• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.331-332
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• 2007

Surface micromachined SiC devices have readily been fabricated from the polycrystalline (poly) 3C-SiC thin film which has an advantage of being deposited onto $SiO_2$ or $Si_3N_4$ as a sacrificial layer. Therefore, in this work, magnetron reactive ion etching process which can stably etch poly 3C-SiC thin films grown on $SiO_2$/Si substrate at a lower energy (70 W) with $CHF_3$ based gas mixtures has been studied. We have investigated the etching properties of the poly 3C-SiC thin film using PR/Al mask, according to $O_2$ flow rate, pressure, RF power, and electrode gap. The etched RMS (root mean square), etch rate, and etch profile of the poly 3C-SiC thin films were analyzed by SEM, AFM, and $\alpha$-step.

• Laser Solutions
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• v.11 no.2
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• pp.26-32
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• 2008

Micro lens array (MLA) is widely used in information technology (IT) industry fields, for examples such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method, micro etching, electroplating, micromachining and laser local heating. Laser local thermal-expansion (LLTE) technology demonstrates the formation of microdots on the surface of polymer substrate, in this paper. We have also investigated the new direct fabrication method of placing the MLA on the surface of a SU-8 photoresist layer. We have obtained the 3D shape of the micro lens processed by UV laser irradiation and have experimentally verified the optimal process conditions.

• Journal of Sensor Science and Technology
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• v.28 no.2
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• pp.127-132
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• 2019

In this study, the fabrication of through-silicon vias (TSVs) filled with SWNTs/Sn by utilizing surface/bulk micromachining and MEMS technologies is proposed. Tin (Sn) and single-walled nanotube (SWNT) powders are used as TSV interconnector materials in the development of a novel TSV at low temperature. The measured resistance of a TSV filled with SWNT/Sn powder is considerably reduced by increasing the fraction of Sn and is lower than that of a TSV filled with only Sn. This is because of a decrease in the surface scattering of electrons along with an increase in the grain size of sintered SWNTs/Sn. The proposed method is conducted at low temperatures (< $400^{\circ}C$) due to the low melting temperature of Sn; hence, the proposed TSVs filled with SWNTs/Sn can be utilized in CMOS based applications.

• Journal of Sensor Science and Technology
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• v.32 no.5
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• pp.295-299
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• 2023

Herein, we propose a simple fabrication method for MXene-coated V-groove sensors for applications. To enhance the sensitivity of this sensor, we applied MXene particles, instead of conventional metal layers, as a sensing material on the sensor's surface. This allows for an easier fabrication, as well as higher sensitivity of the sensor compared to those of our previously demonstrated metal-based V-groove sensor. Additionally, polyurethane-acrylate, a UV-curable liquid polymer, can be easily applied using micro-electromechanical systems-based surface-texture micromachining. The sensor sensitivity is approximately 0.08 /mm, and it can be improved by increasing the number of V-grooves. We believe that the proposed MXene-based wearable sensor offers a great potential in detecting various types of motions characteristic of human activities.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.7 s.98
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• pp.753-759
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• 2005

In this paper, we have developed a new type of single balanced mixer with the RF MEMS $180^{\circ}$ hybrid coupler using surface micromachining technology. The $180^{\circ}$ hybrid coupler in this mixer is composed of the dielectric-supported air gapped microstriplines(DAMLs) which have signal line with $10{\mu}m$ height to reduce substrate dielectric loss and dielectric posts with size of $20{\mu}m{\times}20{\mu}m$ to elevate the signal line on air with stability At LO power of 7.2 dBm, the conversion loss was 15.5 dB f3r RF frequency or 57 GHz and RF power of -15 dBm. Also, we obtained the good RF to LO isolation of -40 dB at LO frequency of 58 GHz and LO power of 7.2 dBm. The main advantage of this type of mixer is that we are able to reduce the size of the chips due to integrating the MEMS passive components.

