• Journal of the Korea Society of Computer and Information
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• v.22 no.6
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• pp.79-86
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• 2017

In this paper, we implement a common module that can integrate multiple biometric information for integrated patient monitoring system. Conventional biomedical instruments have many devices attached to each patient, making it difficult to monitor abnormality signs of many patients in real time. In this paper, we propose a module for an integrated monitoring system that can perform centralized monitoring using a common module that integrates multiple measurement devices. A protocol for sending and receiving packets between the measuring device and the common module is designed, and the packets transmitted through the network are stored and managed through the integrated monitoring system and provide information to various users such as medical staff. The results of this study are expected to contribute to the management of patients and efficient medical services in hospitals.

• Journal of Korean Association for Spatial Structures
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• v.1 no.2 s.2
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• pp.59-66
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• 2001

This paper describes three modules for development of the Space Frame Integrated Design System(SFIDS). The Control Module is implemented to control the developed system. The Model Generation Module based on PATRAN user interface enables users to generate a complicated finite element model for space frame structures. The Optimum Design Module base on a branch of combinatorial optimization techniques which can realize the optimization of a structure having a large number of members designs optimum members of a space frame after evaluating analysis results. The Control Module and the Model Generation Module Is implemented by PATRAN Command Language(PCL) while C++ language is used in the Optimum Design Module. The core of the system is PATRAN database, in which the Model Generation Module creates information of a finite element model. Then, PATRAN creates Input files needed for the analysis program from the information of the finite element model in the database, and in turn, imports output results of analysis program to the database. Finally, the Optimum Design Module processes member grouping of a space frame based on the output results, and performs optimal member selection of a space frame. This process is repeated until the desired optimum structural members are obtained.

• Journal of Navigation and Port Research
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• v.42 no.5
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• pp.323-330
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• 2018

The Korean e-Navigation system is a Korean approach to correspond with implementation of IMO e-Navigation. It provides five services, among them SV20 service, a ship remote monitoring system that collects and processes sensor information related to fire, navigation, and seakeeping performance safety. The system also detects abnormal conditions such as fires, capsizing, sinking, navigation equipment failure during navigation, and calculates the safety index and determines the emergency level. According to emergency level, it provides appropriate emergency response guidance for the onboard operator. The fire safety module is composed of three sub-modules; each module is the safety index sub-module, the emergency level determination sub-module and emergency response guidance sub-module. In this study, operational concept of the fire safety module in SV20 service is explained, and fire safety assessment factors are estimated, to calculate the fire safety index. Fire assessment factors included 'Fire detector position factor,' 'Smoke diffusion rate factor,' and 'Fire-fighting facilities factor.'

• Transactions of Materials Processing
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• v.13 no.3
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• pp.211-215
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• 2004

Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. The alignment system of micro optical module is a key apparatus for the miniaturization of optical module and the development of optical communication parts with high functionality. In this research, we have developed a system capable of automatic alignment of a $30\mu\textrm{m}$-thick film filter and a lensed fiber in order to improve the speed and losses in the optical fiber-to-filter alignment of optical modules. Using the developed automatic alignment system and silicon optical bench, we have measured optical loss and characteristics of the assembled optical add/drop module before packaging $1{\times}1$ OADM optical module. Whole size of add/drop module was less than $5mm{\times}5mm{\times}1mm$. The measured maximum insertion loss was 0.294㏈ that is below 0.3㏈ which is a standard loss of optical module.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.1-6
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• 2022

