• 제목/요약/키워드: System in Package

검색결과 1,435건 처리시간 0.028초

MIGSHIELD: A new model-based interactive point kernel gamma ray shielding package for virtual environment

  • Li, Mengkun;Xu, Zhihui;Li, Wei;Yang, Jun;Yang, Ming;Lu, Hongxin;Dai, Xinyu
    • Nuclear Engineering and Technology
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    • 제52권7호
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    • pp.1557-1564
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    • 2020
  • In this paper, 3D model-based interactive gamma ray shielding package (MIGSHIELD) is developed in virtual reality platform for windows operating system. In MIGSHIELD, the computational methodology is based on point kernel algorithm (PK), several key parameters of PK are obtained using new technique and new methods. MIGSHIELD has interactive capability with virtual world. The main features made in the MIGSHIELD are (i) handling of physical information from virtual world, (ii) handling of arbitrary shapes radioactive source, (iii) calculating the mean free path of gamma ray, (iv) providing interactive function between PK and virtual world, (v) making better use of PK for virtual simulation, (vi) plug and play. The developed package will be of immense use for calculations involving radiation dose assessment in nuclear safety and contributing to fast radiation simulation for virtual nuclear facilities.

발전연료 제약을 고려한 주간 발전계획 전산화 시스템 개발에 관한 연구 (A Study on the Fuel Constrained Optimal Weekly Power Generation Schedule Package)

  • 오태규;김성수;권영준;최봉수;유인우
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1990년도 추계학술대회 논문집 학회본부
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    • pp.220-223
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    • 1990
  • An overview of weekly power generation schedule package is presented. The overall unit commitment logic and the pumped storage operation scheme in the program is illustrated. The results of the application to a practical system is reported.

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농산물 유통과정에서 복숭아의 품질유지를 위한 마스터 포장 시스템 (A Master Packaging System for Preserving Qualities of Peaches in the Fresh Produce Supply Chain)

  • 정미진;안덕순;박우포;이동선
    • 한국포장학회지
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    • 제19권1호
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    • pp.7-10
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    • 2013
  • 신선 농산물 공급체인에서 최종적으로 소비자에게 신선한 복숭아를 공급할 수 있는 통합적 마스터 포장 시스템을 구성하고 그 효과를 실험적으로 검증하고자 하였다. 마스터 포장 시스템은 $35{\mu}m$ 두께의 LDPE 필름 bag에 6개의 300 g 낱개 복숭아의 $30{\mu}m$ OPP 개별포장을 포함하는 것으로 구성하였다. 개별포장에 직경 $59{\mu}m$의 미세공을 1, 3, 7개로 두는 변수조건을 두어서 $5^{\circ}C$의 저온단계 저장과 $20^{\circ}C$의 유통판매단계에서 포장기체조성과 품질변화를 측정하여 비교하였다. $5^{\circ}C$에서 일정기간 저장한 마스터 포장은 해체하여 $20^{\circ}C$ 조건으로 옮겨서 3일간 보관하는 조건으로 실험하였다. 대조구로서 필름에 싸지 않고 골판지 상자에 복숭아를 6개씩 담아서 같은 온도조건에서 보관하였다. 7개 미세공을 가진 포장이 $5^{\circ}C$의 저온단계 저장과 $20^{\circ}C$의 유통판매단계에서 6~10%의 $O_2$ 농도와 11~19% $CO_2$ 농도를 유지시켜 가장 적정 MA 조건에 가까운 기체조성을 유지할 수 있는 것으로 판단되었다. 이보다 작은 미세공을 가진 포장은 일련의 연속적인 저장에서 혐기적인 조건을 유발하였다. 대조구와 비교하여 마스터 포장의 모든 처리구는 낮은 중량손실과 양호한 경도 유지를 보여주었다.

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Structural stability analysis of waste packages containing low- and intermediate-level radioactive waste in a silo-type repository

  • Byeon, Hyeongjin;Jeong, Gwan Yoon;Park, Jaeyeong
    • Nuclear Engineering and Technology
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    • 제53권5호
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    • pp.1524-1533
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    • 2021
  • The structural stability of a waste package is essential for containing radioactive waste for the long term in a repository. A silo-type disposal facility would require more severe verification for the structural integrity, because of radioactive waste packages staked with several tens of meters and overburdens of crushed rocks and shotcretes. In this study, structural safety was analyzed for a silo-type repository, located approximately 100 m below sea level in Gyeongju, Korea. Finite element simulation was performed to investigate the influence of the loads from the backfilling materials and waste package stacks on the mechanical stress of the disposed of wastes and containers. It was identified that the current design of the waste package and the compressive strength criterion for the solidified waste would not be enough to maintain structural stability. Therefore, an enhanced criterion for the compressive strength of the solidified waste and several reinforced structural designs for the disposal concrete container were proposed to prevent failure of the waste package based on the results of parametric studies.