• Journal of Sensor Science and Technology
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• v.8 no.5
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• pp.414-420
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• 1999

The oxide sacrificial layer technology is one of the key technologies in surface micromachining. However, the commonly used aqueous HF solutions, including the $NH_4F$ buffered HF solutions (BHF), are known to attack the Al metal layers during the oxide sacrificial etch. A mixed $NH_4F$/HF/glycerine aqueous solution of 4:1:2 ratio is known to have the best etch selectivity between oxide and AI, but even this sacrificial etchant has a significant etch rate for AI. This paper reports an extensive experimental study on various concentration ratios for HF, $NH_4F$ and glycerine, and develops the optimal mixture ratio for sacrificial etching. At the $NH_4F$/HF/glycerine ratio of 2:1:4, the etch selectivity between PSG and Al improves by approximately 6 times over the previously known best selectivity, to a value of 7,700. At this condition, the measured etch rate of PSG film is approximately $2.1\;{\mu}m/min$, which is sufficiently fast. The developed sacrificial etchant allows the addition of a Al metal layer in surface micromachining, without the worry of Al layer erosion during sacrificial etch.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1968-1970
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• 1996

We investigate a surface-micromachined polysilicon microgyroscope, whose resonant frequencies are electrostatically-tunable after fabrication. The microgyroscope with two oscillation nudes has been designed so that the resonant frequency in the sensing mode is higher than that in the actuating mode. The microgyroscope has been fabricated by a 4-mask surface-micrormachining process, including the deep RIE of a $6{\mu}m$-thick LPCVD polycrystalline silicon layer. The resonant frequency in the sensing mode has been lowered to that in actuating mode through the adjustment of an inter-plate bias voltage; thereby achieving a frequency matching at 5.8kHz under the bias voltage of 2V in a reduced pressure of 0.1torr. For an input angular rate of $50^{\circ}/sec$, an output signal of 20mV has been measured from the tuned microgyroscope under an AC drive voltage of 2V with a DC bias voltage of 3V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.130-130
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• 2009

This paper describes the temperature characteristics of polycrystalline 3C-SiC micro resonators. The 1.2 ${\mu}m$ and 0.4 ${\mu}m$ thick polycrystalline 3C-SiC cantilever and doubly clamped beam resonators with 60 ~ 100 ${\mu}m$ lengths were fabricated using a surface micromachining technique. Polycrystalline 3C-SiC micro resonators were actuated by piezoelectric element and their fundamental resonance was measured by a laser vibrometer in vacuum at temperature range of $25{\sim}200^{\circ}C$. The TCF(Temperature Coefficient of Frequency) of 60, 80 and 100 ${\mu}m$ long cantilever resonators were -9.79, -7.72 and -8.0 $ppm/^{\circ}C$. On the other hand, TCF of 60, 80 and 100 ${\mu}m$ long doubly clamped beam resonators were -15.74, -12.55 and -8.35 $ppm/^{\circ}C$. Therefore, polycrystalline 3C-SiC resonators are suitable with RF MEMS devices and bio/chemical sensor applications in harsh environments.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.2182-2186
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• 2003

This paper presents the differential type resonant accelerometer (DRXL) and its performance test results. The DRXL is the INS grade, surface micro-machined sensor. The proposed DRXL device produces a differential digital output upon an applied acceleration, and the principle is a gap-dependent electrical stiffness variation of the electrostatic resonator with torsion beam structures. Using this new operating concept, we designed, fabricated and tested the proposed device. The final device was fabricated by using the wafer level vacuum packaging process. To test the performance of the DRXL, a nonlinear self-oscillation loop is designed using describing function technique. The oscillation loop is implemented using discrete electronic elements. The performance test of the DRXL shows that the sensitivity of the accelerometer is 12 Hz/g and its long term bias stability is about $2mg(1{\sigma})$. The turn on repeatability, bandwidth, and dynamic range are 4.38 mg, 100 Hz, and ${\pm}\;70g$, respectively.

• Journal of Sensor Science and Technology
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• v.12 no.1
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• pp.24-33
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• 2003

This research is about a comfort sensing system for human environmental monitoring using a one-bodied humidity and temperature sensor and an air flow sensor. The thermal comfort that a human being feels in indoor environment has been known to be influenced mostly by six parameters, i.e. air temperature, radiation, air flow, humidity, activity level and clothing thermal resistance. Considering an environmental monitoring, we have designed and fabricated a one-bodied humidity and temperature sensor and an air flow sensor that detect air relative humidity, temperature and air flow in human environment using surface micromachining technologies. Micro-controller calculates a PMV (predicted mean vote) and CSV (comfort sensing vote) with sensing signals and display a PMV on LCD (liquid crystal display) for human comfort on indoor climate. Our work has demonstrated that a comfort sensing system can provide an effective means of measuring and monitoring the indoor comfort sensing index of a human being. Experimental results with simulated environment clearly suggest that our comfort sensing system can be used in many applications such as air conditioning system, feedback controlling in automobile, home and hospital etc..