(OC2H5)5:Ar:NH3:Ar:NH3:Ar의 한 cycle에서 각 단계의 주입 시간을 1-60초:5초:5초:5초로 Ta(OC2H5)5 주입 시간을 변화시키면서 산화탄탈륨 막을 Cycle-CVD법으로 증착하였다. Ta(OC2H5)5주입시간이 증가하여도 cycle 당 두께가 $1.5\AA$/cycle로 일정하였다. $265^{\circ}C$에서 증착된 박막의 누설 전류는 2MV/cm에서 2x10-2A/$\textrm{cm}^2$이었고 열처리후의 산화탄탈륨 막의 누설 전류값은 $10-4A\textrm{cm}^2$ 이하고 감소하였다. 증착한 산화탄탈륨 막의 성분을 Auger 전자 분광법으로 분석하였다. 2$65^{\circ}C$에서 증착한 막의 성분은 탄탈륨 33at%, 산소 50at%, 탄소 5at%, 질소 12at% 이었으며 90$0^{\circ}C$, O2300torr에서 10분 동안 열처리한 박막은 탄탈륨 33at%, 산소 60wt%, 탄소 4at%, 질소 3at%이었다. 박막의 열처리 온도가 높을수록 불순물인 탄소와 질소의 박막 내 잔류량이 감소하였다. 열처리 후의 박막은 O/Ta 화학정량비가 증가하였으며 Ta의 4f7/5와 4f 5/2의 결합 강도가 열처리 전 박막보다 증가하였다. 열처리 후 누설 전류가 감소하는 것은 불순물 감소와 화학정량비 개선 및 Ta-O 결합 강도의증가에 의한 것으로 생각된다.

• Proceedings of the Materials Research Society of Korea Conference
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• 1997.10a
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• pp.126-126
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• 1997

• KSCE Journal of Civil and Environmental Engineering Research
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• v.30 no.1D
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• pp.1-10
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• 2010

Safety improvement has been a continuous challenge, especially at toll gate of express highway where traffic conflict often occurs due to frequent lane change by drivers of "Hi-pass" lane and regular "TCS" lane. As a part of research on safety at toll gate, this study videotaped traffic conflict data between vehicles using centrally located "Hi-pass" lane and regular "TCS" lane and analyzed accident risk. According to the correlation analysis of vehicle speed, relative vehicle speed, and sudden vehicle deceleration rate due to traffic conflict, when the relative vehicle speed between centrally located "Hi-pass" lane and regular "TCS" lane increases, sudden vehicle deceleration rate also increases. One of the findings is that centrally located "Hi-pass" lane at toll gate shows different location for traffic conflict, and frequency of traffic conflict and the relative vehicle speed was also different based on vehicle lane use. TA (Time to Accident) analysis shows that accident rate is high at toll gate where Hipass lane is installed in center lane, when the occurrence of sudden vehicle deceleration and deceleration time of vehicles rise for vehicles on "Hi-pass" lane. Furthermore, if the expressway entrance/exit point is closely located to toll gate, TA showed a low value. Thus, it is necessary to reduce the relative vehicle speed in order to improve safety. The Study presents reduction of the relevant vehicular speed and prevention of accidents at the centrally installed "Hi-pass" lane as an important strategy for safety improvement at toll gate.

• Journal of the Korean Magnetics Society
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• v.9 no.4
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• pp.210-216
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• 1999

The objective of this paper is to investigate corrosion behaviors of CoCrTa/CrNi thin film and post heat-treatment effect. An electron beam evaporator was used for films deposition. After evaporation, post heat-treatment was carried out under $5.0{\times}10^3$ Torr vacuum condition. Annealing temperature and time were 400 $^{\circ}C$ and 30 min, respectively. To understand the effect of annealing on corrosion behavior of CoCrTa/CrNi, potentiodynamic polarization technique and accelerated corrosion chamber test were undertaken. Corrosion potential is higher for the annealed samples (CoCrTa 400$\AA$/CrNi 1000$\AA$) than for as-deposited one. This is attributed to an enrichment of Cr in the surface layer of the thinfilm resulting in a more corrosion resistant material.