• Title/Summary/Keyword: System Level Design

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A Study of Flexible Identity Design System (가변적 아이덴티티 시스템에 관한 고찰)

  • Kim, Min
    • Archives of design research
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    • v.13 no.3
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    • pp.303-312
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    • 2000
  • Identity Design System, based on the principle of market economy, has developed over last half a century. The essence of identity program is to establish the corporate Image from dispersion to integral ion through design. There is no doubt that identity design became an inevitable necessity as a market In tool . The circumstance of corporate identity, however , has been changed since the revolution of telecommunication by computer which had an important effect upon today's market The development of computer communication allows people with different taste to achieve their needs from var ious kinds of information. Today's market is shitting from uniformity to diversity It is more difficult to create a corporate Image through conventional method. To meet the challenges of today's market, the communication of corporate identity will ultimately reflect the complexity of the market by adapting the flexible conoept of identity design. The level of flexibility in identity system should be determined depending on the management and market Eng strategy. Flexible Identity System (FIS) would be the best solution for some cases such as; a company with various fields, a company with sensitivity to the contemporary trend, and a company with an emotional appeal to consumers. FIS, with the capacity of a chameleon, can not only adopt the various circumstantial flanges, but also maintain the up-to-date corporate image .

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An Improved Multi-level Optimization Algorithm for Orthotropic Steel Deck Bridges (강바닥판교의 개선된 다단계 최적설계 알고리즘)

  • 조효남;이광민;최영민;김정호
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.16 no.3
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    • pp.237-250
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    • 2003
  • Since an orthotropic steel deck bridge has large number of design variables and shows complex structural behavior, it would be very difficult and impractical to directly use a Conventional Single Level (CSL) optimization algorithm for its optimum design. Thus, in this paper, an Improved Multi Level Design Synthesis (IMLDS) optimization algorithm is proposed to improve the computational efficiency. In the proposed IMLDS algorithm, a coordination method is introduced to divide the bridge into main girders and orthotropic steel deck with preserving the characteristics of the structural behavior. For an efficient optimization of the bridge, the IMLDS algorithm incorporates the various crucial approximation techniques such as constraints deletion, Automatic Differentiation (AD), stress reanalysis, and etc. In the case of orthotropic steel deck system, optimum design problems are characterized by mixed continuous discrete variables and discontinuous design space. Thus, a modified Genetic Algorithm (GA) is also applied to optimize discrete member design for orthotropic steel deck. From the numerical example, the efficiency and convergency of the IMLDS algorithm proposed in this paper is investigated. It may be positively stated that the IMLDS algorithm will lead to more effective and practical design compared with previous algorithms.

Design of DC Level Shifter for Daisy Chain Interface (Daisy Chain Interface를 위한 DC Level Shifter 설계)

  • Yeo, Sung-Dae;Cho, Tae-Il;Cho, Seung-Il;Kim, Seong-Kweon
    • The Journal of the Korea institute of electronic communication sciences
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    • v.11 no.5
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    • pp.479-484
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    • 2016
  • In this paper, a design of DC level shifter transmitting and receiving control and data signal which have various DC level through daisy chain interface between master IC and slave is introduced in the cell voltage monitoring (CVM). Circuit designed with a latch structure have a function to operate in high speed and for output of variable DC level through transmission gate. As a result of the simulation and the measurement, it was confirmed that control and data signal could be transferred according to the change of DC level from 0V to 30V. Delay time was measured about 170ns. but, it was considered as a negligible tolerance due to a parasitic capacitance of measuring probe and test board.

Multi-Level and Multi-Objective Optimization of Framed Structures Using Automatic Differentiation (자동미분을 이용한 뼈대구조의 다단계 다목적 최적설계)

  • Cho, Hyo-Nam;Min, Dae-Hong;Lee, Kwang-Min;Kim, Hoan-Kee
    • Proceedings of the Computational Structural Engineering Institute Conference
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    • 2000.04b
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    • pp.177-186
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    • 2000
  • An improved multi-level(IML) optimization algorithm using automatic differentiation (AD) for multi-objective optimum design of framed structures is proposed in this paper. In order to optimize the steel frames under seismic load, two main objective functions need to be considered for minimizing the structural weight and maximizing the strain energy. For the efficiency of the proposed algorithm, multi-level optimization techniques using decomposition method that separately utilizes both system-level and element-level optimizations and an artificial constraint deletion technique are incorporated in the algorithm. And also to save the numerical efforts, an efficient reanalysis technique through approximated structural responses such as moments, frequencies, and strain energy with respect to intermediate variables is proposed in the paper. Sensitivity analysis of dynamic structural response is executed by AD that is a powerful technique for computing complex or implicit derivatives accurately and efficiently with minimal human effort. The efficiency and robustness of the IML algorithm, compared with a plain multi-level (PML) algorithm, is successfully demonstrated in the numerical examples.