The mobile device industry demands much higher levels of integration and lower costs coupled with a growing awareness of the complete system's configuration. A subsystem module package is similar to a board-level circuit that integrates a system function in a package beyond a System-in-Package (SiP) design. It is an advanced IC packaging solution to enhance the PDN and achieve a smaller form factor. Unlike a system-level design with a decoupling capacitor, a subsystem module package system needs to redefine the role of the capacitor and its configuration for PDN performance. Specifically, the design of package's form factor should include careful consideration of optimal PDN performance and the number of components, which need to define the decoupling capacitor's value and the placement strategy for a low impedance profile with associated cost benefits. This paper will focus on both the static case that addresses the voltage (IR) drop and AC analysis in the frequency domain with three specific topics. First, it will highlight the role of simulation in the subsystem module design for the PDN. Second, it will compare the performance of double-sided component placement (DSCP) motherboards with the subsystem module package and then prove the advantage of the subsystem module package. Finally, it will introduce three-terminal decoupling capacitor (decap) configurations of capacitor size, count and value for the subsystem module package to determine the optimum performance and package density based on the cost-effective model.

• 제어로봇시스템학회:학술대회논문집
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• 1988.10a
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• pp.353-359
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• 1988

In this paper, the design and implementation of a multi-processor based die bonder machine for the semiconductor will be described. This is a final research results carried out for two years from June, 1986 to July, 1988. The mechanical system consists of three subsystems such as bonding head module, wafer feeding module, and lead frame feeding module. The overall control system consists of the following three subsystems each of which employs a 16 bit microprocessor MC 68000 : (i) supervisory control system, (ii) visual recognition / inspection system and (iii) the display system. Specifically, the supervisory control system supervises the whole sequence of die bonder machine, performs a self-diagnostics while it controls the bonding head module according to the prespecified bonding cycle. The vision system recognizes the die to inspect the die quality and deviation / orientation of a die with respect to a reference position, while it controls the wafer feeding module. Finally, the display system performs a character display, image display ans various error messages to communicate with operator. Lead frame feeding module is controlled by this subsystem. It is reported that the proposed control system were applied to an engineering sample and tested in real-time, and the results are sucessful as an engineering sample phase.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.2
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• pp.131-137
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• 2009

This presents the equivalent circuit model of solar cell with irradiation and temperature condition. Based on solar cell model, the photovoltaic module specification of manufacturer compare with photovoltaic module simulation and is investigated by simulation results. The obtained results indicate that residual of simulation value and specification value about photovoltaic module is lower. There is considerable validity in simulation of photovoltaic module. Thus, the optimum simulation of photovoltaic module array are studied in this paper. This paper propose the sizing optimization of photovoltaic module array for stand-alone photovoltaic system. Also, the proposed stand-alone photovoltaic system is setting in special region(in seoul). This paper presents simulation characteristic of optimization output power in seoul.

• IE interfaces
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• v.19 no.3
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• pp.245-254
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• 2006

Equipments in container terminal have a lot of parts, and an equipment breakdown affects the productivity of terminal. In this paper, we develop a maintenance management system for improving reliability, availability and maintainability of equipments in container terminals. The developed system consists of five modules : equipment structure module, equipment operation management module, maintenance control module, spare part control module and data analysis module. The system supports reliability engineers to manage and improve RAM of equipments in container terminals. For example, FMEA, failure state analysis and life distribution parameters estimation are easily or automatically done by the system. This system also provides optimal preventive maintenance intervals by simulation and optimal yearly PM schedules for equipments in container terminal are recommended.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.79-84
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• 2010

The supply system module of the liquid rocket engine has been developed, which consists of the various supply system components such as pipes, orifices, elbows, bellows, valves and flanges. This module can size the components and calculate pressure drops between them. For the assembly of the supply system components, the supply system module can evaluate the number of the components, total pressure drop, outlet pressure and total system weight.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.531-534
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• 1997

A design system of dies for hot extrusion of structural shapes such as Z' s, L' s, T' s, U' s and H' s from aluminum alloys was developed in this study. The developed design system of dies is based of established die design rule system. The design rules for die design are obtained from the handbooks, plasticity theories and relevant references. The environment of the system is AutoCAD and AutoLISP, the graphic programming language was used for the configuration of the system. This system includes five major modules such as section shape design module, die opening number module. die opening layout module, die correction module and die bearing design module that are used to determine design variables. This system would be used to design of dies for hot extrusion from aluminum alloys and widely used in manufacturing course..