ERP 패키지의 성공적인 커스터마이징 전략 (A Strategy on the Successful Customization of ERP Packages)

  • 김병곤;오재인
    • Asia pacific journal of information systems
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    • 제10권3호
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    • pp.121-143
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    • 2000
  • The enterprise resource planning(ERP) system becomes more popular as a vehicle of realizing an integrated information system, because this system not only facilitates the reengineering of processes in a firm but also provides the function of generating consolidated financial statements. However, ERP vendors have unsuccessfully provided methodologies on the customization of ERP packages although one of the important issues during the implementation of an ERP package is how to customize it. The purpose of this paper is to build a strategy on the successful customization of ERP packages. The result from the analysis of interviews with 25 consultants and experts in the ERP field recommends 14 customization strategies of an ERP package in the four areas of a firm: management, technology, organization, and environment. The analysis of the feedback from the consultants and experts generates the ranking of the 14 customization strategies.

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Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry

  • Kim, Koung-Suk;Kang, Ki-Soo;Jung, Seung-Tack
    • Journal of Mechanical Science and Technology
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    • 제19권3호
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    • pp.820-825
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    • 2005
  • This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

SiC Based Single Chip Programmable AC to DC Power Converter

  • Pratap, Rajendra;Agarwal, Vineeta;Ravindra, Kumar Singh
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권6호
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    • pp.697-705
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    • 2014
  • A single chip Programmable AC to DC Power Converter, consisting of wide band gap SiC MOSFET and SiC diodes, has been proposed which converts high frequency ac voltage to a conditioned dc output voltage at user defined given power level. The converter has high conversion efficiency because of negligible reverse recovery current in SiC diode and SiC MOSFET. High frequency operation reduces the need of bigger size inductor. Lead inductors are enough to maintain current continuity. A complete electrical analysis, die area estimation and thermal analysis of the converter has been presented. It has been found that settling time and peak overshoot voltage across the device has reduced significantly when SiC devices are used with respect to Si devices. Reduction in peak overshoot also increases the converter efficiency. The total package substrate dimension of the converter circuit is only $5mm{\times}5mm$. Thermal analysis performed in the paper shows that these devices would be very useful for use as miniaturized power converters for load currents of up to 5-7 amp, keeping the package thermal conductivity limitation in mind. The converter is ideal for voltage requirements for sub-5 V level power supplies for high temperatures and space electronics systems.

의류 DIY 패키지의 소비자 현황조사 연구 (Research on Customer Survey for Clothing DIY Packages)

  • 이은혜
    • 패션비즈니스
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    • 제27권2호
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    • pp.108-123
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    • 2023
  • Recent increase of eco-conscious trends and pleasure from Do It Yourself (DIY) activities have led to a surge in sales of package products bundling together clothing patterns and raw materials. However, a well-structured market system is yet to be established. We surveyed 460 women with sewing as a hobby who had purchased these DIY clothing pattern packages. The survey revealed that majority of respondents had their hobby for over five years. Choosing the right fabric to match clothing patterns presented a common challenge. Most participants owned a sewing machine and an overlocker, with price being the primary concern when purchasing a package. For guidance during the sewing process, participants preferred print materials featuring real-life images. Those with less sewing experience leaned towards video tutorials. Items of interest or those commonly created included blouses, shirts, and dresses. Desire for further learning in sewing and pattern-making was prominent, with a clear preference for online classes. Several strategies are recommended to enhance the appeal of DIY clothing package products, including broadening range of packages that incorporate fabric, offering supplementary educational resources to improve users' skills, implementing affordable pricing structures, supplying comprehensive creation guidelines, and making available design modification guides. These considerations could significantly boost customer satisfaction. This research intends to lay groundwork for understanding DIY clothing creation market, ultimately fostering production of highly desirable products. Insights of this study will prove instrumental in refining product development and devising effective marketing tactics, leading to a more rewarding consumer experience.

Hy-CPC의 개발 및 성능평가 (Development and Evaluation of Hy-CPC)

  • 이홍규;황인규;안강호
    • 한국입자에어로졸학회지
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    • 제10권3호
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    • pp.93-97
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    • 2014
  • Condensation particle counter (CPC) has been one of the most important basic instrument for measuring number concentration of submicron aerosols. The principle of the CPC is to expose aerosols to a supersaturated vapor and cool down which causes adiabatic expansion. The particles grow by heterogenous nucleation to a sufficient size for easy detection by optical method. However, for growth by condensation, CPC essentially needs both saturater and condensor causing a heavy system. Therefore, it is hard to install commercial CPC to tethered balloon package system. In this study, we developed customized CPC for tethered balloon package system called Hy-CPC which is lighter and smaller in structure than commercial CPCs, and evaluated activation efficiency and detection efficiency by Hy-CPC using electrostatic method (electrometer and Faraday cup).

Fully Embedded 2.4GHz Compact Band Pass Filter into Multi-Layered Organic Packaging Substrate

  • Lee, Seung-J.;Lee, Duk-H.;Park, Jae-Y.
    • 마이크로전자및패키징학회지
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    • 제15권1호
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    • pp.39-44
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    • 2008
  • In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.

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