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Synchronous Visible Light Communication Systems Using 3-Level LED Modulation (3-Level LED 변조를 이용한 동기식 가시광통신 시스템)

  • Lee, Seong-Ho
    • Journal of Sensor Science and Technology
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    • v.22 no.6
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    • pp.421-427
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    • 2013
  • In this paper, we introduce a new synchronous visible light communication system in which the synchronizing pulse and the data bits are simultaneously transmitted using a 3-level light signal. In the transmitter, the synchronizing pulse and the data bits modulate independently two identical visible LEDs, whose output lights add in free space, make 3-level optical signal. In the receiver, a photodiode detects the light and generates a 3-level output voltage, whose positive and negative part correspond to the synchronizing pulse and the data bits, respectively. The two signals are easily separated and recovered by a simple diode circuit. This configuration provides two independent VLC channels without any multiplexing technique, simplifies the circuit design and construction of synchronous VLC systems.

Study on Classification of Protective Coating Service Level in Nuclear Power Plant (원자력발전소 방호도장 Service Level 분류에 대한 고찰)

  • Lim, Sang-Jun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.11a
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    • pp.140-141
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    • 2018
  • Protective coatings at nuclear power plants should be designed to withstand exposure to ambient conditions during normal operation or design-basis accidents. However, there was a change in the perception of the protective coating to the revision of the Regulatory Guidelines by the NRC in July 2000. In other words, maintenance guidelines have been strengthened in order to minimize the clogging of the cooling water system due to the substances in the containment building. Therefore, KHNP, the contractor and operator of the nuclear power plant, plans to develop the coating system for nuclear power plants in accordance with the regulation, and plans to develop its own coating expert.

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A study on the correlation between the objectives of being members and their request to activate the operation of Business Incubation Systems (창업보육센터 활성화를 위한 입주목적과 지원요구사항간의 상관관계에 관한 연구)

  • Park, Roh-Gook
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.28 no.3
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    • pp.109-114
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    • 2005
  • The founding purpose of Business Incubation System is to induce those businessmen who have technology and promising business ideas but are lacking fund, information, and management skill, and to speed up their business establishment and enhance the level of success by providing them with managerial knowledge, production technology, design, and equipment. While some universities made Business Incubation Center to achieve the above purpose, some other universities, especially the local ones, believed that Business Incubation Center, if managed successfully, could be an accelerator picking up the sluggish local economies. This study studied the motivators that let them move in an Incubating Center, their request for support, their level of expert utilization, and the role of head of a Center. This study found a significant level of correlation among the variables such as industrial-educational cooperation, the development of common items, utilization of professors with matching majors, utilization of research professors, and transfer of technology.

Microcontroller-Based Liquid Level Control Modeling

  • Dumawipata, Teerasilapa;Unhavanich, Sumalee;Tangsrirat, Worapong
    • 제어로봇시스템학회:학술대회논문집
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    • 2001.10a
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    • pp.82.3-82
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    • 2001
  • This work presents a design technique for the implementation of the liquid level control system by based on the use of a single-chip microcontroller. The proposed model system offers the following attractive features : (1) application of the pressure transducer for sensing the height of liquid in tank (2) using the obtained liquid level for defining on-off condition of the water pump (3) the liquid values were controlled by using stepping motors for controlling of 57 points (4) can set up by using manual control or automatic control (5) can monitor and display the process status either on microcontroller-based control board or on the computer via RS232 serial-port. Experimental results have been employed to show the effectiveness ...

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On the Design of a WiFi Direct 802.11ac WLAN under a TGn MIMO Multipath Fading Channel

  • Khan, Gul Zameen;Gonzalez, Ruben;Park, Eun-Chan
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.11 no.3
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    • pp.1373-1392
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    • 2017
  • WiFi Direct (WD) is a state of the art technology for a Device-to-Device (D2D) communication in 802.11 networks. The performance of the WD system can be significantly affected by some key factors such as the type of application, specifications of MAC and PHY layer parameters, and surrounding environment etc. It is, therefore, important to develop a system model that takes these factors into account. In this paper, we focus on investigating the design parameters of the PHY layer that could maximize the efficiency of the WD 802.11 system. For this purpose, a basic theoretical model is formulated for a WD network under a 2x2 Multiple In Multiple Out (MIMO) TGn channel B model. The design level parameters such as input symbol rate and antenna spacing, as well as the effects of the environment, are thoroughly examined in terms of path gain, spectral density, outage probability and Packet Error Rate (PER). Thereafter, a novel adaptive algorithm is proposed to choose optimal parameters in accordance with the Quality of Experience (QoE) for a targeted application. The simulation results show that the proposed method outperforms the standard method thereby achieving an optimal performance in an adaptive manner.

Fabrication and Challenges of Cu-to-Cu Wafer Bonding

  • Kang, Sung-Geun;Lee, Ji-Eun;Kim, Eun-Sol;Lim, Na-Eun;Kim, Soo-Hyung;Kim, Sung-Dong;Kim, Sarah Eun-Kyung
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.2
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    • pp.29-33
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    • 2012
  • The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.