• 한국산학기술학회논문지
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• 제12권9호
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• pp.4138-4146
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• 2011

표면실장기술(SMT: Surface Mount Technology)에 있어서 휴대폰 및 평판 디스플레이가 점점 가볍고 얇아지면서 이 제품에 사용되는 전자부품이 작아지고 있어, 0402, 0603 Chip등과 같은 SMD(Surface Mount Device) 부품을 실장하는 기술이 대두되고 있다. 따라서 Chip Mounter 제조회사들은 미삽이나 오삽을 방지하기 위한 실장기술에 대해 지속적인 연구를 해오고 있다. 본 연구는 이러한 미삽 오삽 방지를 실현하기 위하여 Fiber sensor를 이용하여 기계적 구조를 마련하고, 이를 활용한 시스템 알고리즘을 개선하는 기술을 제시한다.

• 한국군사과학기술학회지
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• 제26권3호
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• pp.205-213
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• 2023

An optimal design of a simple beam-shaped flexure hinge mount supporting an optical mirror is presented. An optical mirror assembly is an opto-mechanically coupled system as the optical and mechanical behaviors interact. This side-supporting mount is flexible in the radial direction and rigid for the remaining degrees of freedom to support the mirror without transferring thermal load. Through thermo-elastic, optical and eigenvalue analysis, opto-mechanical performance was predicted to establish the objective functions for optimization. The key design parameters for this flexure are the thickness and length. To find the optimal values of design parameters, response surface analysis was performed using the design of experiment based on nested FCD. Optimal design candidates were derived from the response surface analysis, and the optimal design shape was confirmed through Opto-mechanical performance validation analysis.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2016년도 춘계학술대회
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• pp.674-675
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• 2016

본 논문에서는 전기 및 전자 쓰레기의 대책으로 Printed Circuit Board (PCB) 부착형 Radio-Frequency Identification (RFID) 태그 칩을 이용한 사물인터넷 디바이스 생산 공정에 대한 모델을 제안한다. 전기 및 전자제품은 PCB 부품실장 공정과 검사가 필요하다. 또한 현재 제조사들이 사용하는 바코드 시스템은 Surface Mount Technology (SMT)공정이 완료되기 전까지 PCB 이력 관리가 불가능하다. 논문에서 제안한 PCB 부착형 RFID 태그 칩을 이용한 사물인터넷 디바이스 생산 공정 모델은 바코드 방식과 같은 출력-부착 단계가 필요하지 않다. 태그 칩은 각 단계의 공정 데이터가 기록될 수 있고, 데이터베이스 시스템 (DBMS) 접속 횟수를 현격히 줄일 수 있다.

• Industrial Engineering and Management Systems
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• 제12권4호
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• pp.330-335
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• 2013

A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1995년도 Proceedings of the Korea Automation Control Conference, 10th (KACC); Seoul, Korea; 23-25 Oct. 1995
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• pp.259-262
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• 1995

In this paper, a model of an asymptotically reliable serial production line with quailty control devices is introduced and analyzed. By an asymptotic technique and Taylor series expansion, its average production rate is approximated in a closed form. The results are applied to a case study of a surface mount system.

• 한국산학기술학회논문지
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• 제16권3호
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• pp.2146-2150
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• 2015

표면 실장 기술은 자동차 정션박스 등에 삽입되는 릴레이를 칩 마운터를 이용하여 실장 하는 경우와 0402, 0603과 같은 소형의 부품을 실장 하는 경우가 있다. 본 논문에서는 무거운 무게로 인해 문제가 발생하는 릴레이를 공급하기 위한 스틱 튜브의 개발과 반대로 너무 크기가 작아 발생하는 미 오삽 방지를 위한 파이버 센서를 이용한 기술을 제시하여 얼마나 생산성이 향상되었는지 실험을 통해 보여준다.

• Current Optics and Photonics
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• 제7권4호
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• pp.435-442
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• 2023

These days, the size of a reflective telescope has been increasing for astronomical observation. An additional optical system usually assists a large ground telescope for image analysis or the compensation of air turbulence. To guide collimated light to the external optical system through a designated path, a coudé mirror is usually adopted. Including a collimator, a coudé mirror of a ground telescope is affected by gravity, depending on the telescope's pointing direction. The mirror surface is deformed by the weight of the mirror itself and its mount, which deteriorates the optical performance. In this research, we propose an optimization method for the coudé mirror assembly for a 1-m class ground telescope that minimizes the gravitational surface error (SFE). Here the mirror support positions and the sizes of the mount structure are optimized using finite element analysis and the response surface optimization method in both the horizontal and vertical directions, considering the telescope's altitude angle. Throughout the whole design process, the coefficients of the Zernike polynomials are calculated and their amplitude changes are monitored to determine the optimal design parameters. At the same time, the design budgets for the thermal SFE and the mass and size of the mount are reflected in the study.

• 반도체디스플레이기술학회지
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• 제14권3호
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• pp.57-60
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• 2015

Electric power in large devices is controlled by digital circuits, such as switching mode power supply. This kind of power circuits require accurate current sensor for power distribution. We studied characteristics of shunt resistor, which has many advantages for commercial application compared to Hall-effect current sensor. We applied ceramic package to the shunt resistor. Ceramic package has good thermal conductivity compared to plastic package, and this point is important for space requirement in Printed Circuit Board (PCB). Another advantage of the ceramic package is that surface mount technology (SMT) can be used for production. Our experimental results showed that the ceramic packaged resistor showed about 50% lower temperature than the plastic packaged one. Burning point and frequency characteristics are also discussed.

• 한국지능시스템학회논문지
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• 제13권4호
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• pp.480-485
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• 2003

인쇄회로기판을 조립하는 SMT (surface mount technology) 라인의 AOI (automatic optical inspection) 형 검사기를 대상으로, 검사시간 단축을 위한 경로계획 방법을 제안한다. 기판에 존재하는 검사 윈도우들은 카메라의 FOV (field-of-view) 크기를 고려하여 클러스터링 되어야 하며, 전체 검사시간의 단축을 위하여 클러스터의 수를 최소화하는 것이 바람직하다. 주어진 기판에 대한 클러스터의 수를 최소화하기 위한 유전자 알고리즘을 새로이 제안하며, 이를 사용한 효과적 경로계획 방법을 제시한다. 상용 검사기를 대강으로 시뮬레이션을 수행하며, 비교 평가를 통하여 제안된 방법의 유용성을 검증한다.

• International Journal of Fuzzy Logic and Intelligent Systems
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• 제6권2호
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• pp.95-99
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• 2006

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.